• Title/Summary/Keyword: Sn-Ag alloy

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Manufacturing of Composite Solders by an In-situ Process (In-situ 공정에 의한 복합솔더 제조)

  • Hwang, Seong-Yong;Lee, Joo-Won;Lee, Zin-Hyoung
    • Journal of Korea Foundry Society
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    • v.22 no.1
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    • pp.35-41
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    • 2002
  • To improve the reliability of solder joints, a composite solder which consists of solder matrix and intermetallic reinforcements was manufactured by a new method. The cast ingot of Sn-6.9Cu-2.9Ag alloy had primary Cu6Sn5 intermetallics in the form of dendrites. After rolling the ingot, the intermetallic dendrites were crushed into fine particles and distributed uniformly throughout the solder matrix. As the rolled strips became thinner, the average size of the crushed particles reached a critical size which did not decrease any more by further rolling. The critical size was nearly the same as the average width of intermetallic dendrite trunk. The crushed intermetallic particles did not melt and remained in solid state during reflow soldering due to their high meltingterm-perature. The coarsening and gravitational segregation of the particles were observed during reflow soldering.

Development and its Performance Evaluation of a Micro-Impression Creep Machine (마이크로 압입 크리프 시험기 개발 및 성능평가)

  • Yang, Kyoung-Tak;Kim, Hyun-Jun;Kim, Ho-Kyung
    • Tribology and Lubricants
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    • v.24 no.1
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    • pp.27-33
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    • 2008
  • A micro-impression creep machine was designed and developed, adopting a small punch in diameter of 150 um, displacement gage with an accuracy of sub-${\mu}m$ scale, and load-cell with an accuracy of mN scale in order to investigate creep behavior of small solder ball in diameter of less than 1 mm. Creep behavior of lead-free solder ball(Sn-3.0Ag-0.5Cu) in diameter of $760\;{\mu}m$ was investigated in the stress range of $8{\sim}60\;MPa$ and at $303\;K{\sim}393\;K$. The applied load became decreased slightly and continuously in the creep rate of $10^{-4}/s$ range during the current experiments. Also, the machine frame was so sensitive to the environmental temperature that nm scaled displacement recording was unstable according to the change in environmental temperature.

A Study on the Improvement of Storage Stability of Solder Paste Using Multiple size of solder Powder (다양한 크기의 솔더 파우더를 이용한 솔더 페이스트의 저장안정성 향상에 관한 연구)

  • Lim, Chan-Kyu;Gyun, Bo-Suk;Son, Min-Jung;Kim, Inyoung;Yang, Sangsun;Nam, Su-Yong
    • Journal of Powder Materials
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    • v.24 no.5
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    • pp.395-399
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    • 2017
  • Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.

A Study on Change of Physical Property in Porcelain Fused to 18K Gold Alloy by Small Additional Elements (도재소부용 18K 금합금의 미량원소의 첨가에 따른 물리적 성질의 변화에 관한 연구)

  • Lee, Kee-Dae
    • Journal of Technologic Dentistry
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    • v.30 no.2
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    • pp.31-37
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    • 2008
  • A variety of the porcelain fused to gold(PFG) have been developed to which porcelain can be fused. PFG alloys developed for this purposed have a high melting point and do not discolor when combined with porcelain. The design of the compositions of PFG is very important to esthetic restorative materials applying to porcelain. The purpose of this study is on the change of physical and mechanical characteristics in PFG 18K alloy by the small additional elements. Principal results are as follows. The high Au alloy containing 18Karat gold contents is respectively Au(75%), Pd(10%), Pt(4%), Ag(4%), In(2%), Sn(2%), Cu(2%), Ti(1%). These alloys are composed mainly of gold, platinum, silver and palladium with a few percent of the additional elements. By the addition of small amounts of elements such as In, Sn, Ti, the fine grain castings are produced in gold alloy and the small addition of platinum is very effective in increasing of hardness and strength. These gold alloys are representative of the changes to be expected as a result of heat treatment. These changes in strength and hardness values are sufficient to demonstrate a significant difference in performance between a as-casted and a heat-treated. These alloys have mechanical properties characteristics of Type and Type gold alloys. These alloys are useful to porcelain-metal restorations and dental laboratory. Also the porcelain fused to metal(PFM) alloys containing gold are commonly use for dental purposes in dental laboratory.

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A Study on Evaluation of Shear Strength for Pb-free Solder Joint with Ni-P/Au UBM (Ni-P/Au UBM을 갖는 Pb-free 솔더 접합부의 전단강도 평가에 관한 연구)

  • Cho, Seong-Keun;Yang, Sung-Mo;Yu, Hyo-Sun
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.2
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    • pp.187-192
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    • 2011
  • UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production

  • Chae Kyu-Sang;Min Jae-Sang;Kim Ik-Joo;Cho Il-Je
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.1 s.34
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    • pp.65-71
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    • 2005
  • At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

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Retardation of Massive Spalling by Palladium Layer Addition to Surface Finish (팔라듐 표면처리를 통한 Massive Spalling 현상의 억제)

  • Lee, Dae-Hyun;Chung, Bo-Mook;Huh, Joo-Youl
    • Korean Journal of Metals and Materials
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    • v.48 no.11
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    • pp.1041-1046
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    • 2010
  • The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

