• Title/Summary/Keyword: Single-step process

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Three-Dimensional Microstructures Fabricated by Multi-Step Electrochemical Aluminum-Foil Etching (알루미늄 박판의 다단 전해식각 공정을 이용한 3 차원 마이크로 구조물의 제작)

  • Kim, Yoon-Ji;Youn, Se-Chan;Han, Won;Cho, Young-Ho;Park, Ho-Joon;Chang, Byeung-Gyu;Oh, Yong-Soo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.12
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    • pp.1805-1810
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    • 2010
  • We present a simple, cost-effective, and fast fabrication process for three-dimensional (3D) microstructures; this process is based on multi-step electrochemical etching of metal foils which facilitates the mass production of 3D microstructures. Compared to electroplating, this process maintains uniform and well-controlled material properties of the microstructure. In the experimental study, we perform single-step electrochemical etching of aluminum foils for the fabrication of 2D cantilever arrays. In the single-step etching, the depth etch rate and bias etch rate are measured as $1.50{\pm}0.10 {\mu}m/min$ and $0.77{\pm}0.03 {\mu}m/min$, respectively. Using the results of single-step etching, we perform two-step electrochemical etching for 3D microstructures with probe tips on cantilevers. The errors in height and lateral fabrication in the case of the fabricated structures are $15.5{\pm}5.8% $ and $3.3{\pm}0.9%$, respectively; the surface roughness is $37.4{\pm}9.6nm$.

Characteristics of Two-Step Plasma-Assisted Boronizing Process in an Atmosphere of BCl3-H2-Ar (BCl3-H2-Ar 분위기를 이용한 2단계 플라즈마 보로나이징 특성)

  • Nam, Kee-Seok;Lee, Gu-Hyun;Shin, Pyung-Woo;Song, Yo-Seung;Kim, Bae-Yeon;Lee, Deuk-Yong
    • Journal of the Korean Ceramic Society
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    • v.43 no.6 s.289
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    • pp.358-361
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    • 2006
  • A two-step plasma-assisted boronizing process was carried out on the AISI 1045 steel substrate to reduce the pore density introduced by a conventional single plasma boronizing process. The specimens were plasma boronized for 1 h at $650^{\circ}C$ and subsequently far 7 h at $800^{\circ}C$ in an atmosphere of $BCl_3-H_2-Ar$. The boride layer thickness was parabolic in boronizing time, a high HV reading of 1540 was found up to the boride layer thickness of $25{\mu}m$. It was found that the morphology of the boride layer prepared by the two-step boronizing process was changed from a columnar to a tooth-like structure and the pores in the borided steel were eliminated completely in comparison to those synthesized by the conventional single boronizing process, implying that it is highly applicable for enhancing the dense and compact coating properties of the low-alloy steel.

Copper thickness and thermal reliability of microvias produced by laser-assisted seeding (LAS) process in printed circuit board (PCB) manufacture

  • Leung, E. S.W.;Yung, W. K.C.
    • International Journal of Quality Innovation
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    • v.2 no.2
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    • pp.69-92
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    • 2001
  • The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

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Mineralogical Analysis and Mechano-Chemical Purification of Natural Silica Ore for High Purity Silica Powder

  • Park, Jesik;Lee, Churl Kyoung;Lee, Hyun-Kwon
    • Korean Journal of Materials Research
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    • v.26 no.6
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    • pp.306-310
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    • 2016
  • To produce 4N grade high-purity silica powder from natural ore, the mineralogical characteristics of natural silica ore were investigated and their effects on the purification process were revealed. The Chinese silica mineral ore used was composed of iron and aluminum as main impurities and calcium, magnesium, potassium, sodium, and titanium as trace impurities; these trace impurities generally exist as either single oxides or complex oxides. It was confirmed that liberation and acidic washing of the impurities were highly dependent on the particle size of the ground silica ore and on its mineralogical characteristics such as the distribution and phases of existing impurities. It is suggested that appropriate size reduction of silica ore should be realized for optimized purification according to the origin of the natural silica ore. A single step purification process, the mechano-chemical washing (MCW) process, was proposed and verified in comparison with the conventional multi step washing process.

Simplified Ground-type Single-plate Electrowetting Device for Droplet Transport

  • Chang, Jong-Hyeon;Kim, Dong-Sik;Pak, James Jung-Ho
    • Journal of Electrical Engineering and Technology
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    • v.6 no.3
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    • pp.402-407
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    • 2011
  • The current paper describes a simpler ground-type, single-plate electrowetting configuration for droplet transport in digital microfluidics without performance degradation. The simplified fabrication process is achieved with two photolithography steps. The first step simultaneously patterns both a control electrode array and a reference electrode on a substrate. The second step patterns a dielectric layer at the top to expose the reference electrode for grounding the liquid droplet. In the experiment, a $5{\mu}m$ thick photo-imageable polyimide, with a 3.3 dielectric constant, is used as the dielectric layer. A 10 nm Teflon-AF is coated to obtain a hydrophobic surface with a high water advancing angle of $116^{\circ}$ and a small contact angle hysteresis of $5^{\circ}$. The droplet movement of 1 mM methylene blue on this simplified device is successfully demonstrated at control voltages above the required 45 V to overcome the contact angle hysteresis.

