• Title/Summary/Keyword: Single-step process

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Nonparametric Bayesian Multiple Change Point Problems

  • Kim, Chansoo;Younshik Chung
    • Journal of the Korean Statistical Society
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    • v.31 no.1
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    • pp.1-16
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    • 2002
  • Since changepoint identification is important in many data analysis problem, we wish to make inference about the locations of one or more changepoints of the sequence. We consider the Bayesian nonparameteric inference for multiple changepoint problem using a Bayesian segmentation procedure proposed by Yang and Kuo (2000). A mixture of products of Dirichlet process is used as a prior distribution. To decide whether there exists a single change or not, our approach depends on nonparametric Bayesian Schwartz information criterion at each step. We discuss how to choose the precision parameter (total mass parameter) in nonparametric setting and show that the discreteness of the Dirichlet process prior can ha17e a large effect on the nonparametric Bayesian Schwartz information criterion and leads to conclusions that are very different results from reasonable parametric model. One example is proposed to show this effect.

Double Step Fabrication of Ag Nanowires on Si Template

  • Zhang, J.;Cho, S.H.;Quan, W.X.;Zhu, Y.Z.;Mseo, J.
    • Journal of Korean Vacuum Science & Technology
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    • v.6 no.2
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    • pp.79-83
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    • 2002
  • As Ag does not form my silicide on Si surfaces, Ag wire is a candidate for self-assembled nanowire on the reconstructed and single-domain Si(5 5 12)-2 $\times$ 1. In the present study, various Ag coverages and post-annealing temperatures had been tested to fabricate a Ag nanowire with high aspect ratio. When Ag coverage was less than 0.03 ML and the post-annealing temperature was 500(C, Ag atoms preferentially adsorbed on the tetramer sites resulting in Ag wires with an inter-row spacing of ~5 nm. However, its aspect ratio is relatively small and its height is also not even. On the other hand, the Ag-posited surface completely loses its reconstruction even with the same annealing at 500 $\^{C}$ if the initial coverage exceeds 0.05 ML. But the additional subsequent annealing at 700$\^{C}$ and slow-cooling process recovers the well-ordered Ag chain with relatively high aspect ratio on the same tetramer sites. It can be understood that, in the double step annealing process, the lower temperature annealing is required for cohesion of adsorbed Ag atoms and the higher temperature annealing is for providing Ag atoms to the tetramer sites.

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Effect of the Sulfurization Temperature and Annealing Time of E-Beam Evaporated Sn Precursors on the Growth of SnSx Thin Films (E-빔 증착된 Sn 전구체의 황화 열처리 온도 및 시간에 따른 SnSx 박막 성장 효과)

  • Huang, Tingjian;Kim, Jeha
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.11
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    • pp.734-739
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    • 2017
  • We prepared $SnS_x$ thin films on both soda-lime glass (SLG) and molybdenum(Mo)/SLG substrates by a two-step process using a Sn precursor followed by sulfur reaction in rapid thermal annealing (RTA) at different sulfurization temperatures ($Ts=200^{\circ}C$, $230^{\circ}C$, $250^{\circ}C$, and $300^{\circ}C$) and annealing times ($t_s=10min$ and 30 min). The single SnS phase was dominant for $200^{\circ}C{\leq}T_s$<$250^{\circ}C$, while an additional phase of $SnS_2$ was appeared at $T_s{\geq}250^{\circ}C$ alongside SnS. The SnS grains in all the samples showed strong growth along the preferred [040] direction. The band-gap energy ($E_g$) of the films was estimated to be 1.24 eV.

Process Development of a Standard Operating Procedure (SOP) for the Manufacturing of Standardized Distribution Boards (규격화된 분전반 제작을 위한 표준작업절차(SOP)의 공정 개발)

