• 제목/요약/키워드: Single-step process

검색결과 371건 처리시간 0.03초

Nonparametric Bayesian Multiple Change Point Problems

  • Kim, Chansoo;Younshik Chung
    • Journal of the Korean Statistical Society
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    • 제31권1호
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    • pp.1-16
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    • 2002
  • Since changepoint identification is important in many data analysis problem, we wish to make inference about the locations of one or more changepoints of the sequence. We consider the Bayesian nonparameteric inference for multiple changepoint problem using a Bayesian segmentation procedure proposed by Yang and Kuo (2000). A mixture of products of Dirichlet process is used as a prior distribution. To decide whether there exists a single change or not, our approach depends on nonparametric Bayesian Schwartz information criterion at each step. We discuss how to choose the precision parameter (total mass parameter) in nonparametric setting and show that the discreteness of the Dirichlet process prior can ha17e a large effect on the nonparametric Bayesian Schwartz information criterion and leads to conclusions that are very different results from reasonable parametric model. One example is proposed to show this effect.

Double Step Fabrication of Ag Nanowires on Si Template

  • Zhang, J.;Cho, S.H.;Quan, W.X.;Zhu, Y.Z.;Mseo, J.
    • Journal of Korean Vacuum Science & Technology
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    • 제6권2호
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    • pp.79-83
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    • 2002
  • As Ag does not form my silicide on Si surfaces, Ag wire is a candidate for self-assembled nanowire on the reconstructed and single-domain Si(5 5 12)-2 $\times$ 1. In the present study, various Ag coverages and post-annealing temperatures had been tested to fabricate a Ag nanowire with high aspect ratio. When Ag coverage was less than 0.03 ML and the post-annealing temperature was 500(C, Ag atoms preferentially adsorbed on the tetramer sites resulting in Ag wires with an inter-row spacing of ~5 nm. However, its aspect ratio is relatively small and its height is also not even. On the other hand, the Ag-posited surface completely loses its reconstruction even with the same annealing at 500 $\^{C}$ if the initial coverage exceeds 0.05 ML. But the additional subsequent annealing at 700$\^{C}$ and slow-cooling process recovers the well-ordered Ag chain with relatively high aspect ratio on the same tetramer sites. It can be understood that, in the double step annealing process, the lower temperature annealing is required for cohesion of adsorbed Ag atoms and the higher temperature annealing is for providing Ag atoms to the tetramer sites.

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E-빔 증착된 Sn 전구체의 황화 열처리 온도 및 시간에 따른 SnSx 박막 성장 효과 (Effect of the Sulfurization Temperature and Annealing Time of E-Beam Evaporated Sn Precursors on the Growth of SnSx Thin Films)

  • 황팅지엔;김제하
    • 한국전기전자재료학회논문지
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    • 제30권11호
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    • pp.734-739
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    • 2017
  • We prepared $SnS_x$ thin films on both soda-lime glass (SLG) and molybdenum(Mo)/SLG substrates by a two-step process using a Sn precursor followed by sulfur reaction in rapid thermal annealing (RTA) at different sulfurization temperatures ($Ts=200^{\circ}C$, $230^{\circ}C$, $250^{\circ}C$, and $300^{\circ}C$) and annealing times ($t_s=10min$ and 30 min). The single SnS phase was dominant for $200^{\circ}C{\leq}T_s$<$250^{\circ}C$, while an additional phase of $SnS_2$ was appeared at $T_s{\geq}250^{\circ}C$ alongside SnS. The SnS grains in all the samples showed strong growth along the preferred [040] direction. The band-gap energy ($E_g$) of the films was estimated to be 1.24 eV.

규격화된 분전반 제작을 위한 표준작업절차(SOP)의 공정 개발 (Process Development of a Standard Operating Procedure (SOP) for the Manufacturing of Standardized Distribution Boards)

  • 고완수;이병설;최충석
    • 한국안전학회지
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    • 제33권5호
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    • pp.21-27
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    • 2018
  • The purpose of this study is to develop a SOP (Standard Operating Procedure) for a distribution board that can monitor the leakage current of a load distribution line in real time. The developed distribution board was fabricated by applying IEC 61439-1. It consists of the distribution board and an alarm device. The work process for making the distribution board was compliant with the KEMC (Korea Electrical Manufacturers Cooperative) regulations. And the AC distribution board range is 1,000 V. In addition, the voltage in DC is less than 1500 V. The distribution board receives a 3-phases and 4-wires power supply system and can supply power to the load of a maximum of 32 single or three phase distribution circuits. Also, leakage current measured on the power distribution board was used by sensors installed. The SOP of the developed distribution board consists of the installation standards for the short circuit alarm device and sensor, the surge protection device, switches and indication lamps, and other devices. The operation procedure was prepared so that each manufacturing step of the distribution board must be confirmed by the persons in charge of preparation, production, quality control and approval before moving forward to the next step.

