• 한국세라믹학회지
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• 제49권6호
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• pp.542-548
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• 2012

The viscosity of a ceramic slurry depends on the slurry concentration, particle shape and size, hydrodynamic interactions, temperature, shear rate, pre-treatment condition and the method of measurement with the selected equipment. Representative ceramic slurries with low to high viscosity levels are selected from colloidal silica, barium titanate slurry and glass frit paste. Rotational rheometers and vibrational viscometers are used to compare the measured viscosity for various ceramic slurries. The rotational rheometer measured the viscosity according to the change of the shear rate or the rotational speed. On the other hand, the vibrational viscometer measured one point of the viscosity in a fixed vibrational mode. The rotational rheometer allows the measurement of the viscosity of a ceramic paste with a viscosity higher than 100,000 cP, while the vibrational viscometer provides an easy and quick method to measure the viscosity without deformation of the ceramic slurry due to the measurement method. It is necessary to select suitable equipment with which to measure the viscosity depending on the purpose of the measurement.

• 기술사
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• 제18권4호
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• pp.5-11
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• 1985

치즈의 기존제조공정상의 문제점을 조사정리하였고, 또 새로운 치즈의 숙성법으로 Cheese Slurry를 이용한 제조법을 시험하였다. Cheese Slurry는 제방, 제과에 좋은 영양의 보강과 풍미를 내는데 가장 적합한 재료로써 잠재력이 큰 것으로 판단되었다. 이 새로운 방법은 치즈의 재래식방법을 약간 변형시켜 적당한 Starter Culture을 이용함으로써 제품의 풍미향상과 제조기간 단축에 뚜렷한 효과를 확인하였다.

• 한국전기전자재료학회논문지
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• 제17권2호
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• pp.156-161
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• 2004

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2001년도 가을 학술발표회 논문집
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• pp.117-122
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• 2001

Recently, epoxy-coated re-bar used to the structure partly and put to practical use step, but not economical and appeared to the defect of deterioration of long term bond strength between concrete. The method for complement the defect of epoxy coated re-bar, study of polymer cement slurry coated re-bar started and basic properties appeared to excellent, but study of bond properties embedded in concrete specimens insufficient until now. This study attempts to examination of using possibility for bond strength of polymer cement slurry coated re-bar between concrete specimens compare to ACI Code and KS Code through pull-out test of 15cm$\times$15cm$\times$15cm specimens with polymer cement slurry coated re-bar as polymer cement ratio 50%, 100%, 150%, coating thickness 250${\mu}{\textrm}{m}$, 440${\mu}{\textrm}{m}$ and curing age. In the results of this study, the bond strength of polymer cement slurry coated re-bar compare to plain re-bar, epoxy coated re-bar decreased St/BA-modified polymer cement slurry coated re-bar, but bond strength of PA-modified polymer cement slurry coated re-bar appeared to excellent results. The bond properties of polymer cement slurry coated re-bar between concrete will be obtain more precise results according to compressive strength change of concrete and re-bar diameter size.

• Geomechanics and Engineering
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• 제13권2호
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• pp.319-331
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• 2017

This vacuum preloading combined with polyacrylamide (PAM) flocculation was proposed to separating solid-liquid in waste slurry and to improving bearing capacity of soft soil ground. By using waste slurry taken from drilled shaft construction site in Shanghai, China, a series of settling column tests with four typical flocculants and one normal for waste slurry were carried out for comparative analysis. The optimal amounts for each flocculant were obtained from the column tests. Then, model tests on vacuum preloading with anionic polyacrylamide (APAM) flocculation and without flocculants were carried out. The out of water and the settlement of slurry surface ground were monitored during the model tests, and the changes in water content, particle-size and pore-size distributions in different positions after the model tests were measured and discussed. It is found that water content of the waste slurry without APAM flocculation changed from 204 to 195% by 24 hours standing and 15 hours vacuum preloading, while the water content of the waste slurry with APAM flocculation was declined from 163 to 96% by 24 hours standing, and was further reduced into 37% by 136 hours vacuum preloading, which shows that the combined method is feasible and effective.