  • Ko, Wan-Su;Lee, Byung-Seol;Choi, Chung-Seog
    • Journal of the Korean Society of Safety
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    • v.33 no.5
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    • pp.21-27
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    • 2018
  • The purpose of this study is to develop a SOP (Standard Operating Procedure) for a distribution board that can monitor the leakage current of a load distribution line in real time. The developed distribution board was fabricated by applying IEC 61439-1. It consists of the distribution board and an alarm device. The work process for making the distribution board was compliant with the KEMC (Korea Electrical Manufacturers Cooperative) regulations. And the AC distribution board range is 1,000 V. In addition, the voltage in DC is less than 1500 V. The distribution board receives a 3-phases and 4-wires power supply system and can supply power to the load of a maximum of 32 single or three phase distribution circuits. Also, leakage current measured on the power distribution board was used by sensors installed. The SOP of the developed distribution board consists of the installation standards for the short circuit alarm device and sensor, the surge protection device, switches and indication lamps, and other devices. The operation procedure was prepared so that each manufacturing step of the distribution board must be confirmed by the persons in charge of preparation, production, quality control and approval before moving forward to the next step.

Brand Distribution Service and Its Effect on Customer Value

  • Margaretha, Margaretha;Halim, Rizal Edy
    • Journal of Distribution Science
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    • v.16 no.1
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    • pp.29-36
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    • 2018
  • Purpose - The purpose of the research is to further explore the understanding of the nature of the brand distribution service (i.e., service brand) by undertaking a quantitative investigation. We focus on the role of customer's perception of service brand on the customer value creation process. Research design, data, and methodology - This study used single cross-sectional design and 137 airline passengers as respondents using a convenience random sampling. We distributed the online questionnaires by email address. The empirical setting for this research is airline service in Indonesia with a consideration that airline service has the useful context for this research as the service delivery process involve extensive customer interactions with the airline and its employees. We then analyzed the data using multiple regression (step-wise) method to fulfill the research objectives. Results - Using the step-wise regression method, the result shows that the influential factors to create customer value are cost and company image. The result suggests a company to improve its costs components and its company image in order to increase the customer value. Conclusions - The research shows that costs play a critical role, and completed with the company image to form the customer value variable. This shows that mostly customer formed their value based on costs they sacrificed. Mainly, this evaluation is monetary cost based, while Indonesian customers tend to have a high value for money demands.

Preparation of High-Purity Urokinase Using Single-Step Hydrophobic Interaction Chromatography with p-Aminobenzamidine Ligand

  • Cao, Xue-Jun;Zhou, Jian-Hua;Huang, Zhen-Hui;Wu, Xing-Yan;Hur, Byung-Ki
    • Journal of Microbiology and Biotechnology
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    • v.12 no.2
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    • pp.196-203
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    • 2002
  • A novel process for urokinase purification was studied using p-aminobenzamidine as the ligand and sepharose 4B as the matrix. The adsorption, washing, and elution conditions were optimized by an unusual method. An adsorption buffer containing 2.5 M NaCl and $1\%$ Tween 80 facilitated the adsorption of urokinase on the affinity media and prevented contaminants from binding to the p-aminobenzamidine affinity gel. It was found that $5\%$ Tween 80 removed most of the contaminants from the affinity column. A 0.2 M glycine elution buffer containing 0.5 M NaCl (pH 3.0) was found to have a strong elution ability with a high recovery and purity of urokinase. A crude urokinase material of231 IU/mg protein from human urine was purified to 124,300 IU/mg protein with a purification factor of 538 and yield of $86.7\%$. As a result, a high purity urokinase was obtained with only a single affinity chromatography step. The purification process was successfully scaled-up to a 2-1 chromatography column. The resulting urokinase eluate could be directly lyophilized, thereby complying with Chinese pharmacopoeia (1995 version) standards.

Optimization of Single Point Incremental Forming of Al5052-O Sheet (Al5052-O 판재의 최적 점진성형 연구)

  • Kim, Chan Il;Xiao, Xiao;Do, Van Cuong;Kim, Young Suk
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.41 no.3
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    • pp.181-186
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    • 2017
  • Single point incremental forming (SPIF) is a sheet-forming technique. It is a die-less sheet metal manufacturing process for rapid prototyping and small batch production. The Critical parameters in the forming process include tool diameter, step depth, feed rate, spindle speed, etc. In this study, these parameters and the die shape corresponding to the Varying Wall Angle Conical Frustum(VWACF) model were used for forming 0.8mm in thick Al5052-O sheets. The Taguchi method of Experiments of Design (DOE) and Grey relational optimization were used to determine the optimum parameters in SPIF. A response study was performed on formability, spring back, and thickness reduction. The research shows that the optimum combination of these parameters that yield best performance of SPIF is as follows: tool diameter, 6mm; spin speed, 60rpm; step depth, 0.3mm; and feed rate, 500mm/min.

