• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Journal of Biosystems Engineering
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• 제20권4호
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• pp.383-389
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• 1995

This study was conducted to develop an automatic nutrient control system for trickle application of nutrient solution. Temperature, electric conductivity(EC). pH and dissolved oxygen(DO) were selected as control variables. A controller using single-chip microcomputer was constructed. An automatic control system for nutrient solution and a controller using single-chip microcomputer with control algorithm were developed. The control system was tested, and could control temperature, EC and pH within the error ranges of $pm 0.2^{circ} pm 0.2mS/cm, pm 0.1pH$, respectively.

• 음성과학
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• 제14권4호
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• pp.157-167
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• 2007

In this paper, we implemented a single-chip speech recognizer using the TMS320C2000 DSPs. For this implementation, we had developed very small-sized speaker-dependent recognition engine based on dynamic time warping, which is especially suited for embedded systems where the system resources are severely limited. We carried out some optimizations including speed optimization by programming time-critical functions in assembly language, and code size optimization and effective memory allocation. For the TMS320F2801 DSP which has 12Kbyte SRAM and 32Kbyte flash ROM, the recognizer developed can recognize 10 commands. For the TMS320F2808 DSP which has 36Kbyte SRAM and 128Kbyte flash ROM, it has additional capability of outputting the speech sound corresponding to the recognition result. The speech sounds for response, which are captured when the user trains commands, are encoded using ADPCM and saved on flash ROM. The single-chip recognizer needs few parts except for a DSP itself and an OP amp for amplifying microphone output and anti-aliasing. Therefore, this recognizer may play a similar role to dedicated speech recognition chips.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.723-724
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• 2006

Exploiting the instruction level parallelism encountered with the limit. Single chip multiprocessor was introduced to overcome the limit of traditional processor using the instruction level parallelism. Also, a branch miss prediction is one of the causes that reduce the processor performance. In order to overcome the problems, in this paper, we make single chip multiprocessor having the idle core execute the two control flow of conditional branch. This scheme is a kind of multi-path execution technique based on single chip multiprocessor architecture.

• Biotechnology and Bioprocess Engineering:BBE
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• 제9권2호
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• pp.86-92
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• 2004

In this paper miniaturized disposable micro/nanofluidic components applicable to bio chip, chemical analyzer and biomedical monitoring system, such as blood analysis, micro dosing system and cell experiment, etc are reported. This system includes various microfluidic components including a micropump, micromixer, DNA purification chip and single-cell assay chip. For low voltage and low power operation, a surface tension-driven micropump is presented, as well as a micromixer, which was implemented using MEMS technology, for efficient liquid mixing is also introduced. As bio-reactors, DNA purification and single-cell assay devices, for the extraction of pure DNA from liquid mixture or blood and for cellular engineering or high-throughput screening, respectively, are presented.

• International Journal of Precision Engineering and Manufacturing
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• 제1권1호
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• pp.15-21
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• 2000

This study presents a procedure for analyzing chip-tool friction and shear processes in 3-D cutting with a single point tool. The edge of a single point tool including a circular nose is modified to an equivalent straight edge, thereby reducing the 3-D cutting with a single point tool to the equivalent of oblique cutting. Then, by transforming the conventional coordinate systems and using the measurements of three cutting force components, the force components on the rake face and shear plane of the equivalent oblique cutting system can be obtained. As a result, the chip-tool friction and shear characteristics of 3-D cutting with a single point tool can be assessed.