Brand Distribution Service and Its Effect on Customer Value

  • Margaretha, Margaretha;Halim, Rizal Edy
    • 유통과학연구
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    • 제16권1호
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    • pp.29-36
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    • 2018
  • Purpose - The purpose of the research is to further explore the understanding of the nature of the brand distribution service (i.e., service brand) by undertaking a quantitative investigation. We focus on the role of customer's perception of service brand on the customer value creation process. Research design, data, and methodology - This study used single cross-sectional design and 137 airline passengers as respondents using a convenience random sampling. We distributed the online questionnaires by email address. The empirical setting for this research is airline service in Indonesia with a consideration that airline service has the useful context for this research as the service delivery process involve extensive customer interactions with the airline and its employees. We then analyzed the data using multiple regression (step-wise) method to fulfill the research objectives. Results - Using the step-wise regression method, the result shows that the influential factors to create customer value are cost and company image. The result suggests a company to improve its costs components and its company image in order to increase the customer value. Conclusions - The research shows that costs play a critical role, and completed with the company image to form the customer value variable. This shows that mostly customer formed their value based on costs they sacrificed. Mainly, this evaluation is monetary cost based, while Indonesian customers tend to have a high value for money demands.

Preparation of High-Purity Urokinase Using Single-Step Hydrophobic Interaction Chromatography with p-Aminobenzamidine Ligand

  • Cao, Xue-Jun;Zhou, Jian-Hua;Huang, Zhen-Hui;Wu, Xing-Yan;Hur, Byung-Ki
    • Journal of Microbiology and Biotechnology
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    • 제12권2호
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    • pp.196-203
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    • 2002
  • A novel process for urokinase purification was studied using p-aminobenzamidine as the ligand and sepharose 4B as the matrix. The adsorption, washing, and elution conditions were optimized by an unusual method. An adsorption buffer containing 2.5 M NaCl and $1\%$ Tween 80 facilitated the adsorption of urokinase on the affinity media and prevented contaminants from binding to the p-aminobenzamidine affinity gel. It was found that $5\%$ Tween 80 removed most of the contaminants from the affinity column. A 0.2 M glycine elution buffer containing 0.5 M NaCl (pH 3.0) was found to have a strong elution ability with a high recovery and purity of urokinase. A crude urokinase material of231 IU/mg protein from human urine was purified to 124,300 IU/mg protein with a purification factor of 538 and yield of $86.7\%$. As a result, a high purity urokinase was obtained with only a single affinity chromatography step. The purification process was successfully scaled-up to a 2-1 chromatography column. The resulting urokinase eluate could be directly lyophilized, thereby complying with Chinese pharmacopoeia (1995 version) standards.

Al5052-O 판재의 최적 점진성형 연구 (Optimization of Single Point Incremental Forming of Al5052-O Sheet)

  • 김찬일;샤오샤오;도반크옹;김영석
    • 대한기계학회논문집A
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    • 제41권3호
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    • pp.181-186
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    • 2017
  • 점진 판재 성형은 금형을 제작하지 않고 판재를 가공하는 방법으로써 빠른 시제품 제작과 소량 생산에 적합한 성형법이다. 이러한 점진 판재 성형의 공정 변수로 공구 직경, 매 스탭당 z-방향 깊이, 공구 이송속도, 공구 회전 속도 등은 성형품의 품질에 크게 영향을 미친다. 본 연구에서는 Al5052-O(0.8mm) 판재를 사용하여 Varying Wall Angle Conical Frustum 모델의 점진성형을 실시하였으며, 각각의 변수들의 조합에서 성형성을 판단하였다. 다구찌 기법을 사용하여 점진성형 변수들의 조합을 찾아내고, 그레이 관계형 최적화를 통하여 최적 성형 변수 값의 조합을 찾아 내였다. 최종 성형물의 품질은 성형성, 스프링 백, 두께 감소량을 측정하여 판단하였다. 본 연구의 실험 조건에서의 최적의 변수 조합은 공구직경 6 mm, 회전속도 60rpm, 매 스탭당 z-방향 깊이 0.3 mm, 이송속도 500 mm/min으로 판단되었다.

