• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.571-572
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• 2006

Tungsten CMP needs interconnect of semiconductor device ULSI chip and metal plug formation, CMP technology is essential indispensable method for local planarization. This Slurry development also for tungsten CMP is important, slurry of metal wiring material that is used present is depending real condition abroad. It is target that this research makes slurry of efficiency that overmatch slurry that is such than existing because focus and use colloidal silica by abrasive particle to internal production technology development. Compared selectivity of slurry that is developed with competitor slurry using 8" tungsten wafer and 8" oxide wafer in this experiment. And removal rate measures about density change of $H_2O_2$ and Fe particle. Also, corrosion potential and current density measure about Fe ion and Fe particle. As a result, selectivity find 83:1, and expressed similar removal rate and corrosion potential and current density value comparing with competitor slurry.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 제35회 춘계학술대회
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• pp.272-278
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• 2002

Recently, STI(Shallow Trench Isolation) process has attracted attention for high density of semiconductor device as a essential isolation technology. In this paper, the effect of pattern density, trench width and selectivity of slurry on dishing in STI CMP process was investigated by using specially designed isolation pattern. As trench width increased, the dishing tends to increase. At $20{\mu}m$ pattern size, the dishing was decreased with increasing pattern density Low selectivity slurry shows less dishing at over $160{\mu}m$ trench width, whereas high selectivity slurry shows less dishing at below $160{\mu}m$ trench width.

• Journal of Advanced Marine Engineering and Technology
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• 제28권6호
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• pp.962-971
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• 2004

This paper has dealt with thermo-physical properties of microencapsulated phase change material slurry as a latent heat storage material having a low melting point. The measured results of the thermo-physical properties of the test microencapsulated phase change material slurry, those are, density, specific heat, thermal conductivity and viscosity, were discussed for the temperature region of solid and liquid phases of the dispersion material (paraffin). The measurements of these properties of microencapsulated phase change material slurry have been carried out by using a specific-gravity meter, a water calorimeter, a differential scanning calorimeter(DSC), a transient hot wire method and rotating type viscometer, respectively. It was clarified that the additional properties law could be applied to the estimation of the density and specific heat of microencapsulated phase change material slurry and also the Euckens equation could be applied to the estimation of the thermal conductivity of this slurry.

• 설비공학논문집
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• 제19권8호
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• pp.599-606
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• 2007

An experimental study was performed to measure a ice concentration of ice slurry flowing in a pipe in a real time. In the present paper, we suggested a measuring method by a refractive index and compared it to other methods by a freezing point and a density. To measure the refractive index of the solution, ice particles in the ice slurry should be completely removed and a hydro-cyclone was introduced instead of a mesh. The measuring method through the refractive index coincided with the density method using the real-time solution density within ${\pm}5%$ error range, having the error range less than the other two methods. In the other hand, the measuring method through the density has a good resolution, but the result using the initial density of the solution was different more than 10% error from that using the real-time density. And it has an error range 1.5 times greater than the method through the refractive index.

• 설비공학논문집
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• 제12권9호
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• pp.860-869
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• 2000

The thermal conductivity and density of slurries entrained with the particles of Micro-PCM are measured with respect to its temperatures as well as concentrations. For the thermal conductivity of slurries, a device made from P.A. Hilton (Model No. H470) is adopted. There is a well-scaled 0.3 mm gap between shells into which the slurry is injected. The temperatures of the slurry are changed to $5~25^{\circ}C$ , for which it is controled by the supplied voltage and cooling water circulated around the outer shell. The concentrations of Micro-PCM slurries are varied from 5 wt% to 50 wt%. Some general equations such as Maxwell's equation, are evaluated for their applicability with Micro-PCM slurry. As a result, it happens to be some 20% discrepancy between the experiment and the applied equations. The density measurements of Micro-PCM slurry to its temperature and concentration are peformed by hydrometer. For the experiment, tetradecane encapsulated slurry (($t_m≒6^{\circ}C$) and a mixed wax ($t_m≒50^{\circ}C$) are tested. The temperature changes of tetradecane are applied for $0^{\circ}C\;to\;$20^{\circ}C$and a mixed wax for $20^{\circ}C\;to\;$60^{\circ}C$ and its concentrations are changed from 5 wt% to 30 wt%. The results are compared with a general equation and the referenced data. For the conclusion, the experimental result and a general equation are well agreed.