• 대한전자공학회논문지SP
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• 제44권5호
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• pp.103-111
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• 2007

본 논문에서는 single-chip CMOS Image Sensor(CIS)용 고화질 image signal processor(ISP)에 최적화된 하드웨어 구조를 제안한다. Single-chip CIS는 CIS와 ISP가 하나의 칩으로 구현된 것으로, 다양한 휴대기기에 사용된다. 휴대기기의 특성상, single-chip CIS용 ISP는 고화질이면서도 저전력을 위해 하드웨어 복잡도를 최소화해야 한다. 영상의 품질 향상을 위해서 다양한 영상 처리 블록들이 ISP에 적용되지만, 그 중에 핵심이면서 하드웨어 복잡도가 가장 큰 블록은 컬러 영상을 만들기 위한 색 보간 블록과 영상을 선명하게 하기 위한 화질 개선 필터 블록이다. 이들 블록은 데이터 처리를 위한 로직 외에도 라인 메모리를 필요로 하기 때문에 ISP의 하드웨어 복잡도의 대부분을 차지한다. 기존 ISP에서는 색 보간과 화질 개선 필터를 독립적으로 수행하였기 때문에 많은 수의 라인 메모리가 필요하였다. 따라서 하드웨어 복잡도를 낮추기 위해서는 낮은 성능의 색보간 알고리즘을 적용하거나, 화질 개선 필터를 사용하지 않아야 했다. 본 논문에서는 화질 개선을 위해 경계 적응적이면서 채널간 상관관계를 고려하는 고화질 색 보간 알고리즘을 적용하였다. 또한 채널 간 상관관계를 고려하는 색 보간 알고리즘의 특성을 이용하여 색 보간 블록과 화질 개선 필터 블록이 라인 메모리를 공유하도록 설계함으로써, 전체 라인 메모리 수를 최소화하는 새로운 구조를 제안한다. 제안된 방법을 적용하면 화질 개선 필터 블록을 위한 추가적인 라인 메모리가 불필요하기 때문에, 고화질과 낮은 복잡도 모두를 만족시킬 수 있다. 제안 방식과 기존 방식의 MSE(Mean Square Error)는 0.37로, 메모리 공유로 인한 화질의 저하는 거의 없었고, 고화질 색 보간 알고리즘을 적용했기 때문에 전체적인 화질은 향상되었다. 제안된 ISP 구조는 Verilog HDL 및 FPGA를 이용하여 실시간으로 구현 검증되었다. 0.25um CMOS 표준 셀 라이브러리를 이용하여 합성하였을 때, 총 게이트 수는 37K개였으며 7.5개의 라인 메모리가 사용되었다.

• 대한기계학회논문집B
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• 제21권8호
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• pp.973-982
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• 1997

Effect of vortex generator on the heat transfer enhancement of electronic chips is investigated using naphthalene sublimation technique. Experiments are performed for a single chip and chip arrays, and shape of vortex generator, position of vortex generator, stream wise chip spacing and air velocity are varied. Local and average heat transfer coefficients are measured on the top surface of simulated electronic chips, and compared with those obtained without vortex generator. In case of a single chip, heat transfer augmentation is seen only on the upstream portion of chip surface, while heat transfer enhancement is found on the whole surface for chip arrays. Rectangular wing type vortex generator is found to be more effective than delta wing.

• 한국전기전자재료학회논문지
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• 제19권11호
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• pp.994-999
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• 2006

For low-cost embedded EEPROM, in this paper, single polysilicon EEPROM and n-channel high-voltage LDMOST device are developed in a $0.25{\mu}m$ standard CMOS logic process. Using these devices developed, the EEPROM chip is fabricated. The fabricated EEPROM chip is composed of 1 Kbit single polysilicon EEPROM away and high voltage driver circuits. The program and erase characteristics of the fabricated EEPROM chip are evaluated using 'STA-EL421C'. The fabricated n-channel high-voltage LDMOST device operation voltage is over 10 V and threshold voltage window between program and erase states of the memory cell is about 2.0 V.

• Nuclear Engineering and Technology
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• 제55권3호
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• pp.1015-1020
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• 2023

A multi-layer design is applied to mitigate single event effect (SEE) in a 28 nm System-on-Chip (SoC). It depends on asymmetric multiprocessing (AMP), redundancy and system watchdog. Irradiation tests utilized 70 and 90 MeV proton beams to examine its performance through comparative analysis. Via examining SEEs in on-chip memory (OCM), compared with the trial without applying the multi-layer design, the test results demonstrate that the adopted multi-layer design can effectively mitigate SEEs in the SoC.