• 청정기술
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• 제7권1호
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• pp.27-34
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• 2001

CMP공정에서 발생되는 slurry는 다량의 입자성 물질과 중금속을 함유하고 있다. 이 폐 slurry는 응집성과 침강성에 문제가 있어 처리에 어려움이 있다. 따라서, 본 연구에서는 PACI과 Alum을 이용한 Jar-tester를 통하여 용수 재활용을 위한 최적 응집 조건을 도출하고자 하였다. 고형물 함량이 0.1wt%의 경우 PACI을 응집제로 사용할 때 최적 응집 조건은 pH 4 부터 6에서 투여량은 20~50 mg/L 였으며, 0.5 wt%의 경우 pH 4와 5에서 응집제 투여량은 50~100 mg/L였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.63-63
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• 2003

The nanotopography of silicon wafers has emerged as an important factor in the STI process since it affects the post-CMP thickness deviation (OTD) of dielectric films. Ceria slurry with surfactant is widely applied to STI-CMP as it offers high oxide-to-nitride removal selectivity. Aiming to control the nanotopography impact through ceria slurry characteristics, we examhed the effect of surfactant concentration and abrasive size on the nanotopography impact. The ceria slurries for this study were produced with cerium carbonate as the starting material. Four kinds of slurry with different size of abrasives were prepared through a mechanical treatment The averaged abrasive size for each slurry varied from 70 nm to 290 nm. An anionic organic surfactant was added with the concentration from 0 to 0.8 wt %. We prepared commercial 8 inch silicon wafers. Oxide Shu were deposited using the plasma-enhanced tetra-ethyl-ortho-silicate (PETEOS) method, The films on wafers were polished on a Strasbaugh 6EC. Film thickness before and after CMP was measured with a spectroscopic ellipsometer, ES4G (SOPRA). The nanotopogrphy height of the wafer was measured with an optical interferometer, NanoMapper (ADE Phase Shift)

• 한국축산시설환경학회지
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• 제4권2호
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• pp.137-147
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• 1998

This study was carried out to find deodorization effect of swine-slurry by addition of phototrophic bacteria(PTB). The pilot-scale reactors operation conditions was designed by the inoculum amounts of PTB and light-conditions. Treatment conditions was divided into 3 types; 106 MPN/ml$.$Dark(T-1), 108 MPN/ml$.$Dark(T-2), 108 MPN/ml$.$Natural light(T-3). The changes of the concentration of volatile fatty acids(VFAs), hydrogen sulfide(H2S), ammonia (NH3) and odor intensity were analyzed during the treatment period(35 days). From results of this study, the maximum intensity of odor in the headspace of the reactor T-1 was 4.82 and T-2, T-3 was 2.63, respectively. In swine-slurry of reactors used, it almost took 10 days until to be stabilized with solid and liquid phase. Intensity of odor in headspace was mainly derived from the liquid phase. The PTB inoculum method to swine-slurry was very effective in reduction of VFAs, H2S and Sulfate-reducing bacteria(SRB) concentration. Expecially, It was interested in reverse growth behaviour of SRB and PTB in these conditions.

• 설비공학논문집
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• 제11권4호
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• pp.549-559
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• 1999

An experimental study was peformed to measure the viscosity of microencapsulated PCM slurries as the functions of its concentration and temperature, and also influence to its fluid dynamics. For the viscosity measurement, a rotary type viscometer, which was equipped with temperature control system, was adopted. The slurry was mixed with water and Sodium Lauryl Sulphate as a surfactant by which its suspended particles were dispersed well without the segregation of particles during the experiment. The viscosity was increased as the concentration of MicroPCM particle added. The surfactant increased 5% of the viscosity over the working fluid without particles. Experiments were proceeded by changing parameters such as PCM particles'concentration as well as the temperature of working fluid. As a result, a model to the functions of temperature for the working fluid and its particle concentration is proposed. The proposed model, for which its standard deviation shows 0.8068, is agreed well with the reference's data. The pressure drop was measured by U-tube manometer, and then the friction factor was obtained. It was noted that the pressure drop was not influenced by the state of PCM phase, that is solid or liquid in its core materials at their same concentration. On the other hand, it was described that the pressure drop of the slurry was much increased over the working fluid without particles. A friction factor was placed on a straight line in all working fluids of the laminar flow regardless of existing particles as we expected.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 추계학술발표대회
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• pp.24.2-24.2
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• 2011