Hardening mechanism associated with post-firing heat treatment of softening heat treated and then firing simulated Pd-Ag-Au alloy for bonding porcelain (연화 열처리 후 모의소성된 금속-세라믹용 Pd-Ag-Au계 합금의 후열처리에 의한 경화기전)

  • Kim, Sung-Min;Yu, Young-Jun;Cho, Mi-Hyang;Kwon, Yong-Hoon;Kim, Hyung-Il;Seol, Hyo-Joung
    • Korean Journal of Dental Materials
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    • v.42 no.2
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    • pp.95-106
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    • 2015
  • Hardening mechanism associated with post-firing heat treatment of softening heat treated and then firing simulated Pd-Ag-Au alloy for bonding porcelain was examined by observing the change in hardness, crystal structure and microstructure. By post-firing heat treatment of as-cast, solution treated and pre-firing heat treated specimens at $650^{\circ}C$ after casting, the hardness value increased within 10 minutes. Then, hardness consistently increased until 30 minutes, and gap of hardness value among the specimens was reduced. The increase in hardness after post-firing heat treatment was caused by grain interior precipitation in the matrix. The softening heat treatment did not affect the increase in hardness by post-firing heat treatment. The precipitated phase from the parent Pd-Ag-Au-rich ${\alpha}$ phase with face-centered cubic structure by post-firing heat treatment was $Pd_3$(Sn, In) phase with face-centered tetragonal structure, which has lattice parameters of $a_{200}=4.0907{\AA}$, $c_{002}=3.745{\AA}$. From above results, appropriate post-firing heat treatment in order to support the hardness of Pd-Ag-Au metal substructure was expected to bring positive effects to durability of the prosthesis.

A STUDY ON THE MICROSTRUCTURES OF THE AMALGAM ALLOYS AND AMALGAMS (치과용 아말감합금 및 아말감의 마세구조에 관한 연구)

  • Yeon, Sang-Heum;Lee, Chung-Sik;Lee, Myung-Jong;Um, Chung-Moon
    • Restorative Dentistry and Endodontics
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    • v.21 no.1
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    • pp.87-105
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    • 1996
  • The purpose of this study is to investigate the characteristics of the compositions and phases of amalgam alloys and amalgams by using EMPA and X-ray diffractometer. Each specimen was made from Caulk Fine Cut Clow copper lathe cut amalgam), Caulk Spherical (low copper spherical amalgam), Tytin (high copper unicorn position amalgam), Dispersally (high copper admixed amalgam) and Valiant (Palladium enriched amalgam). For preparing amalgam alloys, Tytin and Valiant were used as powder forms and the others were used as tablet forms after being polished with polishing machine. For preparing amalgams, each amalgam alloy and Hg were measured, and triturated by mechanical amalgamater according to user's instructions. After triturating, the triturated mass was inserted to cylindrical metal mold and simultaneously adapted by cylindrical condenser with same diameter and condensed by Instron universal testing machine with 80kg pressure & 1mm/min speed. Each specimen was removed from the metal mold and stored at room temperature for a week. The specimen was polished with the same polishing machine for amalgam alloy. For observation of microstructure and analysis of composition of amalgam alloys and amalgams, EMPA was used to get secondary electron images, backscattered images and characteristic X-ray images of Ag, Sn, Cu, Zn, Hg. To analyze compositions of amalgam alloys and amalgams, X-ray diffractometer was used. Amalgam alloys were scanned at the range of 2${\theta}$ of 30-$85^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line and amalgams were scanned at the range of 2${\theta}$ of 28-$44^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line. By comparing obtained d(distance between surfaces) and d of expected phases and atoms in amalgam alloys and amalgams in ASTM card, phases and atoms were identified. The results were as follows, 1. In Caulk Fine Cut amalgam alloy typical ${\gamma}$ phase was shown, and in amalgam, ${\gamma}$, ${\gamma}_1$ and ${\gamma}_2$ phases were observed. 2. In Caulk Spherical amalgam alloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, ${\gamma}_2$ and $\eta$ phases were observed. 3. In Tytin amalgam alloy ${\gamma}$, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 4. In Dispersalloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 5. In Valiant alloy ${\gamma}$, Cu and e phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed.

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Applicability for Authenticity of Bronze Artefacts using Scientific Analyses (과학적 분석을 통한 전세품 청동기의 진위판별 적용 가능성 연구)

  • Do, Misol;Chung, Kwang Yong
    • Journal of Conservation Science
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    • v.29 no.4
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    • pp.355-366
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    • 2013
  • Diverse scientific analyses, including microstructure, ICP-AES, SEM-EDS, and P-XRF(Bench Top type and Gun type), were carried out on 6 bronze artefacts which handed from generation to generation. Also, we attempted to study applicability for authenticity of the bronze artefacts using scientific analyses based on the specific element. The results of ICP-AES analysis showed that the bronze were formed from an alloy of Cu, Sn, Pb with trace elements such as Ag, As, Co, Fe, but there were not Zn found. The result of P-XRF are 10~25% lower in Cu and 10~20% higher in Sn than that of ICP-AES. This is because of destannification that the compound of $SnO_2$ are present on the surface. The results of SEM-EDS represented that there is lead segregation. It was difficult to study applicability for authenticity of bronze artefact according to the microstructures and chemical components of the bronze artefacts. Therefore, as bronze artefacts have shown different corrosion materials depending on the buried environment and conserving environment, identifying the authenticity would be possible on the basis of the additional researches on the corrosion and comparative research of ancient art.