• Title/Summary/Keyword: Size Inspection

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A Study on the Fluctuations in Quality of Incoming Materials and Determination of the Acceptance Inspection Type with Inspection Error (검사과오를 고려한 자재의 품질변동과 수입검사방법의 결정)

  • Lee, Hoe-Sik
    • Journal of Korean Society for Quality Management
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    • v.24 no.2
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    • pp.54-64
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    • 1996
  • The inspection policy and inspection error are very critical factors which influence the outgoing quality. In other words, such factors influence the acceptance rate of the incoming matarials. Hence, the outgoing lot size is varied. This paper presents a method to compute the break-even point(pb1, pb2) under these two factors, which canbe used to determine the economic acceptance inspection type.

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Automatic Focusing Vision System for Inspection of Size and Shape of Small Hole (소형(1mm이하) hole의 형태 및 크기 측정을 위한 자동초점 비젼검사기)

  • Han, Moon-Yong;Han, Hern-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.10
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    • pp.80-86
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    • 1999
  • Since the quality of the coated wires is in various applications dependant on the coating depth, accuracy of hole size of dies used for coating wires must be maintained precisely, in general within one micron. This paper proposes a new vision system which measures automatically the size and shape of small holes having diameters less than 1mm within an error limit of 1 micron. To quickly obtain the focused image, this paper proposes an estimation method of the camera position using only a couple of defocused hole images. It measures the distributions of light intensity around the image boundary and decides the direction and distance of a camera motion. The proposed system measures the size, shape distortion, inclination of the hole against the axis of the dies structure, to decides the acceptability of the dies for use. The proposed algorithm has been implemented using a cheap 640${\times}$480 image system and has shown an average size error of 1micron when measuring the dieses having 0.1mm to 1.0mm diameters. It can be applied to the inspection of the size and position of holes in PCB, too.

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Estimation of the Number of Physical Flaws Using Effective POD (유효 POD를 이용한 물리적 결함 수의 추정)

  • Lee, Jae-Bong;Park, Jae-Hak;Kim, Hong-Deok;Chung, Han-Sub
    • Journal of the Korean Society of Safety
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    • v.21 no.4 s.76
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    • pp.42-48
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    • 2006
  • The strategies of maintenance and operation are usually established based on the number of flaws and their size distribution obtained from nondestructive inspection in order to preserve safety of the plant. But non destructive inspection results are different from the physical flaws which really exist in the equipments. In case of a single inspection, it is easy to estimate the number of physical flaws using the POD curve. However, we may be faced with some difficulties in obtaining the number of physical flaws from the periodic in-service non destructive inspection data. In this study a simple method for estimating the number of physical flaws from periodic in-service nondestructive inspection data was proposed. In order to obtain the flaw growth history, the flaw growth was simulated using the Monte Carlo method and the flaw size and the corresponding POD value were obtained for each flaw at each periodic inspection time. The flaw growth rate used in the simulation was statistically calculated from the in-service inspection data. By repeating the simulation numerous flaw growth data could be generated and the effective POD curve was obtained as a function of flaw size. From the effective POD curve the number of physical flaws was obtained. The usefulness and convenience of the proposed method was evaluated from several applications and satisfactory results were obtained.

Object Dimension Estimation for Remote Visual Inspection in Borescope Systems

  • Kim, Hyun-Sik;Park, Yong-Suk
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.13 no.8
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    • pp.4160-4173
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    • 2019
  • Borescopes facilitate the inspection of areas inside machines and systems that are not directly accessible for visual inspection. They offer real-time, up-close access to confined and hard-to-access spaces without having to dismantle or destructure the object under inspection. Borescopes are ideal instruments for routine maintenance, quality inspection and monitoring of systems and structures. The main application being fault or defect detection, it is useful to have measuring capability to quantify object dimensions in a target area. High-end borescopes use multi-optic solutions to provide measurement information of viewed objects. Multi-optic solutions can provide accurate measurements at the expense of structural complexity and cost increase. Measuring functionality is often unavailable in low-end, single camera borescopes. In this paper, a single camera measurement solution that enables the size estimation of viewed objects is proposed. The proposed solution computes and overlays a scaled grid of known spacing value over the screen view, enabling the human inspector to estimate the size of the objects in view. The proposed method provides a simple means of measurement that is applicable to low-end borescopes with no built-in measurement capability.

