• 제목/요약/키워드: Sn-Cu-Ni alloy

검색결과 51건 처리시간 0.027초

가스분무성형 Cu-5Ni-10Sn 합금의 미세조직 및 시효강화 (Microstructural Feature and Aging Characteristics of Spray-Formed Cu-5Ni-10Sn Alloy)

  • 노대균;강희수;백경호
    • 한국분말재료학회지
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    • 제19권4호
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    • pp.317-321
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    • 2012
  • In this study, Cu-5Ni-10Sn(wt%) spinodal alloy was manufactured by gas atomization spray forming, and the microstructural features and mechanical properties of Cu-5Ni-10Sn alloy have been investigated during homogenization, cold working and age-hardening. The spray formed Cu-5Ni-10Sn alloy consisted of an equiaxed microstructure with a mixture of solid solution ${\alpha}$-(CuNiSn) grains and lamellar-structure grains. Homogenization at $800^{\circ}C$ and subsequent rapid quenching formed a uniform solid solution ${\alpha}$-(CuNiSn) phase. Direct aging at $350^{\circ}C$ from the homogenized Cu-5Ni-10Sn alloy promoted the precipitation of finely distributed ${\gamma}$' or ${\gamma}-(Cu,Ni)_3Sn$ phase throughout the matrix, resulting in a significant increase in microhardness and tensile strength. Cold working prior to aging was effective in strengthening Cu-5Ni-10Sn alloy, which gave rise to a maximum tensile strength of 1165 MPa. Subsequent aging treatment slightly reduced the tensile strength to 1000-1100 MPa due to annealing effects.

Bi, In을 함유한 Sn-Cu-Ni계 솔더 합금 제조와 물성 (The Properties and Processing of Bismuth and Indium Added Sn-Cu-Ni Solder Alloy System)

  • 박종원;최정철;최승철
    • 마이크로전자및패키징학회지
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    • 제9권1호
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    • pp.21-28
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    • 2002
  • Sn-Cu-Ni계 솔더 합금에 소량의 Bi와 In을 첨가하여 새로운 무연솔더 합금 개발을 진행하였다. Sn-0.7%(Cu+Ni)에 2~5% Bi. 2~10% In을 첨가하여 각각의 열적, 전기적, 기계적 특성을 평가하였다. 솔더합금의 융점은 200~$222^{\circ}C$, 응고온도범위는 20~$37^{\circ}C$로 중.고온계 솔더로서 적용이 가능하다. 실험 조성별 솔더 합금중 실용적, 경제적인 면을 고려하여 Sn-0.7%(Cu+Ni)-3.5%Bi-2%In이 최적의 합금 조성으로 판단된다. 이 합금은 융점이 $220^{\circ}C$정도이며 응고범위는 $25^{\circ}C$, 강도 면에서는 타 합금에 비해 상당히 우수한 값을 나타내었으며 연신율은 비교적 낮은 값을 나타내었다. 다른 기계적, 전기적 특성은 타 솔더 합금과 유사하거나 우수한 편이었으며 젖음특성도 양호하였다.

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열처리 온도에 따른 SnO2/Cu(Ni)/SnO2 다층구조 투명전극의 전기·광학적 특성 (A Study on the Electrical and Optical Properties of SnO2/Cu(Ni)/SnO2 Multi-Layer Structures Transparent Electrode According to Annealing Temperature)

  • 정지원;공헌;이현용
    • 한국전기전자재료학회논문지
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    • 제32권2호
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    • pp.134-140
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    • 2019
  • Oxide ($SnO_2$)/metal alloy (Cu(Ni))/oxide ($SnO_2$) multilayer films were fabricated using the magnetron sputtering technique. The oxide and metal alloy were $SnO_2$ and Ni-doped Cu, respectively. The structural, optical, and electrical properties of the multilayer films were investigated using X-ray diffraction (XRD), ultraviolet-visible (UV-vis) spectrophotometry, and 4-point probe measurements, respectively. The properties of the $SnO_2/Cu(Ni)/SnO_2$ multilayer films were dependent on the thickness and Ni doping of the mid-layer film. Since Ni atoms inhibit the diffusion and aggregation of Cu atoms, the grain growth of Cu is delayed upon Ni addition. For $250^{\circ}C$, the Haccke's figure of merit (FOM) of the $SnO_2$ (30 nm)/Cu(Ni) (8 nm)/$SnO_2$ (30 nm) multilayer film was evaluated to be $0.17{\times}10^{-3}{\Omega}^{-1}$.