Process and Electrical Characteristics of Step-down Piezoelectric Transformers (강압용 압전변압기 제작 및 전기적특성)

  • Kwon, Ju-Nam;Shin, Hoon-Bum;Han, Deuk-Young;Ahn, Hyung-Keun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07b
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    • pp.595-598
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    • 2004
  • We have explained Process and electrical characteristics of a step-down Rosen type piezoelectric transformer for AC-adapter. When the electric voltage is applied to the driving piezoelectric vibrator notarized in the thickness direction, then output voltage is generated at the generating piezoelectric vibrator polarized in the thickness direction due to the piezoelectric effects. Output voltage and current from a single-layered piezoelectric transformer were measured under the various condition of loads and frequencies It was shown from experiments that output voltage has increased and resonance frequency has changed according to various resistor loads. Output current has decreased inversely proportional to the loads

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DENTIN PERMEABILITY CHANCE ACCORDING TO THE PROCESS OF COMPOMER RESTORATION (컴포머 충전과정에 따른 상아질 투과도의 변화)

  • Cho, Hye-Jin;Lee, Kyung-Ha;Lee, Se-Joon;Lee, Kwang-Won
    • Restorative Dentistry and Endodontics
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    • v.27 no.4
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    • pp.382-388
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    • 2002
  • Compomer is composed of matrix and filler : matrix is made of the combination of resins and polycarboxylic molecules that are light-cured, and a filler is a glass component which is capable of ion-release. The resin content of compomers produces polymerization shrinkage which can adversely affect marginal adaptation. Pretreatment is a fundamental step which is treated with conditioner or primer in the use of these materials. Microleakage of restorative materials has been investigated mostly by dye penetration method. Dye penetration method was not quantitative and not measured repeatedly. Fluid filtration method, introduced and developed by Pashley's group, has been extensively used for 20 years for research purpose to understand the physiology of dentin, as well as the effects of various restorative treatments on dentin permeability. It permits quantitative, nondestructive measurment of microleakage in a longitudinal manner. The purpose of this study was to evaluate the change of dentin permeability according to the process of compomer restoration. In this study. Cl V cavities were prepared on buccal surface of thirty extracted human molars. The prepared cavities were etched by 37% phosphoric acid. The experimental teeth were randomly divided into three groups. Each group was treated with following materials Group 1 : Prime & Bond NT/Dyract AP, Group2: Single Bond/F2000 compomer, Group 3 : Syntac Single Component/Compoglass. The bonding agent and compomer were applied for each group following manufacturers information. Dentin permeability of each group was measured at each process by fluid filtration method; Step 1 : preparation(smear layer). Step 2 : etching(smear layer removal), Step 3 : applying the bonding agent, Step 4 : filling the compomer. Dentin permeability was expressed by hydraulic conductance ($\mu\textrm{l}$ min$^{-1}$cm$H_2O$$^{-1}$). The data were analysed statistically using One-way ANOVA and Sheffe's method. The results were as follows : 1. Dentin permeability differences between each process were significant except between step 1 and step 2(p<0.01). 2. Dentin permeability after removal of smear layer was highly increased(p<0.01). 3. In most case, decrease of dentin permeability was obtained by applying bonding agent(p<0.01). 4. Dentin permeability differences among the experimental groups were not significant(p>0.05). 5. None of compomers used in this study showed perfect seal at the interface.

The Laminating process for Single Substrate Flexible LCD

  • Bae, Kwang-Soo;Choi, Yoon-Seuk;Kim, Hak-Rin;Kim, Jae-Hoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08b
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    • pp.1125-1128
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    • 2007
  • The laminating technique for developing flexible liquid crystal display was demonstrated by using a thin UV curable polymer film and a plastic substrate with patterned polymer wall structure. We adopted the rigid wall structure to provide a solid mechanical support for the stable molecular alignment of liquid crystals (LCs) in the device. The cover film was prepared to have an ability of aligning LC molecules by patterning a micro-groove structure using the soft-lithographic process. These two substrates can be assembled tightly by the laminating and one-step UV irradiation process because of the adhesive nature of the used UV curable polymers. Proposed method can be used to fabricate the flexible LC display with simplicity and also be applicable for a cost-effective roll-to-roll process.

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Application of the electroless plating method to the fabrication of metallic bus electrodes of PDP

  • Oh, Young-Joo;Jeung, Won-Young
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.829-831
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    • 2003
  • In the present study, the electroless plating method was applied instead of the sputtering as a formation method of metallic bus electrodes. No additional blackening step is needed in this method since this process provides a metallic seed layer with black color by a single step. The parameters which affects color and morphology of the metallic seed layer in the electroless plating solution were investigated

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