• Title/Summary/Keyword: Sink Flow

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An Error Recovery Mechanism for Wireless Sensor Networks

  • Kim, Dong-Il
    • Journal of information and communication convergence engineering
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    • v.10 no.3
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    • pp.237-241
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    • 2012
  • In wireless sensor networks, the importance of transporting data correctly with reliability is increasing gradually along with the need to support communications between the nodes and sink. Data flow from the sink to the nodes requires reliability for control or management that is very sensitive and intolerant of error; however, data flow from the nodes to the sink is relatively tolerant. In this paper, with emphasis on the data flow from the sink to the nodes, we propose a mechanism that considers accurate transport with reliability hop-by-hop. During the process of sending the data, if errors occur or data is missing, the proposed mechanism supports error recovery using a fixed window with selective acknowledgment. In addition, this mechanism supports congestion control depending on the buffer condition. Through the simulation, we show that this mechanism is accurate, reliable, and proper for transport in wireless sensor networks.

A Study on Sink Marks in Injection Molding of Boss Parts (보스부분 사출성형의 싱크마크 발생에 관한 연구)

  • Kim, Hyun-Pil;Kim, Yong-Jo
    • Design & Manufacturing
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    • v.2 no.4
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    • pp.37-43
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    • 2008
  • Supplementary features in injection molded products, which are boss, rib and snap fit, are mainly located in the products. These features might make molding flow improper in injection processing and consequently give rise to some of molding troubles such as short shot and hesitation. The sink mark on boss parts is generated by the volumetric shrinkage that is caused by both the molding thickness and the closed boss height. The volumetric shrinkage is affected by packing pressure and its amount tends to decrease by increasing the packing pressure. The packing pressure can therefore increase flow rate to a boss part and causes the sink mark depth to increase. As the molding thickness and the closed boss height in the boss part can increase the part volume, these may yield bad solidifying and also extend the molding cycle. In this paper, both the injection molding test and the flow analysis were carried out to investigate the effect of sink marks generated in the boss part of injection molded products.

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Development and Characterization of Optimum Heat Sink for 30 W Chip on Board LED Down-Light

  • Seo, Bum-Sik;Lee, Ki-Joung;Yang, Jong-Kyung;Cho, Young Seek;Park, Dae-Hee
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.6
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    • pp.292-296
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    • 2012
  • An optimum heat sink for a 30 W chip on board (COB) LED down-light is designed, fabricated, and characterized. By using the SolidWorks Flow simulator and thermal analysis software, the thermal characteristics of the optimum heat sink is analyzed. Four different types of heat sink are simulated and an optimum structure of the heat sink is found. The simulated temperature of the heat sink when operating the LED down-light is $55.9^{\circ}C$, which is only a difference of $2^{\circ}C$ from the measured temperature. In order to reduce the temperature further, a copper spreader is introduced to the heat sink. The temperature of the heat sink with the copper spreader is $3^{\circ}C$ lower than without the copper spreader.

Investigation of Natural Convective Heat Flow Characteristics of Heat Sink (히트싱크의 자연대류 열유동 특성 분석)

  • Jung, Tae Sung;Kang, Hwan Kook
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.37 no.1
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    • pp.27-33
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    • 2013
  • To ensure proper functioning of electrical and mechanical systems, cooling devices are of great importance. A heat sink is the most common cooling device used in many industries such as the semiconductor, electronic instrument, LED lighting, and automotive industries. To design an optimal heat sink, the required surface area for heat radiation should be calculated based on an accurate expectation of the heat flow rate in the target environment. In this study, the convective heat flow characteristics were numerically investigated for a vertically installed typical heat sink and a horizontally installed one in free convection using ANSYS CFX. Comparative experiments were carried out to reveal the quantitative effect of the installation direction on the cooling performance. Moreover, the result was analyzed using the dimensionless correlation with the Nusselt number and Rayleigh number and compared with well-known theories. Finally, it was observed that the cooling performance of the vertically installed heat sink is approximately 10~15% better than that of the one in natural convection.

