• Korean Journal of Metals and Materials
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• v.49 no.8
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• pp.635-641
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• 2011

The effect of high shear speed on shear force, shear energy and fracture surface was investigated for the solder joint of a $Sn-_{3.0}Ag-_{0.5}Cu$ ball. For both ENIG and OSP pads, the shear force increased with an increase in shearing speed to 0.3 m/s. However, for an ENEPIG pad, the shear force increased with an increase in shear speed to 0.6 m/s and kept almost constant afterward. The shear energy decreased with an increase in shearing speed for ENIG and OSP pads. For the ENEPIG pad, however, the shear energy almost remained constant in a shearing speed range 0.3-3.0 m/s. The fracture mode analysis revealed that the amount of brittle fracture for the ENIG and the OSP pads increased with shearing speed, and a complete brittle fracture appeared at 1.0 m/s for ENIG and 2.0 m/s for OSP. However, the ENEPIG pad showed only a ductile fracture until 0.25 m/s, and a full brittle fracture didn't occur up to 3.0 m/s. The fracture mode matched well with the shear energy. The results from the high speed shear test of SAC305 were similar to those of SAC105.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.17-27
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• 2011

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/ 2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moir$\acute{e}$ setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Journal of the Korean Society of Safety
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• v.30 no.6
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• pp.7-11
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• 2015

The present study investigates the impact shear strength of thermal aged Sn-3Ag-0.5Cu lead-free solder joints at impact speeds ranging from 0.5 m/s to 2.5 m/s. The specimens were thermal aged for 24, 100, 250 and 1000 hours at $100^{\circ}C$. The experimental results demonstrate that the shear strength of the solder joint decreases with an increase in the load speed and aging time. The shear strength of the solder joint aged averagely decreased by 43% with an increase in the strain rate. For the as-reflowed specimens, the mode II stress intensity factor ($K_{II}$) of interfacial IMC between Sn-3.0Ag-0.5Cu and a copper substrate also was found to decrease from $1.63MPa.m^{0.5}$ to $0.97MPa.m^{0.5}$ in the speed range tested here. The degradations in the shear strength and fracture toughness of the aged solder joints are mainly caused by the growth of IMC layers at the solder/substrate interface.

• Resources Recycling
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• v.29 no.2
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• pp.69-77
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• 2020

With rapid increasing production and installation, recycling of photovoltaic modules has become the main issue. According to the research, the accumulation of waste modules will reach to 8600 tons in 2030. Moreover, Crystalline-silicon (c-Si) Photovoltaic modules account for more than 90% of the waste. C-Si PV modules contain 1.3% of weight of photovoltaic ribbon inside which contains the most of lead, tin and copper in the PV modules, which would cause environmental and humility problem. This study provided a valuable metal separation process for PV ribbons. Ribbons content 82.1% of Cu, 8.9% of Sn, 5.2% of Pb, and 3.1% of Ag. All of them were leached by 3M of hydrochloric acid in the optimal condition. Ag was halogenated to AgCl and precipitated. Cu ion was extracted and separated from Pb and Sn by Lix984N then stripped by 3M H2SO4. The effect of the optimal parameters of extraction was also studied in this essay. The maximum extraction efficiency of Cu ion was 99.64%. The separation condition of Pb and Sn were obtained by adjusting the pH value to 4 thought ammonia to precipitate and separate Pb and Sn. The recovery of Pb and Sn can reach 99%.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.18-23
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• 2003

Properties of Ag thick films fabricated by using low temperature curable silver pastes were investigated. Ag pastes were consisted of polymer resins and silver powders. Ag pastes were used for conductive or fixing materials between board and various electrical and electronic devices. Low temperature curable Ag pastes have some advantages over high temperature curable types. In cases of chip mounting, soldering properties were required for screen printed Ag thick films. In this study, four types of Ag pastes were fabricated with different compositions. Screen printed Ag thick films on alumina substrates were fabricated at various curing temperatures and times. Thickness, resistivity, adhesive strength and solderability of fabricated Ag thick films were characterized. Finally, Ag thick films produced using Ag pastes, sample A and B, cured at $150^{\circ}C$ for longer than 6 h and $180^{\circ}C$ for longer than 2 h, and $150^{\circ}C$ for longer than 1 h and $180^{\circ}C$ for 1 h, respectively, showed low resistivities of $10^{-4}$ $∼10^{-5}$ Ωcm and good adhesive strength of 1∼5 Mpa. Soldering properties of those Ag thick films with curing temperatures at solder of 62Sn/36Pb/3Ag were also investigated.

