• Title/Summary/Keyword: Slip Velocity Rate

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Braking Distance Estimation using Frictional Energy Rate (마찰에너지율을 이용한 타이어 제동거리 예측)

  • Jeon, Do-Hyung;Choi, Joo-Hyung;Cho, Jin-Rae;Kim, Gi-Jeon;Woo, Jong-Shik
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.519-524
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    • 2004
  • This study is concerned with the braking distance estimation using frictional energy rate. First, steady state rolling analysis is performed, and using this result, the braking distance is estimated. Dynamic rolling analysis during entire braking time period is impratical, so that this study divides the vehicle velocity by 10km/h to reduce the analysis time. The multiplication of the slip rate and the shear stress provides the frictional energy rate. Using frictional energy rate, total braking distance is estimated, In addition, ABS(Anti-lock Brake System) is considered, and two type of slip ratios are compared, One is 15% slip ratio for the ABS condition, and the other is 100% slip ratio which leads lo the almost same braking distance as the elementary kinematic theory. A slip ratio is controlled by angular velocity in ABAQUS/Explicit, A 15% slip ratio gives the real vehicle's braking distance when the frictional energy occurred al disk pad is included. Disk pad's frictional energy rate is calculated by the theoretical approach.

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EFFECT OF ASPECT RATIO ON SLIP FLOW IN RECTANGULAR MICROCHANNELS

  • Islam, Md.Tajul;Lee, Yeon-Won
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.2803-2810
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    • 2007
  • Three dimensional numerical studies were carried out to investigate the effect of aspect ratio on gas slip flow in rectangular microchannels. We focused on aspect ratio effect on slip velocity, pressure distribution and mass flow rate. As aspect ratio decreases the wall slip velocity also decreases. As a result nonlinearity of pressure distribution increases. The slip velocities on sides and top/bottom walls are different and this difference decreases with increasing aspect ratio. These two velocities are equal when aspect ratio is 1. The ratios of slip mass flow rate over noslip mass flow rate increases with increasing aspect ratios.

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Holdup and Flow Behavior of Fluidized Solid Particles in a Liquid-Solid Circulating Fluidized Bed

  • Lim, Dae Ho;Lim, Ho;Jin, Hae Ryong;Kang, Yong
    • Korean Chemical Engineering Research
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    • v.52 no.3
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    • pp.371-377
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    • 2014
  • Characteristics of holdup and flow behavior of fluidized solid particles were investigated in a liquid-solid circulating fluidized bed ($0.102m{\times}3.5m$). Effects of liquid velocity ($U_L$), particle size ($d_P$) and solid circulation rate ($G_S$) on the solid holdup, overall particle rising velocity, slip velocity between liquid and particles and hydrodynamic energy dissipation rate in the riser were examined. The particle holdup increased with increasing $d_P$ or $G_S$ but decreased with increasing $U_L$. The overall particle rising velocity increased with increasing $U_L$ or $G_S$ but decreased with increasing $d_P$. The slip velocity increased with increasing $U_L$ or $d_P$ but did not change considerably with $G_S$. The energy dissipation rate, which was found to be closely related to the contacting frequency of micro eddies, increased with increasing $d_P$, $G_S$ or $U_L$. The solid particle holdup was well correlated with operating variables such as $U_L$, $d_P$ and $G_S$.

Development of Analysis Program for Multi-Pass Wet Wire Drawing Process and Its Application (습식 다단 인발공정 해석 프로그램 개발 밀 적용)

  • 이상곤;김민안;김병민;조형호
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.9
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    • pp.126-134
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    • 2003
  • This paper investigates the multi-pass wet wire drawing process considering the slip between the wire and the capstan. The production of fine wire through multi-pass wet wire drawing process would be impossible without backtension. The backtension is affected by many process parameters, such as slip, dies reduction, coiling number of wire at the capstan, machine reduction, characteristic of lubricant etc. Up to date, die design and dies pass schedule of multi-pass wet wire drawing process have been performed by trial and error of expert in the industrial field. In this study, an analysis program which can perform the analysis and considering the effect of slip at each capstan was developed. The effects of many important parameters (drawing force, backtension force, needed power, slip rate, slip velocity rate etc.) on multi-pass wet wire drawing process can be predicted by this developed program. It is possible to obtain the important basic data which can be used in the pass schedule of multi-pass wet wire drawing process by using this developed program.

Processing parallel-disk viscometry data in the presence of wall slip

  • Leong, Yee-Kwong;Campbell, Graeme R.;Yeow, Y. Leong;Withers, John W.
    • Korea-Australia Rheology Journal
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    • v.20 no.2
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    • pp.51-58
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    • 2008
  • This paper describes a two-step Tikhonov regularization procedure for converting the steady shear data generated by parallel-disk viscometers, in the presence of wall slip, into a shear stress-shear rate function and a wall shear stress-slip velocity functions. If the material under test has a yield stress or a critical wall shear stress below which no slip is observed the method will also provide an estimate of these stresses. Amplification of measurement noise is kept under control by the introduction of two separate regularization parameters and Generalized Cross Validation is used to guide the selection of these parameters. The performance of this procedure is demonstrated by applying it to the parallel disk data of an oil-in-water emulsion, of a foam and of a mayonnaise.

