• 제목/요약/키워드: Single-chip

검색결과 866건 처리시간 0.028초

Single-Chip Eye Ball Sensor using Smart CIS Pixels

  • Kim, Dongsoo;Seunghyun Lim;Gunhee Han
    • 대한전자공학회:학술대회논문집
    • /
    • 대한전자공학회 2003년도 하계종합학술대회 논문집 II
    • /
    • pp.847-850
    • /
    • 2003
  • An Eye Ball Sensor (EBS) is a system that locates the point where the user gazes on. The conventional EBS using a CCD camera needs many peripherals, software computation causing high cost and power consumption. This paper proposes a compact EBS using smart CMOS Image Sensor (CIS) pixels. The proposed single chip EBS does not need any peripheral and operates at higher speed and lower cost than the conventional EBS. The test chip was designed and fabricated for 32$\times$32 smart CIS pixel array with a 0.35 um CMOS process occupying 5.3$\textrm{mm}^2$ silicon area.

  • PDF

PCS 응용을 위한 CMOS Tx RF/IF 단일 칩 설계 (Design of a CMOS Tx RF/IF Single Chip for PCS Applications)

  • 문요섭;전석희;유종근
    • 대한전자공학회:학술대회논문집
    • /
    • 대한전자공학회 2003년도 하계종합학술대회 논문집 II
    • /
    • pp.795-798
    • /
    • 2003
  • In this paper, a CMOS Tx RF/IF single chip for PCS applications is designed. The chip consumes 84mA from a 3V supply and the layout area without pads is 1.6mm$\times$3.5mm. Simulation results show that the RF block composed of a SSB RF block and a driver amplifier exhibits a gain of 14.8dB and an OIP3 of 7dBm. The image and carrier suppressions are 35dBc and 31dBc, respectively. The designed circuits are under fabrication using a 0.35${\mu}{\textrm}{m}$ CMOS process.

  • PDF

One-Chip Microcontroller를 이용한 단상유도전동기의 기동특성개선 (The Starting Characteristics Improvement of SPIM with One-Chip Microcontroller)

  • 박수강;최낙일;백형래;임양수;박원철
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 1998년도 하계학술대회 논문집 F
    • /
    • pp.1987-1989
    • /
    • 1998
  • A single phase induction motor is predominant in fractional horsepower rating and is widely used in home and industrial equipment. For example, these motors provide the motive power to washing machines, fans, refrigerators, etc. In this paper has presented the design and implementation of a microcontroller software - based self - starting SPIM. The control algorithm used in the experimentation employed simple control strategies which enabled a single chip programmable microcontroller to execute both the self - starting and self - detecting control of SPIM with relatively simplified hardware.

  • PDF

BLDC 전동기의 디지털 속도제어기에 관한 연구 (A Study on the Implementation af a Digital Spaed Controlled BLDC Drive)

  • 노광호;김용;이은영;조규만;이규훈
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 2000년도 하계학술대회 논문집 B
    • /
    • pp.991-993
    • /
    • 2000
  • The paper presents the software control of a brush-less do motor with parameter identification. Not only speed and current controls but also a real-time identification of the motor parameters can be implemented by software using the digital signal processor TMS320F240. The DSP Controller TMS320F240 from Texas Instruments is suitable for a wide range of motor drives TMS320F240 provides a single chip solution by integrating on-chip not only a high computational power but also all the peripherals necessary for electric motor control. This new family of DSPs enables single chip, cost effective, modular and increased performance solutions for BLDC drives. The present paper describes how a speed controlled brushless DC drive can be implemented using TMS320F240 and what kind of results can be achieved.

  • PDF

항공기 기체 가공용 대용량 절삭칩 회수 장치의 설계 평가 (The Design Evaluation of Cutting Chip Collecting Apparatus to Manufacture Aircraft Components)

  • 김광영;김동수;강정호
    • 한국공작기계학회논문집
    • /
    • 제14권6호
    • /
    • pp.110-116
    • /
    • 2005
  • A single-piece-machined-part has superior characteristics to an assembly of several pieces of part especially for aircraft components. It is necessary to develop high efficient 'multi-head router machine' for machining a large size single-piece-part on a large scale. In this type machine, many cutting chips are generated. These chips should be removed automatically f3r productivity and part precision. In this study, the design evaluation of the cutting chip collecting apparatus for 'multi-head router machine' was complemented using performance test and finite element analysis.