Ru is used as a bottom electrode capacitor in dynamic random access memories (DRAMs) and ferroelectric random access memories (FRAMs). The surface of the Ru needs to be planarized which is usually done by chemical mechanical polishing (CMP). Ru CMP process requires chemical slurry consisting of abrasive particles and oxidizer. A slurry containing NaIO4 and alumina particles is already proposed for Ru CMP process. However, the stability of the slurry is critical in the CMP process since if the particles in the slurry get agglomerated it would leave scratches on the surface being planarized. Thus, in the present work, the stability behavior of the slurry using a suitable anionic polyelectrolyte is investigated. The parameters such as slurry pH, polyelectrolyte concentration, adsorption time and the sequence of addition of chemicals are optimized. The results show that the slurry is stable for longer time at an optimized condition. The polishing behavior of the Ru using the optimized slurry is also investigated.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.546-546
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• 2008

Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.

• 멤브레인
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• 제13권2호
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• pp.88-100
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• 2003

테일러 와류흐름 여과에서 평균기공 1.2 ${\mu}m$인 셀룰로우스 에스테르 정밀막으로 이루어진 내부원통의 회전속도와 슬러리의 농도, 입자의 크기에 따른 여과선속의 변화를 실험을 통하여 알아보았다. 여과선속은 압력차에 비례하고 저항에 반비례하였으며, 시간에 따른 케이크 층의 저항 변화를 회전속도, 슬러리의 농도, 입자의 크기에 따라 검토하였다. 회전속도가 증가할수록 케이크 저항이 감소하고 짧은 시간에 준정상 상태에 도달하였다 슬러리의 농도를 증가시킬수록 초기 저항이 급격히 증가하였고 높은 저항값에서 준정상 상태가 유지되었으나, 준정상 상태에 도달하는 시간은 농도에 무관하였다. 입자 크기가 작을 때 저항이 크게 나타남을 관찰하였는데, 입자 크기가 작을수록 막 기공을 막을 확률이 더 높고 전단력에 의해 영향을 덜 받기 때문이라 생각할 수 있다. 본 연구에서 제안한 모델식은 입자의 퇴적과 제거항으로 나누어져 있는데, 실험상수의 평균값을 사용하여 실험결과와 잘 일치하였다.

• Journal of Advanced Marine Engineering and Technology
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• 제39권4호
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• pp.456-462
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• 2015

본 연구는 토네이도와 축류펌프의 원리를 적용하여 마중물 없이 슬러리를 송출할 수 있는 새로운 펌프기술 개발을 목적으로 한다. 개발한 로터형 슬러리 펌프는 전동모터, 구동축 및 커플링, 로터, 임펠러 그리고 흡입 및 송출관으로 구성된다. 청수를 이용한 성능실험에서는 로터의 설계조건에 따른 송출량, 소비 전력량 그리고 흡입관 부압특성에 대해 모터의 회전수를 변수로 검증하였으며, 시멘트를 이용하여 제조한 슬러리의 고형물 농도에 따른 송출량 특성에 대한 검증연구를 수행하였다. 로터의 직경과 높이가 커지면 송출량과 소비되는 전력량은 증가하지만 흡입관 부압은 감소하였으며, 송출량과 부압에 미치는 로터 두께의 영향은 거의 나타나지 않았다. 개발지표로 제시하였던 18 % 이상의 고형물 농도에서도 슬러리의 송출이 가능함을 확인하였다.

• 설비공학논문집
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• 제18권6호
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• pp.518-525
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• 2006

The present experiments have been performed for obtaining the melting heat transfer characteristics of micro-encapsulated solid-liquid phase-change material and water mixture slurry flow in a circular tube heated with constant wall heat flux. The phase change material having a low melting point was selected for a domestic cooling system in the present study. The governing parameters were found to be latent heat material concentration, heat flux, and the slurry velocity. The experimental results revealed that the increase of tube wall temperature of latent microcapsule slurry was lower than that of water caused by the heat absorption of fusion.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2005년도 동계학술발표대회 논문집
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• pp.193-198
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• 2005

The present experiments have been performed for obtaining the melting heat transfer characteristics of micro-encapsulated solid-liquid phase change material and water mixed slurry flow in a circular tube heated with constant wall heat flux. The phase change material having a low melting point was selected for a domestic cooling system in the present study. The governing parameters were found to be latent heat material concentration, heat flux, and the slurry velocity. The experimental results revealed that the increase of tube wall temperature of latent microcapsule slurry was lower than that of water caused by the heat absorption of fusion.