• 설비공학논문집
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• 제11권2호
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• pp.224-235
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• 1999

The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water, PF-5060, and paraffin slurry. The experimental parameters were coolants including Paraffin slurry with mass fraction of 2.5~7.5%, heat flux of 10~40W/$\textrm{cm}^2$ for the simulated VLSI chips and Reynolds numbers of 3,000~20,000. The size of paraffin slurry was constant as 10~40${\mu}{\textrm}{m}$ before and after the experiment. The chip surface temperatures for paraffin slurry were lower than those for water and PF-5060. The local heat transfer coefficients for the paraffin slurry were larger than those for water and the local heat transfer coefficients reached a row-number-independent and thermally-fully-developed value approximately after the third row. The local Nusselt numbers for paraffin slurry with a mass fraction of 7.5% were larger by 20~38% than those for water. The paraffin slurry with a mass fraction of 5% shelved the best thermal and hydrodynamic characteristics when local heat transfer and pressure drop were considered simultaneously.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.571-572
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• 2006

Tungsten CMP needs interconnect of semiconductor device ULSI chip and metal plug formation, CMP technology is essential indispensable method for local planarization. This Slurry development also for tungsten CMP is important, slurry of metal wiring material that is used present is depending real condition abroad. It is target that this research makes slurry of efficiency that overmatch slurry that is such than existing because focus and use colloidal silica by abrasive particle to internal production technology development. Compared selectivity of slurry that is developed with competitor slurry using 8" tungsten wafer and 8" oxide wafer in this experiment. And removal rate measures about density change of $H_2O_2$ and Fe particle. Also, corrosion potential and current density measure about Fe ion and Fe particle. As a result, selectivity find 83:1, and expressed similar removal rate and corrosion potential and current density value comparing with competitor slurry.

• 설비공학논문집
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• 제19권8호
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• pp.599-606
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• 2007

An experimental study was performed to measure a ice concentration of ice slurry flowing in a pipe in a real time. In the present paper, we suggested a measuring method by a refractive index and compared it to other methods by a freezing point and a density. To measure the refractive index of the solution, ice particles in the ice slurry should be completely removed and a hydro-cyclone was introduced instead of a mesh. The measuring method through the refractive index coincided with the density method using the real-time solution density within ${\pm}5%$ error range, having the error range less than the other two methods. In the other hand, the measuring method through the density has a good resolution, but the result using the initial density of the solution was different more than 10% error from that using the real-time density. And it has an error range 1.5 times greater than the method through the refractive index.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.434-437
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• 2005

Chemical Mechanical Polishing (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. In general, CMP is a surface planarization method in which a silicon wafer is rotated against a polishing pad in the presence of slurry under pressure. The polishing pad, generally a polyurethane-based material, consists of polymeric foam cell walls, which aid in removal of the reaction products at the wafer interface. It has been found that the material removal rate of any polishing pad decreases due to the so-called 'pad glazing' after several wafer lots have been processed. Therefore, the pad restoration and conditioning has become essential in CMP processes to keep the urethane polishing pad at the proper friction coefficient and to allow effective slurry transport to the wafer surface. Diamond pad conditioner employs a single layer of brazed bonded diamond crystals. Due to the corrosive nature of the polishing slurry required in low pH metal CMP such as copper, it is essential to minimize the possibility of chemical interaction between very low pH slurry (pH <2) and the bond alloy. In this paper, we report an exceptional protective coated conditioner for in-situ pad conditioning in low pH Cu CMP process. The protective Cr-coated conditioner has been tested in slurry with pH levels as low as 1.5 without bond degradation.

• 한국세라믹학회지
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• 제52권1호
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• pp.13-18
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• 2015

The fabrication method used for mineral hydrate is similar to that of ALC (autoclaved lightweight concrete), but the fabrication of normal slurry with a considerable amount of a foaming agent is difficult due to material separation and collapse of the slurry. Therefore, the development of fabrication methods for normal slurry is necessary. The final product, mineral hydrate insulation, has excellent thermal properties but poor strength characteristic given the many pores. In this study, in order to fabricate normal slurry, the viscosity and foaming time of the slurry were controlled. The mixing ratio of the starting material and the polypropylene fiber was controlled to improve the strength. Mineral hydrate with polypropylene fiber showed a higher strength than that without this type of fiber. Specifically, the compressive strength of mineral hydrate with 2% polypropylene fiber added to it was more than 40% higher than that without the fiber.