NUMERICAL STUDY OF CHIP COOLING ENHANCEMENT WITH EVAPORATING MIST FLOW (분무 증발을 이용한 칩 냉각 향상에 대한 수치적 연구)

  • Roh, S.E.;Kim, D.;Son, G.
    • Journal of computational fluids engineering
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    • v.18 no.2
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    • pp.9-16
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    • 2013
  • The heat transfer enhancement of heat sink with mist flow is studied numerically by solving the conservation equations for mass, momentum and energy in the continuous and dispersed phases. A Lagrangian method is used for tracing dispersed water droplets in the heat sink and an Eulerian species transport model for air and steam mixture. The continuous and dispersed phases are interacted with the drag and evaporation source terms. The computed results show that addition of evaporating mist droplets enhances the cooling performance of heat sink significantly.

Cooling Characteristics of a Strip Fin Heat Sink (스트립휜 히트싱크의 냉각특성)

  • Park. Cheol-Woo;Kim. Hyun-Woo;Jang .Chung-Sun;Riu. Kap-Jong
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.29 no.1 s.232
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    • pp.16-26
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    • 2005
  • Air-cooled heat sinks are employed in many electronic cooling applications since they provide significant heat transfer enhancement and operational flexibility. Strip-shaped fin heat sink is of interest and needs to be investigated as general cooling products for more applicability. The purposes of this study are to evaluate heat sink performance without bypass flow condition and to determine optimal heat sink geometries. The results show that the decreasing rate of thermal resistance of a heat sink decreases with increasing inlet air velocity, and the increasing rate of pressure drop increases with increasing inlet air velocity, but is not affected by input power. The increasing rate of optimal longitudinal fin spacing is larger than that of transverse fin spacing. The strip fin heat sink tested in this study showed better cooling performance compared to that of other plate fin type.matism. 2004; 50(11): 3504-3515.

FE Analysis of Extrusion Process for Heat sink (방열판 직접압출 공정의 유한요소해석)

  • 이정민;김병민;조형호
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.10a
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    • pp.313-317
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    • 2003
  • Porthole die extrusion is the method which put the billet in the container and push it between die hole by ram. This method make it possible that product manufacture which have complex shape of area with excellent induction of area, in addition that this is economical. So this method is used as the basic manufacturing method of many industrial materials. The subject of this research is the forming technology development of heat sink which is being produced by extrusion process in my country. Flow condition of extrusion for heat sink, and metal flow of billet in the die are estimated by the means of rigid-plasticity finite element method.

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A Numerical Study on Beat Transfer from an Aluminum Foam Heat Sink by Impinging Air Jet in a Confined Channel (충돌 공기제트에서 국한 유로 내 발포 알루미늄 방열기의 열전달 수치해석)

  • Lee, Sang-Tae;Kim, Seo-Young;Lee, Kwan-Soo
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.26 no.6
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    • pp.883-892
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    • 2002
  • A numerical study has been carried out to investigate the flow and heat transfer from an aluminum foam heat sink in a confined channel. A uniform heat flux is given at the bottom of the aluminum foam heat sink, which is horizontally placed on the heated surface. The channel walls are assumed to be adiabatic. Cold air is supplied from the top opening of the channel and exhausted to the channel outlet. Comprehensive numerical solutions are acquired to the governing Wavier-Stokes and energy equations, using the Brinkman-Forchheimer extended Darcy model and the local thermal non-equilibrium model f3r the region of porous media. Details of flow and thermal fields are examined over wide ranges of the principal parameters; i.e., the Reynolds number Re, the height of heat sink h/H, porosity $\varepsilon$and pore diameter ratio $R_{H}$.

A Study on Cooling Characteristics of the LED Lamp Heat Sink for Automobile by Forced Convection (강제대류에 의한 자동차용 램프 방열판의 냉각 특성에 LED 관한 연구)

  • Yang, Ho-Dong;Yoo, Jae-Young;Park, Seul-Hyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.17 no.6
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    • pp.117-123
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    • 2018
  • Automotive headlamps have been continuously developed as one of the most important devices for securing the driver's view, and the LED lamps are getting popular in recent years. However, in case of the LED lamps, because the heat generated by the LED lamps are too high, it shorten the product life and lower the LED efficiency. Therefore, this study was investigated the cooling characteristics of the LED lamp heat sink for automobile by forced convection for LED heat generation control. In order to analyze the cooling characteristics of the heat sink, the temperature distribution results were investigated through the experiment and computational analysis under the increase of the air flow velocity, and the convective heat transfer coefficient was obtained. Also, convective heat transfer coefficient was calculated by the theoretical formula under the same condition and compared with experimental and computational results. From the result of this study, as the air flow velocity around the heat sink fins increased, the convective heat transfer coefficient significantly increased, confirming the improvement in the cooling effect.