Deep Learning-based X-ray Inspection for Battery Defect Detection (배터리 불량 검출을 위한 딥러닝 기반 X-ray 검사)

  • Daejin Jeong;Heon Huh
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.24 no.2
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    • pp.147-153
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    • 2024
  • X-rays are extensively employed for non-destructive inspection, applied to packaged food, human anatomy, and industrial products. Recently, this technology has extended to inspecting batteries in electric vehicles. Given the challenge of manual inspection for a substantial volume of batteries, deep learning is leveraged to detect battery defects. However, the effectiveness of deep learning heavily depends upon data size, and acquiring authentic defective images is a difficult and time-consuming task. In this study, we use data augmentation and investigate the impact of data size on battery inspection performance. The results provide valuable insights for enhancing the capabilities of the inspection process.

Optimal buffer size control of serial production lines with quality inspection machines

  • Han, Man-Soo;Lim, Jong-Tae
    • 제어로봇시스템학회:학술대회논문집
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    • 1996.10a
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    • pp.350-353
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    • 1996
  • In this paper, based on the performance analysis of serial production lines with quality inspection machines, we develope an buffer size optimization method to maximize the production rate. The total sum of buffer sizes are given and a constant, and under this constraint, using the linear approximation method, we suggest a closed form solution for the optimization problem with an acceptable error. Also, we show that the upstream and downstream buffers of the worst performance machine have a significant effect on the production rate. Finally, the suggested methods are validated by simulations.

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Robust Defect Size Measuring Method for an Automated Vision Inspection System (영상기반 자동결함 검사시스템에서 재현성 향상을 위한 결함 모델링 및 측정 기법)

  • Joo, Young-Bok;Huh, Kyung-Moo
    • Journal of Institute of Control, Robotics and Systems
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    • v.19 no.11
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    • pp.974-978
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    • 2013
  • AVI (Automatic Vision Inspection) systems automatically detect defect features and measure their sizes via camera vision. AVI systems usually report different measurements on the same defect with some variations on position or rotation mainly because different images are provided. This is caused by possible variations from the image acquisition process including optical factors, nonuniform illumination, random noises, and so on. For this reason, conventional area based defect measuring methods have problems of robustness and consistency. In this paper, we propose a new defect size measuring method to overcome this problem, utilizing volume information that is completely ignored in the area based defect measuring method. The results show that our proposed method dramatically improves the robustness and consistency of defect size measurement.

Development of Reliability Acceptance Sampling Plan for the Exponential Lifetime Distribution under Periodic Inspection and Type I Censoring (수명이 지수분포를 따를 때 정기검사 및 정시종결하에서 신뢰성 샘플링검사계획의 개발)

  • 서순근;김갑석
    • Journal of the Korean Operations Research and Management Science Society
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    • v.21 no.1
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    • pp.115-129
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    • 1996
  • A reliability Acceptance Sampling Plan (RASP) is developed for testing the exponential mean lifetime under the periodic (i. e., equally-spaced) inspection and Type I censoring. Under the periodic inspection, the exact sampling distribution of maximum likelihood (ML) estimator of mean can not be derived. Hence sample size and acceptance criterion are determined by the algorithm proposed on the basis of Monte Carlo simulation such that the producer's and consumer's risks are satisfied for given censoring time and number of inspections. In addition, the developed RASP is compared in terms of sampling size, OC curve, and expected completion time. The effects for the RASP by the chosen inspection scheme are also discussed.

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Inspection for Process Improvement during High-Resolution Large-Size LTPS TFT Manufacturing

  • Chang, Jiun-Jye;Chen, Chih-Chiang;Chuang, Ching-Sang;Wu, Yung-Fu;Sheu, Chai-Yuan
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.626-629
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    • 2003
  • In order to achieve high-resolution and large-size displays, inspection technology is necessary and important. It is a powerful utility for process and yield improvement for the high valued panel realization. We indicated the challenge of advanced panel manufacturing on inspection ability and throughput. We also investigated the method to judge laser-crystallizing energy by inspection technology. Finally, the total defect number and critical killer defects were classified and discussed in this work.

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Wavelet Transform Based Image Template Matching for Automatic Component Inspection (자동부품검사를 위한 웨이블렛 변환 기반 영상정합)

  • Cho, Han-Jin;Park, Tae-Hyoung
    • Journal of Institute of Control, Robotics and Systems
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    • v.15 no.2
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    • pp.225-230
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    • 2009
  • We propose a template matching method for component inspection of SMD assembly system. To discriminate wrong assembled components, the input image of component is matched with its standard image by template matching algorithm. For a fast inspection system, the calculation time of matching algorithm should be reduced. Since the standard images of all components located in a PCB are stored in computer, it is desirable to reduce the memory size of standard image. We apply the discrete wavelet transformation to reduce the image size as well as the calculation time. Only 7% memory of the BMP image is used to discriminate goodness or badness of components assembly. Comparative results are presented to verify the usefulness of the proposed method.