• 한국전기전자재료학회논문지
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• 제37권1호
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• pp.74-78
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• 2024

We have studied the effects of Ag on the characteristics of Sn₄₈In₅₂Ag_x (wt%) low-melting solders for photovoltaic ribbons. The Sn₄₈In₅₂ (wt%) solder coexisted in the InSn₄ and In₃Sn alloys. Ag atoms added in the solder formed an AgIn₂ alloy by reacting with some part of In atoms, while they did not react with Sn atoms. The addition of Ag atoms in the Sn₄₈In₅₂Ag_x (wt%) solders showed useful results; an increase in peel strength and a decrease in melting temperature. The peel strength of the ribbon plated with the Sn₄₈In₅₂ (wt%) solder was 53.6 N/mm², and that of the Sn₄₈In₅₂Ag₁ (wt%) solder largely increased to 125.1 N/mm². In the meanwhile, the melting temperature of the Sn₄₈In₅₂ (wt%) solder was 119.2℃, and that of the Sn₄₈In₅₂Ag₁ (wt%) solder decreased to 114.0℃.

• 마이크로전자및패키징학회지
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• 제12권4호통권37호
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• pp.351-357
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• 2005

솔더/UBM 계면반응에 따른 솔더범프의 기계적 신뢰성을 평가하기 위한 방안으로서 Cu UBM 상에서 리플로우한 Sn-52In 솔더범프의 리플로우 조건에 따른 전단응력과 전단에너지의 변화거동을 비교하였다. 리플로우 조건에 따른 전단에너지의 변화거동이 전단강도에 비해 Sn-52In/Cu 계면반응 및 파괴모드의 변화거동과 훨씬 잘 일치하여 솔더/UBM 계면반응에 따른 기계적 신뢰성을 분석하는데 전단에너지가 전단강도보다 훨씬 효과적인 평가 방안임을 알 수 있었다.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.87-93
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• 2005

Au 층의 두께를 $0.1{\~}0.7{\mu}m$로 변화시킨 $0.1{\mu}m$ Ti/3 ${\mu}m$ Cu/Au UBM 상에서 48Sn-52In 솔더를 $150-250^{\circ}C$의 온도 범위에서 리플로우시 UBM/솔더 반응에 의한 금속간화합물의 형성거동을 분석하였다. 또한 Ti/Cu/Au UBM의 Au 두께 및 리플로우 온도에 따른 볼 전단강도와 전단에너지를 분석하였다. $150^{\circ}C$와 $200^{\circ}C$에서 리플로우 시에는 UBM/솔더 계면에 $Cu_6(Sn,In)_5$와 $AuIn_2$ 금속간 화합물이 형성되어 있으나, $250^{\circ}C$에서 리플로우 시에는 솔더 반응이 크게 증가하여 UBM이 대부분 소모되었다. 볼 전단강도는 UBM/솔더 반응과 일치하지 않는 결과를 나타내었으나, 전단 에너지는 UBM/솔더 반응과 잘 일치하는 변화 거동을 나타내었다.

• 한국전기전자재료학회논문지
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• 제36권2호
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• pp.186-190
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• 2023

We studied the various characteristics of Sn-In (wt%) Pb-free solders for photovoltaic ribbon application. The solders near the eutectic composition of Sn₄₈In₅₂ (wt%) existed in InSn₄ and In₃Sn alloy phases, and in In crystal phase, but not in Sn crystal phase. In addition, the InSn₄ phase (γ-alloy) existed separately from the In₃Sn (β-alloy) and the In phase confirmed by an SEM-EDS-mapping. The melting temperature of the eutectic solder of Sn₄₈In₅₂ (wt%) was 119.2℃, and when the Sn content decreased in reference to the eutectic composition, it slightly increased to 121.4℃, but when the Sn content increased, it remained almost constant at 119.1℃. The peel strength of the ribbon plated with the Sn₄₂In₅₈ (wt%) solder was 38.7 N/mm², and it tended to increase when the Sn content increased. The peel strength of the eutectic Sn₄₈In₅₂ (wt%) solder was 53.6 N/mm², and that of the Sn₅₁In₄₉ (wt%) solder was 61.6 N/mm² that was the highest.

• 마이크로전자및패키징학회지
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• 제9권2호
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• pp.39-43
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• 2002

48 $\mu$BGA 패키지에 Sn-37Pb 공정 솔더와 Sn-0.7Cu, Sn-3.5 Ag, Sn-2.0Ag-0.75Cu, Sn-2.0Ag-0.7Cu-3.0Bi 4종류의 무연 솔더를 적용하여, 미세 솔더 볼의 경도와 조성에 따른 솔더 접합부의 전단강도에 대해서 연구하였다. 실험 결과, 솔더 볼의 짖눌림은 Sn-2.0Ag-0.7Cu-3.0Bi에서 0.043mm로 큰 경도값을 얻었다. 또한 전단 강도 값은 무연 솔더가 Sn-37Pb 솔더보다 높았으며, Sn-2.0Ag-0.7Cu-3.0 Bi에서 최대 52% 높은 값을 나타내었다.

