• 한국분말야금학회:학술대회논문집
• /
• 한국분말야금학회 2005년도 추계학술강연 및 발표대회강연 및 발표논문 초록집
• /
• pp.87-88
• /
• 2005

Ultra-fine copper powders with particle size about 150 nm were synthesized from copper hydroxide slurry by wet method using hydrazine as reduction agent and several sur factants at below $80^{\circ}C$. The particle size distribution and dispersion of synthesized powders as function of temperature, feeding rate of reduction and especially, sur factants were character ized by XRD, BET, PSA and SEM by this process.

• 한국콘크리트학회:학술대회논문집
• /
• 한국콘크리트학회 2000년도 가을 학술발표회 논문집(II)
• /
• pp.1205-1210
• /
• 2000

In this research we made the mean cement particle size 4 $\mu\textrm{m}$ which can penetrate even minor cracks based on the theory of J.K. Michel who reported particles can penetrate the crack of width up to 3 times of maximum particle size. The cement slurries were produced by adding super plasticizer. The slurries were tested with slurry characterization methods and its rheological properties were characterized. The early hydrated phenomena of ultra fine cement were observed by SEM, XRD and DSC during 24 hours. Mechanical properties of hardened slurry with JIS molds were also tested in 3, 7 and 28 days. The cracked specimens which were repaired with slurries produced various conditions were tested after 3, 7 and 28 days curing in the air and adhesion properties were characterized.

• 한국전기전자재료학회논문지
• /
• 제17권2호
• /
• pp.156-161
• /
• 2004

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

• 한국분말재료학회지
• /
• 제25권5호
• /
• pp.395-401
• /
• 2018

The improvement of dispersion stability for the primary polishing slurry in a CMP process is achieved to prevent defects produced by agglomeration of the slurry. The dispersion properties are analyzed according to the physical characteristics of each silica sol sample. Further, the difference in the dispersion stability is confirmed as the surfactant content. The dispersibility results measured by Zeta potential suggest that the dispersion properties depend on the content and size of the abrasive in the primary polishing slurry. Moreover, the optimum ratio for high dispersion stability is confirmed as the addition content of the surfactant. Based on the aforementioned results, the long-term stability of each slurry is analyzed. Turbiscan analysis demonstrates that the agglomeration occurs depending on the increasing amount of surfactant. As a result, we demonstrate that the increased particle size and the decreased content of silica improve the dispersion stability and long-term stability.

• 한국추진공학회:학술대회논문집
• /
• 한국추진공학회 2008년도 제31회 추계학술대회논문집
• /
• pp.459-462
• /
• 2008

슬러리 연료 제조 시 카본의 분산안정성에 미치는 공정변수의 영향을 조사하였다. 슬러리연료 저장용기의 세군데(위, 중간, 아래) 위치별로 채취된 시료에서 평균입도와 탄소함량을 분석하여 Jet A-1에서 카본의 분산안정성을 측정하였다. 여러 종류의 첨가제를 적용한 결과, NB463S84 사용 시 분산성과 증가된 중력 가속도하에서 안정성이 가장 우수하였다. 동일 조건에서 카본층 높이 변화와 카본의 평균입도 측정을 통하여 혼합장비의 성능을 비교하였고, 실험실 규모에서 얻은 제조조건을 bench 규모 제조에 적용하여 본 연구의 실용 가능성을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
• /
• pp.50-53
• /
• 2003

CMP (chemical mechanical polishing) process remained to solve several problems in deep sub-micron integrated circuit manufacturing process. especially consumables (polishing pad, backing film, slurry, pad conditioner), one of the most important components in the CMP system is the slurry. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are important in determining polish rate and planarization ability of a CMP process. However, the cost of abrasives is still very high. So, in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• 한국진공학회지
• /
• 제10권3호
• /
• pp.361-367
• /
• 2001

CMP(Chemical Mechanical Polishing)는 반도체 소자 제조공정 중 다층 배선구조의 평탄 경면화에 널리 이용되고 있다. 차세대 웨이퍼로 각광받는 SOI(Silicon On Insulator) 웨이퍼 제조공정 중 웨이퍼 표면 미소 거칠기를 개선하기 위해서 본 논문에서는 여러 가지 가공변수(슬러리와 연마패드)에 따른 CMP 연마능률과 표면 미소 거칠기 변화에 대해 연구하였다. 결과적으로 연마능률은 슬러리의 입자 크기가 증가할수록 이에 따라 증가하였으며, 미소 거칠기는 슬러리의 연마입자보다는 연마패드에 영향이 더욱 지배적이다. AFM(Atomic Force Microscope)에 의한 평가에서 표면 미소 거칠기가 27 $\AA$ Rms에서 0.64 $\AA$ Rms로 개선됨을 확인할 수 있었다.