Design of Asynchronous 16-Bit Divider Using NST Algorithm (NST알고리즘을 이용한 비동기식 16비트 제산기 설계)

  • 이우석;박석재;최호용
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.3
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    • pp.33-42
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    • 2003
  • This paper describes an efficient design of an asynchronous 16-bit divider using the NST (new Svoboda-Tung) algorithm. The divider is designed to reduce power consumption by using the asynchronous design scheme in which the division operation is performed only when it is requested. The divider consists of three blocks, i.e. pre-scale block, iteration step block, and on-the-fly converter block using asynchronous pipeline structure. The pre-scale block is designed using a new subtracter to have small area and high performance. The iteration step block consists of an asynchronous ring structure with 4 division steps for area reduction. In other to reduce hardware overhead, the part related to critical path is designed by a dual-rail circuit, and the other part is done by a single-rail circuit in the ring structure. The on-the-fly converter block is designed for high performance using the on-the-fly algorithm that enables parallel operation with iteration step block. The design results with 0.6${\mu}{\textrm}{m}$ CMOS process show that the divider consists of 12,956 transistors with 1,480 $\times$1,200${\mu}{\textrm}{m}$$^2$area and average-case delay is 41.7㎱.

Fabrication technology of the focusing grating coupler using single-step electron beam lithography (Single-step 전자빔 묘화 장치를 이용한 Focusing Grating Coupler 제작 연구)

  • Kim, Tae-Youb;Kim, Yark-Yeon;Sohn, Yeung-Joon;Han, Gee-Pyeong;Paek, Mun-Cheol;Kim, Hae-Sung;Shin, Dong-Hoon;Rhee, Jin-Koo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07b
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    • pp.976-979
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    • 2002
  • A focusing grating coupler (FGC) was not fabricated by the 'Continuous Path Control' writing strategy but by an electron-beam lithography system of more general exposure mode, which matches not only the address grid with the grating period but also an integer multiple of the address grid resolution (5 nm), To more simplify the fabrication, we are able to reduce a process step without large decrease of pattern quality by excluding a conducting material or layer such as metal (Al, Cr, Au), which are deposited on top or bottom of an e-beam resist to prevent charge build-up during e-beam exposure. A grating pitch period and an aperture feature size of the FGC designed and fabricated by e-beam lithography and reactive ion etching were ranged over 384.3 nm to 448.2 nm, and $0.5{\times}0.5mm^2$ area, respectively, This fabrication method presented will reduce processing time and improve the grating quality by means of a consideration of the address grid resolpution, grating direction, pitch size and shapes when exposing. Here our investigations concentrate on the design and efficient fabrication results of the FGC for coupling from slab waveguide to a spot in free space.

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A Resonant-type Step-up DC/DC Converters with Piezoelectric Transducer (압전 트랜스듀서를 이용한 승압형 공진형 직류-직류 컨버터)

  • Park, Joung-Hu;Seo, Gab-Su;Cho, Bo-Hyung;Yi, Kyung-Pyo
    • The Transactions of the Korean Institute of Power Electronics
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    • v.14 no.5
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    • pp.343-354
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    • 2009
  • In this paper, a magnetic-less dc-dc switching converter realizing an integrable power conversion system is described. Instead of magnetic devices, the inductive impedance range of piezoelectric transducers is utilized to store and resonate the energy for soft-switching. Piezoelectric devices have no windings and deliver the power by the electrodes, which lead to mass product through semiconductor-manufacturing process. This paper presents a resonant-type step-up dc-dc power converter employing a disk-type piezoelectric transducer, analyzing the operation principles and the frequency control characteristics. Also, a topology extension of the single stage converter into cascaded multi-stage is presented and analyzed with the operation principles and control characteristics. For verification of the analysis, a 10W output dc-dc power converter hardware was implemented. The hardware experiments shows a good frequency control and power efficiency greater than 96% in the single stage. A hardware prototype of the extended multi-stage one was also realized and tested. The results shows that the converter has the same frequency control performance and high efficiency such as 93%.