가스분무주조 Cu-Sn-Ni-Si 합금의 미세조직 및 상온 인장성질 (Microstructure and Tensile Properties of Spray Cast Cu-Sn-Ni-Si Alloy)

  • 강희수;이언식;이규창;백경호
    • 한국분말재료학회지
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    • 제17권6호
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    • pp.470-476
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    • 2010
  • In this study, Cu-10Sn and Cu-10Sn-2Ni-0.2Si alloys have been manufactured by spray casting in order to achieve a fine scale microstructure and high tensile strength, and investigated in terms of microstructural evolution, aging characteristics and tensile properties. Spray cast alloys had a much lower microhardness than continuous cast billet because of an improved homogenization and an extended Sn solid solubility. Spray cast Cu-Sn-Ni-Si alloy was characterized by an equiaxed grain microstructure with a small-sized (Ni, Si)-rich precipitates. Cold rolling of Cu-Sn-Ni-Si alloy increased a tensile strength to 1220 MPa, but subsequent ageing treatment reduced a ultimate tensile strength to 780 MPa with an elongation of 18%.

전기도금된 Cu-Sn과 Ni preplated frame의 특성 비교 (Comparison of the Characteristics of Cu-Sn and Ni Pre-Plated Frames Prepared by Electro-Plating)

  • 이대훈;장태석;홍순성;이지원;양형우;한병근
    • 한국표면공학회지
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    • 제39권6호
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    • pp.276-281
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    • 2006
  • In order to improve the performance of PPFs (Pre-Plated Frames), a PPF that employed a Cu-Sn alloy instead of conventionally used Ni was developed and then its properties were investigated. It was found that the electoplated Cu-Sn alloy layer was a mixture of uniformly distributed fine crystallites, resulting In better wettability and crack resistance than those of Ni PPF. Moreover, as in Cu/Ni/Pd/Au PPF, migration of copper atoms from the base metal to the top of the Cu/Cu-Sn/Pd/Au PPF surface was not found although the Cu-Sn layer itself contained considerable amount of copper. It was expected that, by using the newly developed Cu-Sn PPF, any possible heat generation and signal interrupt caused by an external electro-magnetic field could be reduced because the Cu-Sn layer was paramagnetic, i.e., nonmagnetic.

Ni-xCu 합금 UBM과 Sn-Ag계 솔더 간의 계면 반응 연구 (Interfacial Reactions of Sn-Ag-Cu solder on Ni-xCu alloy UBMs)

  • 한훈;유진;이택영
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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    • pp.84-87
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    • 2003
  • Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

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아말감과 이종(異種)금속의 거리에 따른 부식에 대한 고찰 (A Study on Corrosion according to Distance between Amalgam and Dissimilar Metals)

  • 김주원;정은경
    • 치위생과학회지
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    • 제4권3호
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    • pp.103-109
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    • 2004
  • 본 실험은 제조회사 매뉴얼과 통법에 의해서 Amalgam 합금, Ni-Cr alloy의 Crown용 Verabond, Denture용 Talladium $^{TM}alloy$로 각각 24개의 총 72의 시편을 하악 제1대구치근 원심 치관 폭경과 임상에서의 MOD cavity를 고려하여 제작하였고 인공 타액 80ml를 담은 200ml 용 비이커에 시편을 넣어 0mm, 7mm, 40mm 거리에서 7일 후 갈바닉 부식을 측정하였다. 유리금속은 유도 플라즈마 방출 분광기(Inductively Coupled Plasma - Atomic Emission Spectrometer(ICP-AES, JY-50P, VG Elemental Co. France)로 전해액내의 Cu, Ag, Ni, Cr, Sn, Zn, Hg를 정량 분석했으며 그 결과 다음과 같은 결론을 얻었다. 첫째, Cu, Sn, Ag, Hg, Zn은 아말감이 금 합금과 접촉했을 때가 크라운용 Ni-Cr alloy와 덴쳐용 Talladium alloy 보다 아주 많이 유리 했으며 금 합금이 구강조직과 생체 적합성이 가장 좋다지만 아말감과 함께 있을 때 가장 불리 했슴을 알 수 있었다. 둘째, 아말감이 금 합금과 접촉했을 때, 금 합금의 조성에서 Ni, Cr 같은 중금속이 함유되지 않았기 때문인지 전혀 유리되지 않았으나 Sn은 조성에는 없었지만 $227.1{\pm}18.0035{\mu}g/cm^2$나 유리 되었고 Hg도 유리되었는데 이는 아말감 자체의 유리 물질임을 추측할 수 있었다. 셋째, 아말감 합금과 금 합금 사이에서의 0mm, 7mm, 40mm 거리에서는 Cu, Ag는 유의성이 있었으며 Hg는 유의성이 없었다. 이는 금합금은 절대 아말감과 같이 사용해서 안되며 이종 보철물 사이의 거리에 관계없이 사용을 금해야 하는 것으로 사료된다. 넷째, 아말감합금이 Crown용 Ni-Cr 합금과 접촉했을 때 아말감의 Ag이 유리 되지 않았으며 Zn, Ni, Sn, Hg, Cu의 순으로 유리되었다. 0mm, 7mm, 40mm 거리에 따라서 유의성이 있었다. Hg는 유리 되지 않았지만 중금속인 Ni, Cr은 유리되었고 반대 악궁이나 거리가 떨어져 있으면 접촉보다 Hg의 유리가 적었다. 다섯째, 아말감합금이 Denture용 Talladium alloy 합금과 접촉했을 때 0mm, 7mm, 40mm 거리에서도 유의성이 있었다. 0mm, 7mm, 40mm 거리에 따라서 유의성이 있었다. Hg는 유리 되지 않았지만 중금속인 Ni, Cr은 유리되었고 반대 악궁이나 거리가 떨어져 있으면 접촉보다 Hg의 유리가 적었다. 여섯째, 인공 타액에서 접촉 시 Amalgam alloy와 Gold, Verabond, Talladium alloy의 Cu, Sn, Ag, Hg, Zn, Ni, Cr의 ICPES 검사 결과 Cu, Hg가 유의성을 있었다. 일곱째, 인공타액에서 아말감합금과 두 비귀금속인 Ni-Cr alloy(crown용), Denture용 Talladium alloy가 접촉한 경우 거리에 따른 Hg, Ni, Cr의 유리 부산물에서 유의성을 확인했다.