NST알고리즘을 이용한 비동기식 16비트 제산기 설계 (Design of Asynchronous 16-Bit Divider Using NST Algorithm)

  • 이우석;박석재;최호용
    • 대한전자공학회논문지SD
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    • 제40권3호
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    • pp.33-42
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    • 2003
  • 본 논문에서는 NST (new Svoboda-Tung) 알고리즘을 이용한 비동기식 제산기의 효율적 설계에 관해 기술한다. 본 제산기설계에서는 비동기 설계방식을 사용하여 제산연산이 필요할 때에만 동작함으로써 전력소모를 줄이도록 설계한다. 제산기는 비동기식 파이프라인 구조를 이용한 per-scale부, iteration step부, on-the-fly converter부의 세부분으로 구성된다. Per-scale부에서는 새로운 전용 감산기를 이용하여 적은 면적과 고성능을 갖도록 설계한다. Iteration step부에서는 4개의 division step을 갖는 비동기식 링 구조로 설계하고, 아울러 크리티컬 패스(critical path)에 해당하는 부분만을 2선식으로, 나머지 부분은 단선식으로 구성하는 구현방법을 채택하여 하드웨어의 오버헤드를 줄인다. On-the-fly converter부는 iteration step부와 병렬연산이 가능한 on-the-fly 알고리즘을 이용하여 고속연산이 되도록 설계한다. 0.6㎛ CMOS 공정을 이용하여 설계한 결과, 1,480 ×1,200㎛²의 면적에 12,956개의 트랜지스터가 사용되었고, 41.7㎱의 평균지연시간을 가졌다.

Single-step 전자빔 묘화 장치를 이용한 Focusing Grating Coupler 제작 연구 (Fabrication technology of the focusing grating coupler using single-step electron beam lithography)

  • 김태엽;김약연;손영준;한기평;백문철;김해성;신동훈;이진구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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    • pp.976-979
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    • 2002
  • A focusing grating coupler (FGC) was not fabricated by the 'Continuous Path Control' writing strategy but by an electron-beam lithography system of more general exposure mode, which matches not only the address grid with the grating period but also an integer multiple of the address grid resolution (5 nm), To more simplify the fabrication, we are able to reduce a process step without large decrease of pattern quality by excluding a conducting material or layer such as metal (Al, Cr, Au), which are deposited on top or bottom of an e-beam resist to prevent charge build-up during e-beam exposure. A grating pitch period and an aperture feature size of the FGC designed and fabricated by e-beam lithography and reactive ion etching were ranged over 384.3 nm to 448.2 nm, and $0.5{\times}0.5mm^2$ area, respectively, This fabrication method presented will reduce processing time and improve the grating quality by means of a consideration of the address grid resolpution, grating direction, pitch size and shapes when exposing. Here our investigations concentrate on the design and efficient fabrication results of the FGC for coupling from slab waveguide to a spot in free space.

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압전 트랜스듀서를 이용한 승압형 공진형 직류-직류 컨버터 (A Resonant-type Step-up DC/DC Converters with Piezoelectric Transducer)

  • 박종후;서갑수;조보형;이경표
    • 전력전자학회논문지
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    • 제14권5호
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    • pp.343-354
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    • 2009
  • 본 논문에서는 집적 가능한 전력변환기 제작을 위하여 자화 소자가 없는 전력용 직류-직류 변환기를 제안하였다. 자화 소자가 없는 대신, 압전 트랜스듀서의 유도성 임피던스 구간을 사용함으로써 에너지 저장 및 소프트 스위칭을 위한 공진파형을 구현하였다. 압전소자는 권선이 없고 전극을 사용하여 전력을 전달하므로, 반도체 공정을 통한 대량생산이 가능한 장점이 있다. 본 논문에서는 압전 트랜스듀서를 적용가능한 승압형 공진형 직류-직류 변환 회로를 제안하고, 동작모드 및 주파수 제어 특성을 분석하였다. 또한, 단일 컨버터를 확장한 다중 직렬형 토폴로지를 살펴보고, 동일하게 주파수 제어 특성을 분석하였다. 분석 결과를 검증하기 위하여 10W 출력 직류-직류 전력변환기 하드웨어를 제작하였다. 또한 확장형 다중 직렬 컨버터 하드웨어를 제작하여 검증하였다. 단일 컨버터와 동일하게 주파수 제어 특성을 보였으며, 전력변환기로 매우 우수한 효율 성능을 보임을 알 수 있었다.