• The Journal of the Petrological Society of Korea
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• v.16 no.4
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• pp.189-195
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• 2007

Pirquitas mine was Bolivian type deposits, which Tertiary quartz andesites caused various epithermal quartz veins and deposited minerals of Sn and Ag in it. Main mineral was cassiterite and necessaries were pyrite, arsenopyrite, pynhotite, Probable ore reserve and daily production are 200 million tons and 5 thousand tons, respectively, and both of exploration and pit development are being carried simultaneously, but in near future open pit works can be done. This mine is owned by the Canadian company of "Silver Standard Resources" and it is located on $S22^{\circ}30'25.0",\;66^{\circ}15'22.5"$, 4086m S.L. In view of infrastructure, geological environment and scale of ore reserves it is high potential area for domestic mining companies to participate share ownership.

• Resources Recycling
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• v.10 no.5
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• pp.29-35
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• 2001

This study was carried out to recover gold, silver and valuable metals from the printed circuit boards (PCBs) of waste computers. PCBs samples were crushed under 1 mm by a shredder and separated into 30% conducting and loft nonconducting materials by an electrostatic separator. The conducting materials contained valuable metals which were then used as feed materials for magnetic separation. 42% of magnetic materials from the conducting materials was removed by magnetic separation as nonvaluable materials and the others, 58% of non magnetic materials, was used as leaching samples containing 0.227 mg/g Au and 0.697 mg/g Ag. Using the materials of leaching from magnetic separation, more than 95% of copper, iron, zinc, nickel and aluminium was dissolved in 2.0M sulfuric acid solution, added with 0.2M hydrogen peroxide at $85^{\circ}C$. Au and Ag were not extracted in this solution. On the other hand, more than 95% of gold and 100% of silver were leached by the selective leaching with a mixed solvent (0.2M($NH_4$)$_2$$S_2$$O_3$,0.02M $CuSO_4$,0.4M $NH_4$OH). Finally, the residues were reacted with a NaCl solution to leach Pb whereas sulfuric acid was used to leach Sn. Recoveries reached 95% and 98% in solution, respectively.

• Journal of Korea Foundry Society
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• v.22 no.1
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• pp.35-41
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• 2002

To improve the reliability of solder joints, a composite solder which consists of solder matrix and intermetallic reinforcements was manufactured by a new method. The cast ingot of Sn-6.9Cu-2.9Ag alloy had primary Cu6Sn5 intermetallics in the form of dendrites. After rolling the ingot, the intermetallic dendrites were crushed into fine particles and distributed uniformly throughout the solder matrix. As the rolled strips became thinner, the average size of the crushed particles reached a critical size which did not decrease any more by further rolling. The critical size was nearly the same as the average width of intermetallic dendrite trunk. The crushed intermetallic particles did not melt and remained in solid state during reflow soldering due to their high meltingterm-perature. The coarsening and gravitational segregation of the particles were observed during reflow soldering.

• Journal of the Korean Applied Science and Technology
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• v.33 no.2
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• pp.352-360
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• 2016

The purpose of this study was to determine the electrochemical properties develop DSA electrode for sewage sludge solubilization. Using Ir as a main catalyst, the catalyst selected for the sewage sludge solubilization durability and proceeds to functional electrode suitable for sewage sludge electrolysis experiment were obtained the following results. Less mass reduction of the sintering temperature of the main catalyst, Ir coated electrodes, the endothermic reaction zone $300^{\circ}C$ to $500^{\circ}C$, which was selected from a range of experiments. The efficiency of the catalyst results came up to $350^{\circ}C$ best. Each Binder stars (Ta, Sn, W) in this experiment was the biggest catalyst efficiency at $350^{\circ}C$. Used as a binder, $TaCl_5$, $SnCl_4$, $WCl_6$ of the Ta and without affecting the other characteristics of the main catalyst than Sn, W. For the 50% $IrO_2$ electrode is 1.4 V (vs. Ag / AgCl) in a current of about $29mA/cm^2$ was caused to evaluate the effectiveness of the electrode.