ISFET 바이오센서에의 적용을 위한 신호처리회로의 개발과 그들의 단일칩 집적설계 (A Signal Process Circuit for ISFET Biosensor and A Desitgn for Their One-Chip Integration)

  • Hwa Il Seo;Won Hyeong Lee;Soo Won Kim
    • 전자공학회논문지A
    • /
    • 제28A권1호
    • /
    • pp.46-51
    • /
    • 1991
  • The new signal process circuit using ISFETs as two input devices of a MOS differential amplifier stage for application to a ISFET biosensor was developed and its operational characteristics simulated. For a single chip integration of ISFETs, developed signal process circuit and metal reference electrode, serial studies including process development and chip layout was carried out.

  • PDF

A Low-Power Single Chip Li-Ion Battery Protection IC

  • Lee, Seunghyeong;Jeong, Yongjae;Song, Yungwi;Kim, Jongsun
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • 제15권4호
    • /
    • pp.445-453
    • /
    • 2015
  • A fully integrated cost-effective and low-power single chip Lithium-Ion (Li-Ion) battery protection IC (BPIC) for portable devices is presented. The control unit of the battery protection system and the MOSFET switches are integrated in a single package to protect the battery from over-charge, over-discharge, and over-current. The proposed BPIC enters into low-power standby mode when the battery becomes over-discharged. A new auto release function (ARF) is adopted to release the BPIC from standby mode and safely return it to normal operation mode. A new delay shorten mode (DSM) is also proposed to reduce the test time without increasing pin counts. The BPIC implemented in a $0.18-{\mu}m$ CMOS process occupies an area of $750{\mu}m{\times}610{\mu}m$. With DSM enabled, the measured test time is dramatically reduced from 56.82 s to 0.15 s. The BPIC chip consumes $3{\mu}A$ under normal operating conditions and $0.45{\mu}A$ under standby mode.

담체자기조직화법에 의한 고집적 DNA 어레이형 마이크로칩의 개발 (Development of High-Intergrated DNA Array on a Microchip by Fluidic Self-assembly of Particles)

  • 김도균;최용성;권영수
    • 대한전기학회논문지:전기물성ㆍ응용부문C
    • /
    • 제51권7호
    • /
    • pp.328-334
    • /
    • 2002
  • The DNA chips are devices associating the specific recognition properties of two DNA single strands through hybridization process with the performances of the microtechnology. In the literature, the "Gene chip" or "DNA chip" terminology is employed in a wide way and includes macroarrays and microarrays. Standard definitions are not yet clearly exposed. Generally, the difference between macro and microarray concerns the number of active areas and their size, Macroarrays correspond to devices containing some tens spots of 500$\mu$m or larger in diameter. microarrays concern devices containing thousnads spots of size less than 500$\mu$m. The key technical parameters for evaluating microarray-manufacturing technologies include microarray density and design, biochemical composition and versatility, repreducibility, throughput, quality, cost and ease of prototyping. Here we report, a new method in which minute particles are arranged in a random fashion on a chip pattern using random fluidic self-assembly (RFSA) method by hydrophobic interaction. We intend to improve the stability of the particles at the time of arrangement by establishing a wall on the chip pattern, besides distinction of an individual particle is enabled by giving a tag structure. This study demonstrates the fabrication of a chip pattern, immobilization of DNA to the particles and arrangement of the minute particle groups on the chip pattern by hydrophobic interaction.ophobic interaction.

멀티 칩 LED 패키지의 방열 특성 (Thermal Dissipation Characteristics of Multi-Chip LED Packages)

  • 김병호;문철희
    • 조명전기설비학회논문지
    • /
    • 제25권12호
    • /
    • pp.34-41
    • /
    • 2011
  • In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.

VLSI Implementation of H.264 Video Decoder for Mobile Multimedia Application

  • Park, Seong-Mo;Lee, Mi-Young;Kim, Seung-Chul;Shin, Kyoung-Seon;Kim, Ig-Kyun;Cho, Han-Jin;Jung, Hee-Bum;Lee, Duk-Dong
    • ETRI Journal
    • /
    • 제28권4호
    • /
    • pp.525-528
    • /
    • 2006
  • In this letter, we present a design of a single chip video decoder called advanced mobile video ASIC (A-MoVa) for mobile multimedia applications. This chip uses a mixed hardware/software architecture to improve both its performance and its flexibility. We designed the chip using a partition between the hardware and software blocks, and developed the architecture of an H.264 decoder based on the system-on-a-chip (SoC) platform. This chip contains 290,000 logic gates, 670,000 memory gates, and its size is $7.5\;mm{\times}7.5\;mm$ (using 0.25 micron 4-layers metal CMOS technology).

  • PDF