DUFOUR AND HEAT SOURCE EFFECTS ON RADIATIVE MHD SLIP FLOW OF A VISCOUS FLUID IN A PARALLEL POROUS PLATE CHANNEL IN PRESENCE OF CHEMICAL REACTION

  • VENKATESWARLU, M.;BABU, R. VASU;SHAW, S.K. MOHIDDIN
    • Journal of the Korean Society for Industrial and Applied Mathematics
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    • v.21 no.4
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    • pp.245-275
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    • 2017
  • The present investigation deals, Dufour and heat source effects on radiative MHD slip flow of a viscous fluid in a parallel porous plate channel in presence of chemical reaction. The non-linear coupled partial differential equations are solved by using two term perturbation technique subject to physically appropriate boundary conditions. The numerical values of the fluid velocity, temperature and concentration are displayed graphically whereas those of shear stress, rate of heat transfer and rate of mass transfer at the plate are presented in tabular form for various values of pertinent flow parameters. By increasing the slip parameter at the cold wall the velocity increases whereas the effect is totally reversed in the case of shear stress at the cold wall. It is observed that the effect of Dufour and heat source parameters decreases the velocity and temperature profiles.

Three-Dimensional Flow Analysis and Improvement of Slip Factor Model for Forward-Curved Blades Centrifugal Fan

  • Guo, En-Min;Kim, Kwang-Yong
    • Journal of Mechanical Science and Technology
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    • v.18 no.2
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    • pp.302-312
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    • 2004
  • This work developed improved slip factor model and correction method to predict flow through impeller in forward-curved centrifugal fan. Both steady and unsteady three-dimensional CFD analyses were performed to validate the slip factor model and the correction method. The results show that the improved slip factor model presented in this paper could provide more accurate predictions for forward-curved centrifugal impeller than the other slip factor models since the present model takes into account the effect of blade curvature. The correction method is provided to predict mass-averaged absolute circumferential velocity at the exit of impeller by taking account of blockage effects induced by the large-scale backflow near the front plate and flow separation within blade passage. The comparison with CFD results also shows that the improved slip factor model coupled with the present correction method provides accurate predictions for mass-averaged absolute circumferential velocity at the exit of impeller near and above the flow rate of peak total pressure coefficient.

Microflow of dilute colloidal suspension in narrow channel of microfluidic-chip under Newtonian fluid slip condition

  • Chun Myung-Suk;Lee Tae Seok;Lee Kangtaek
    • Korea-Australia Rheology Journal
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    • v.17 no.4
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    • pp.207-215
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    • 2005
  • We present a finite difference solution for electrokinetic flow in rectangular microchannels encompassing Navier's fluid slip phenomena. The externally applied body force originated from between the nonlinear Poisson-Boltzmann field around the channel wall and the flow-induced electric field is employed in the equation of motion. The basic principle of net current conservation is applied in the ion transport. The effects of the slip length and the long-range repulsion upon the velocity profile are examined in conjunction with the friction factor. It is evident that the fluid slip counteracts the effect by the electric double layer and induces a larger flow rate. Particle streak imaging by fluorescent microscope and the data processing method developed ourselves are applied to straight channel designed to allow for flow visualization of dilute latex colloids underlying the condition of simple fluid. The reliability of the velocity profile determined by the flow imaging is justified by comparing with the finite difference solution. We recognized the behavior of fluid slip in velocity profiles at the hydrophobic surface of polydimethylsiloxane wall, from which the slip length was evaluated for different conditions.

Analysis of Multi-Pass Wet Wire Drawing Process and Its Application (다단 습식 신선공정 해석 및 적용)

  • Lee S. K.;Kim B. M.
    • Transactions of Materials Processing
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    • v.14 no.8 s.80
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    • pp.689-695
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    • 2005
  • Multi-pass wet wire drawing process is used to produce fine wire in the industrial field. The production of fine wire through multi-pass wet wire drawing process with appropriate dies pass schedule would be impossible without understanding the relationship among many process parameters such as material properties, dies reduction, friction conditions, drawing speed etc However, in the industrial field, dies pass schedule of multi-pass wet wire drawing process has been executed by trial and error of experts. This study investigated the relationship among many process parameters quantitatively to obtain the important process information fur the appropriate pass schedule of multi-pass wet wire drawing process. Therefore, it is possible to predict the many important process parameters of multi-pass wet wire drawing process such as dies reduction, machine reduction, drawing force, backtension force, slip rate, slip velocity rate, power etc. The validity of the analyzed drawing force was verified by FE simulation and multi-pass wet wire drawing experiment. Also, pass redesign was performed based on the analyzed results, and the wire breakage between the original pass schedule and the redesigned pass schedule was compared through experiment.

Basal slip (0001)1/3 <1120> dislocation in sapphire ($\alpha$-$Al_2$$O_3$) single crystals Part I: Dislocation velocity (사파이어($\alpha$-$Al_2$$O_3$) 단결정에 있어 basal slip (0001)1/3<1120>전위 Part I : 전위속도)

  • Yoon, Seog-Young;Lee, Jong-Young
    • Korean Journal of Materials Research
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    • v.11 no.3
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    • pp.221-226
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    • 2001
  • The basal slip (0001)1/3<1120 > dislocation velocity in sapphire ($\alpha$-$Al_2$$O_3$) single crystals was measured by four-point bending test. The bending experiment was carried out in the temperature range from 120$0^{\circ}C$ to $1400^{\circ}C$ at various engineering stresses 90MPa, 120MPa, and 150MPa. The velocity of such dislocations was estimated from the bending displacement rate of the four-point bend sample. The dependence of temperature and stress in dislocation velocity was investigated. The activation energy for dislocation velocity was determined to be about 2.2$\pm$0.4eV. In addition, the stress exponent (m) describing the stress dependence of dislocation velocities was in the range of 2.0$\pm$0.2.

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