• Transactions on Electrical and Electronic Materials
• /
• 제7권4호
• /
• pp.167-172
• /
• 2006

Submicron colloidal silica coated with ceria were prepared by mixing of silica and nano ceria particles and modified by hydrothermal reaction. The polishing efficiency of the ceria coated silica slurry was tested over oxide film on silicon wafer. By changing the polishing pressure in the range of $140{\sim}420g/cm^2$ with the ceria coated silica slurries in $100{\sim}300nm$, rates, WIWNU and friction force were measured. The removal rate was in the order of 200, 100, and 300 nm size silica coated with ceria. It was known that the smaller particle size gives the higher removal rate with higher contact area in Cu slurry. In the case of oxide film, the indentation volume as well as contact area gives effect on the removal rate depending on the size of abrasives. The indentation volume increase with the size of abrasive particles, which results to higher removal rate. The highest removal rate in 200 nm silica core coated with ceria is discussed as proper combination of indentation and contact area effect.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
• /
• pp.112-112
• /
• 2008

최근 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 금속층-유전막-금속층 캐패시터의 하부전극으로 각광받고 있다. 또한 Cu와의 우수한 Adhesion 특성으로 인해 Cu 배선에서의 Cu 확산 방지막으로도 주목받고 있다. 그러나 이렇게 형성된 Ru 하부전극의 각 캐패시터간의 분리와 평탄화를 위해서는 CMP 공정이 도입이 필요하다. 이러한 CMP 공정에 공급되는 Slurry 에는 부식액, pH 적정제, 연마입자 등이 첨가되는데 이때 연마입자가 응집하여 Slurry의 분산 안전성 저하에 영향을 줄수 있다. 이로 인해 응집된 Slurry는 Scratch와 Delamination 과 같은 표면 결함을 유발할 수 있으며, Slurry의 저장 안정성을 저하시켜 Slurry의 물리적 화학적 특성을 변화시킬 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 Surfactant와 같은 분산 안정제에 따른 Surface tension, Zeta potential, Particle size, Sedimentation의 분석을 통해 Slurry 안정성에 대한 영향을 살펴보았다. 그 결과 pH9 조건의 31ppm Dispersant 농도에서 50%이상의 Sedimentation 상승효과를 얻을 수 있었다. 또한 선택된 Surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru wafer의 Static etch rate, Passivation film thickness 와 Wettability를 비교해 보았다. 그리고 CMP 공정을 실시하여 Ru의 Removal rate와 TEOS에대한 Selectivity를 측정해 보았다.

• Asian-Australasian Journal of Animal Sciences
• /
• 제13권11호
• /
• pp.1593-1597
• /
• 2000

In the quiescent state, cattle-manure slurry stratifies into three discernible layers, namely a floating scum layer, a bottom sludge layer and a watery middle layer. The proportions of top (scum), middle and bottom (sludge) layers were approximately 20, 60 and 20% respectively of the volume of the whole slurry. Particulate matter from the different stratified layers was characterised for particle size distribution and cellulose, hemicellulose and lignin composition. Total solids concentrations of top, middle and bottom layers were 12.7, 2.8 and 7.4% respectively. Larger particles were found in the top layer compared with the bottom. The top layer contained the highest amounts of Neutral Detergent Fibre (NDF), Acid Detergent Fibre (ADF), cellulose and hemicellulose, but the lowest amount of Total Kjeldahl Nitrogen (TKN). The bottom layer contained the highest amounts of Acid Detergent Lignin (ADL) and TKN. With increase in particle size, there were increases in NDF, ADF, cellulose and hemicellulose, accompanied by decreases in ADL and TKN. Biochemical methane potential of the three layers was also measured. The top layer was found to produce the most methane with the middle layer producing the least. Biomethanation rate from the top layer was also the highest. Differences in biomethanation rates and biochemical methane potential were attributed to differences in chemical composition of the particulate matter. About 48%, 23% and 30% of the total chemical oxygen demand (COD) in the top, middle and bottom layers respectively of the slurry was found to be degradable.