• Transactions on Electrical and Electronic Materials
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• 제7권4호
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• pp.163-166
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• 2006

The dishing and the erosion were evaluated on the tungsten CMP process with conventional and new developed slurry. The tungsten thin film was polished by orbital polishing equipment. Commercial pattern wafer was used for the evaluation. Both slurries were pre tested on the oxide region on the wafer surface and the removal rate was not different very much. At the pattern density examination, the erosion performance was increased at all processing condition due to the reduction of thickness loss in new slurry. However, the dishing thickness was not remarkably changed at high pattern density despite of the improvement at low pattern density. At the large pad area, the reduction of dishing thickness was clearly found at new tungsten slurry.

• Tribology and Lubricants
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• 제34권6호
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• pp.226-234
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• 2018

Copper chemical mechanical planarization (CMP) has become a key process in integrated circuit (IC) technology. The results of copper CMP depend not only on the mechanical abrasion, but also on the slurry chemistry. The slurry used for Cu CMP is known to have greater chemical reactivity than mechanical material removal. The Cu CMP slurry is composed of abrasive particles, an oxidizing agent, a complexing agent, and a corrosion inhibitor. Citric acid can be used as the complexing agent in Cu CMP slurries, and is widely used for post-CMP cleaning. Although many studies have investigated the effect of citric acid on Cu CMP, no studies have yet been conducted on the interfacial friction characteristics and step height reduction in CMP patterns. In this study, the effect of citric acid on the friction characteristics and step height reduction in a copper wafer with varying pattern densities during CMP are investigated. The prepared slurry consists of citric acid ($C_6H_8O_7$), hydrogen peroxide ($H_2O_2$), and colloidal silica. The friction force is found to depend on the concentration of citric acid in the copper CMP slurry. The step heights of the patterns decrease rapidly with decreasing citric acid concentration in the copper CMP slurry. The step height of the copper pattern decreases more slowly in high-density regions than in low-density regions.

• 한국세라믹학회지
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• 제36권9호
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• pp.954-964
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• 1999

The effect of fabrication variables and microstructures on the compressive strength of open cell alumina zirconia and silicon nitride ceramics fabricated by polymeric sponge method was investigated. Bulk density and compressive strength of open cell ceramics were mainly affected by coating characteristics of ceramic slurry on polymeric sponge that controlled a shape thickness and defect of the struts. Sintering temperature was optimized for enhancement of strut strength and compressive strength of open cell ceramics. Relative density and compressive strength behaviors were relatively well matched with the predicted values. Open cell ceramics of lower relative density below 0.1 prepared by first relatively well matched with the predicted values. Open cell ceramics of lower relative density below 0.1 prepared by first coating of ceramic slurry had thin triangular prismatic struts that were often broken or longitudinally cracked. With an application of second coating of slurry shape of struts was transformed into thickner cylindrical one and defects in struts were healed but the relative density increased over 0.2 Open cell zirconia had both the highest bulk density and compressive strength and alumina had the lowest compressive strength while silicon nitrides showed relatively high compressive strength and the lowest density. Based upon the analysis open cell silicon nitride was expected to be one of potential structural ceramics with light weight.

• Journal of Advanced Marine Engineering and Technology
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• 제39권8호
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• pp.807-812
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• 2015

A microcapsule water slurry is a latent heat-storage material having a low melting point. In this study, the thermal properties of a microcapsule water slurry are measured. The physical properties of the test microcapsule water slurry, i.e., thermal conductivity, specific heat, latent heat, and density, are measured, and the results are discussed for the temperature region of solid and liquid phases of the dispersion material (paraffin). It is clarified that Eucken's equation can be applied to the estimation of the thermal conductivity of the microcapsule water slurry. Useful correlation equations of the thermal properties of the microcapsule water slurry are proposed in terms of the temperature and concentration ratio of the microcapsule water slurry constituents.

• 한국세라믹학회지
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• 제50권6호
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• pp.528-532
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• 2013

Well-dispersed slurries of submicron-sized alumina powders were pressure-infiltrated in 3D preforms of mullite fibers and the effects of the particle size and infiltration pressure on the particle packing characteristics were investigated. Infiltration without pressure showed that the packing density increased as the particle size decreased due to the reduction of the friction between the particles and the fibers. The infiltrated preforms contained large pores in the large voids between the fiber tows and small pores in the narrow voids between the individual fibers. Pressure infiltration resulted in a packing density of 77% regardless of the particle size or the infiltration pressure(210 ~ 620 kPa). Pressure infiltration shortened the infiltration time and eliminated the large pores in preforms infiltrated with the slurries of smaller particles. The slurry pressure-infiltration process is thus an efficient method for the packing of matrix materials in various preforms.