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90Sn10Cu, 99Sn1Cu 도금막의 특성 (Characteristics of Electroplated 90Sn10Cu, 99Sn1Cu Films)

  • 김주연;김시중;배규식
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 하계학술대회 논문집
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    • pp.658-662
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    • 2000
  • The microstructure, adhesion strength and conductivity of electroplated Sn-Cu Films on Alloy42 lead Frame were measured for comparison. In the case of electroplated 90Sn10Cu, 99Sn1Cu, Cu$\sub$10/Sn$_3$Phase was formed and Ni$_3$Sn$_2$Phase was formed after 200$^{\circ}C$, 30min annealing. In the case of electroplated 99Sn1Cu, Cu$\sub$10/Sn, Ni$_3$Sn phases were formed and Ni$_3$Sn$_4$, Ni$_3$Sn$_4$phases were formed after 200$^{\circ}C$, 30min annealing. 90Sn10Cu film was measured better uniformity, adhesion strength and conductivity than 99Sn1Cu.

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열처리조건에 따른 Cu-Ni-Si-Sn-Fe-P 석출경화형 동합금계의 물성변화 특성 (Mechanical and Physical Property Changes of Cu-Ni-Si-Sn-Fe-P Copper Alloy System According to the Heat Treatment Conditions)

  • 김승호;염영진
    • 열처리공학회지
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    • 제26권5호
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    • pp.225-232
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    • 2013
  • The influence of aging treatment, addition elements and rolling reduction ratio on the microstructure, mechanical, electrical and bendability properties of Cu-Ni-Si-P-x (x = Fe, Sn, Zn) alloys for connector material application was investigated. SEM/EDS analysis exhibited that Ni2-Si precipitates with a size of 20~100 nm were distributed in grains. Fe, Sn, Zn elemnets in Cu-Ni-Si-P alloy imporved the mechanical strength but it was not favor in increasing of electrical conductivity. As higher final rolling reduction ratio, the strength and electrical conductivity is increased after aging treatment, but it indicated excellent bendability. Especially, Cu-2Ni-0.4Si-0.5Sn-0.1Fe-0.03P alloy show the tensile strength value of 700MPa and the electrical conductivity was observed to reach a maximum of 40%IACS. It is optimal for lead frame and connector.

분무주조에 의해 제조된 Cu-Sn계 합금의 미세조직 및 인장성질 (Microstructural Evolution and Tensile Properties of Cu-Sn Based Alloys Manufactured by Spray Casting Route)

  • 심상현;강희수;백경호
    • 한국분말재료학회지
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    • 제17권6호
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    • pp.477-481
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    • 2010
  • Cu-Sn based alloys were manufactured by gas atomization spray casting route in order to achieve a fine scale microstructure and a high tensile strength. The spray cast Cu-10Sn-2Ni-0.2Si alloy had an equiaxed grain microstructure, with no formation of brittle ${\delta}-Cu_{41}Sn_{11}$ phase. Aging treatment promoted the precipitation of finely distributed particles corresponding to ${\delta}-Ni_2Si$ intermetallic phase throughout the $\alpha$-(CuSn) matrix. The cold-rolled Cu-Sn-Ni-Si alloy had a very high tensile strength of 1200 MPa and an elongation of 5%. Subsequent aging treatment at $450^{\circ}C$ for 1h slightly reduced the tensile strength to 700 MPa and remarkably increased the elongation up to 30%. This result has been explained by coarsening the precipitates due to over aging and reducing the dislocation density due to annealing effects.