• Elastomers and Composites
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• 제52권4호
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• pp.287-294
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• 2017

Nanocomposites based on $SnO_2-Mn$ were synthesized by the reaction of tin (II) chloride dihydrate and manganese (II) chloride tetrahydrate at a molar ratio of 10:1 in the presence of ammonium hydroxide at $80^{\circ}C$. The $SnO_2-Mn$ nanocomposites were stirred with fullerene [$C_{60}$] in a mass ratio of 2:1 in tetrahydrofuran to prepare $SnO_2-Mn-C_{60}$ nanocomposites; these nanocomposites were obtained upon heating the mixture of $SnO_2-Mn$ nanocomposites and fullerene [$C_{60}$] in an electric furnace at $700^{\circ}C$ for 2 h. The synthesized $SnO_2-Mn-C_{60}$ nanocomposites were confirmed through various characterization methods such as X-ray diffraction and scanning electron microscopy. The photocatalytic activities of the $SnO_2-Mn-C_{60}$ nanocomposites were demonstrated by the degradation of the organic dyes BG, MB, MO, and RhB under 254 nm irradiation and evaluated using UV-Vis spectrophotometry.

• 한국동물위생학회지
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• 제14권2호
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• pp.148-153
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• 1991

To investigate epidemological sitution of bovine viral diarrhea infection, serological survey in cattle being raised in Young Dong province were conducted. Bovine sera collected ramdomly from August 1990 to December 1990 were tested for bovine viral diarrhea virus serum neutralizing antibody titers. The results were as follows 1. BVDV SN antibody levels were considerably varies and positive rate was 58(108 heads out of 186) 2. BVDV SN antibodies to breeds of cattle was various and positive rates showed that diary cattle, beef, native cattle(Korean) were 67.52%, 59.38%, 27.00％ respectively followed in that order. 3. In the regional prevalence of BVD SN antibodies in cattle, Alpine(92％) was the highest, Young Dong south(59%) middle(44%), and North 30% followed in that order 4. In the age relatated prevalence of BVD SN antibodies, the younger than 6 month old group was the highest 65.7%, and older than 25 month old group was also at 62.2％. Then, 7 to 12 moth old group and 13 to 24 month old group showed to 58.5%, 52.1％ respectively. 5. The geometric mean titer (log2) of 108 cattle serum samples showing positive BVD SN antibodies was 4.3. 6. In the geometric mean titer(log2) according to age, younger than 6 month old group (5.2) was the highest, then 7 to 12 month old group 2.8(SD=1.94 standard deviation) was lowliest.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1995년도 특별강연 및 추계학술발표 개요집
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• pp.110-112
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• 1995

Initial solder joint strengths of various solder pastes, such as Sn-Pb(63-37wt%), Sn-In(52-48wt%), Sn-In-Ag(77.5-20-2.5wt%), and Sn-Ag(96.5-3.5wt%) has been studied. A system that can control the solder joint interface temperature during bonding process was also desined and implemented to improve solder joint integrity.

• 천문학회보
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• 제44권2호
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• pp.52.2-52.2
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• 2019

In the last decades, the use of type Ia supernovae (SN) as standard candles has allowed us to understand the geometry of the Universe as they help to measure the expansion rate of the Universe, especially in combination with other cosmological probes such as the study of cosmic microwave background radiation anisotropies or the study of the imprint of baryonic acoustic oscillations on the galaxy clustering. Cosmological parameter constraints obtained with type Ia SN are mainly affected by intrinsic systematic errors. But there are other systematic effects related with the correlation of the observed brightness of Supernova and the large-scale structure of the Universe such as the effect of peculiar velocities and gravitational lensing. The former is relevant for SN at low redshifts while the latter starts being relevant for SN at higher redshifts. Gravitational lensing depends on how much matter is along the trajectory of each SN light beam. In order to account for this effect, we consider a statistical approach by defining the probability distribution (PDF) that a given supernova brightness is magnified by a given amount, for a particular redshift. We will show that different theoretical approaches to define the matter density along the light trajectory hugely affect the shape and width of the PDF. This may have catastrophic effects on cosmology fits using Supernova lensing as planned for surveys such as the Dark Energy Survey or future surveys such the Large Synoptic Survey Telescope.

• Journal of Welding and Joining
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• 제20권6호
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• pp.59-59
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.