• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2001년도 추계학술대회 논문집
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• pp.213-219
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• 2001

In this paper, particle velocity of slurry flow, a kind of solid-particle two phase flow, was measured by using a particle tracking velocimetry. Particles are modeled by sphere-shaped glass whose diameters are 3mm, 5mm, and 7mm At first, a particle which is falling in the water is captured and analyzed to give their free falling velocity. The falling velocity was very high up to about 4m/sec in the air, which needs special algorithm for the accurate measurement. For the upwelling slurry flow in the straight duct, there are some noises caused by cavity. However, the effect was so small that it does not affect the measurement of large particles. From the preliminary study of applying the PTV to measurement of particle movement in slurry flow, we could find out the optimum value of parameters: threshold value., searching area radius and correlation area size.

• 한국분무공학회지
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• 제13권1호
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• pp.42-50
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• 2008

In the present work, atomization characteristics of shear-thinning liquid slurry discharging from fan spray nozzles were studied experimentally for spray painting applications. The effects of solid particle size and concentration on the properties (especially on the viscosity) of suspensions and mean drop size were examined by using model fluids. In the range of low particle concentration (below 3 wt%), the fluid viscosity was primarily determined by the particle size. On the other hand, in the range of high particle concentration (higher than 10 wt%), the agglomeration phenomenon and the oil absorption capability of solid particles played major roles in determining the fluid viscosity. In the high concentration region, which most of the paints belong to, the fluid became more viscous and the shear thinning behavior appeared more prominent as the particle concentration was increased. In this region, mean drop size(SMD) decreased more rapidly with the increase of the injection pressure. Also, SMD became larger with the higher particle concentration and the larger particle size.

• 대한기계학회논문집
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• 제16권5호
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• pp.974-982
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• 1992

본 연구에서는 Wheel 미립화기로 CWM을 분사시켰을때 Vane의 형태가 혼합연료 방울의 크기분포에 미치는 영향을 실험적으로 연구하는 것이며 그 연구 내용을 요약하 면 다음과 같다. .Vane의 형상계수(Aspect ratio)가 연료방울의 크기분포에 미치는 영향 .Vane의 각도가 연료방울의 크기분포에 미치는 영향 .미분탄 부하도와 연료방울의 SMD변화 .미분탄 분포의 평균크기변경에 따른 연료방울의 SMD변화 위에서 형상계수라함은 Vane의 출구직경(d)와 Vane의 출구길이 (L)의 비(L/d)를 의미 하고 있다.

• 멤브레인
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• 제13권2호
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• pp.88-100
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• 2003

테일러 와류흐름 여과에서 평균기공 1.2 ${\mu}m$인 셀룰로우스 에스테르 정밀막으로 이루어진 내부원통의 회전속도와 슬러리의 농도, 입자의 크기에 따른 여과선속의 변화를 실험을 통하여 알아보았다. 여과선속은 압력차에 비례하고 저항에 반비례하였으며, 시간에 따른 케이크 층의 저항 변화를 회전속도, 슬러리의 농도, 입자의 크기에 따라 검토하였다. 회전속도가 증가할수록 케이크 저항이 감소하고 짧은 시간에 준정상 상태에 도달하였다 슬러리의 농도를 증가시킬수록 초기 저항이 급격히 증가하였고 높은 저항값에서 준정상 상태가 유지되었으나, 준정상 상태에 도달하는 시간은 농도에 무관하였다. 입자 크기가 작을 때 저항이 크게 나타남을 관찰하였는데, 입자 크기가 작을수록 막 기공을 막을 확률이 더 높고 전단력에 의해 영향을 덜 받기 때문이라 생각할 수 있다. 본 연구에서 제안한 모델식은 입자의 퇴적과 제거항으로 나누어져 있는데, 실험상수의 평균값을 사용하여 실험결과와 잘 일치하였다.

• 분석과학
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• 제32권5호
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• pp.173-184
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• 2019

As the size of semiconductors becomes smaller, it is necessary to perform high precision polishing of nanoscale. Ceria, which is generally used as an abrasive, is widely used because of its uniform quality, but its stability is not high because it has a high molecular weight and causes agglomeration and rapid precipitation. Such agglomeration and precipitation causes scratches in the polishing process. Therefore, it is important to accurately analyze the size distribution of ceria particles. In this study, a study was conducted to select dispersants useful for preventing coagulation and sedimentation of ceria. First, a dispersant was synthesized and a ceria slurry was prepared. The defoamer selection experiment was performed in order to remove the air bubbles which may occur in the production of ceria slurry. Dynamic light scattering (DLS) and asymmetrical flow field-flow fractionation (AsFlFFF) were used to determine the size distribution of ceria particles in the slurry. AsFlFFF is a technique for separating nanoparticles based on sequential elution of samples as in chromatography, and is a useful technique for determining the particle size distribution of nanoparticle samples. AsFlFFF was able to confirm the presence of a little quantities of large particles in the vicinity of 300 nm, which DLS can not detect, besides the main distribution in the range of 60-80 nm. AsFlFFF showed better accuracy and precision than DLS for particle size analysis of a little quantities of large particles such as ceria slurry treated in this study.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1891-1894
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• 1999

We can classify the scratches after CMP process into micro-scratch and macro-scratches according to the scratch size, scratch intensity and defect map, etc. The micro-scratches on wafer after CMP process are discussed in this paper. From many causes, major factor that influences the formation of micro-scratch is known as particle size distribution of slurry.(1) It is indefinite what size or type of particle can cause micro-scratch on wafer surface, but there is possibility caused by large particle over 1um. The best way for controlling these large particle to inflow is to use the slurry filter on POU(Point of user). But the slurry filter(especially, depth-type filter) has sometimes the problem which makes more sever micro-scratches on wafer surface after CMP. We studied that depth-type slurry filter has what kind of week-points and the number of scratch could be reduced by lowering slurry flow rate and by using high spray bar which sprays DIW on polishing pad with high pressure.

• 한국주조공학회지
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• 제25권6호
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• pp.240-248
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• 2005

The rheocasting characteristics are strongly influenced by the microstructural morphology such as particle size, form factor and contiguity. In this study, the effect of structural morphology on fluid flow characteristics of A356 semi-solid alloy was investigated with a vacuum suction fluidity test. Semi-solid metal slurry was made by the mechanical stirring, the liquidus casting, and H-NCM to be analysed. H-NCM could obtain uniform and fine globular microstructures of 0.9 form factor and 55 ${\mu}m$ particle size. Inoculation was found to be effective for reducing particle size, however, for H-NCM it should be avoided due to the cause of increasing contiguity. The fluidity test indicated that the non-stirring method had higher fluidity and smaller liquid segregation in the same solid faction of 0.4 than the stirring method, for smaller particle size and higher form factor. It was observed that liquid segregation decreased as the particle size is smaller and form factor is higher. The results of die-casting experiment were a good agreement with those of fluidity test.

• Tribology and Lubricants
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• 제27권1호
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• pp.34-39
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• 2011

In this study, finite element analysis of particle-surface collision using 2-dimensional elements was performed to observe the effects of abrasive size and impact angle. The result of the simulation on the change in abrasive size revealed that larger abrasive particle induced larger contact stress due to force transfer through slurry fluid as the particle moved and pushed the fluid. This observation brought an important finding that the slurry fluid could make the workpiece surface soften and then change the mechanical properties of the surface layer such as elastic modulus and yield strength. As for the impact angle, it was found that the contact stress increased with the angle of impact and jumped up at a specific angle. Such result would be attributed to the complex effects of the impact velocity and angle.

• 한국세라믹학회지
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• 제44권2호
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• pp.98-102
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• 2007

The stability of slurry and removal rate during recycling of colloidal silica slurry was evaluated in silicon wafer polishing. The particle size distribution, pH, and zeta potential were measured to investigate the stability of colloidal silica. Large particles appeared as recycling time increased while average size of slurry did not change. Large particles were identified by EDS(energy dispersive spectrometer) as foreign substances from pad or abraded silicon flakes during polishing. As the recycling time increased, pH of slurry decreased and removal rate of silicon reduced but zeta potential decreased inversely. Hence, it could be mentioned that decrease of removal rate is related to consumption of $OH^-$ ions during recycling. Attention should be given to the control of pH of slurry during polishing.

• 대한기계학회논문집
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• 제14권5호
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• pp.1211-1221
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• 1990

본 연구에서는 CWM을 이류체 미립화기(twin-fluid atomizer)로 미립화 시켜 미립화에 크게 영향을 미치는 인자들로 믿어지는 공기분사압력, 부하도(loading), 미 분탄의 크기 그리고 CWM 방울 채집위치의 변화가 CWM 방울크기 분포와 CWM 방울안 미 분탄 존재유무에 미치는 영향을 연구의 목적으로 하였다.