• 제목/요약/키워드: Single crystalline

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PC1D를 이용한 결정질 실리콘 태양전지 최적화 (Optimization of High Efficiency Single Crystalline Silicon Solar Cell by Using PC1D)

  • 이용우;이영석;한규민;이준신
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.195-196
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    • 2008

  • 결정질 실리콘 웨이퍼의 도핑농도와 도핑깊이, 비저항은 태양전지의 효율을 결정하는데 매우 중요한 요소이다. 높은 효율을 갖는 태양전지의 설계를 위해 PC1D를 이용해 태양전지의 에미터 도핑농도와 깊이, 베이스 비저항을 조절하였다. 최적화 결과 emitter peak doping $1\times10^{19}cm^{-3}$와 depth factor $1{\mu}m$, base $\rho$ $ 0.1\Omega$-cm, 즉 sheet resistance $69.15\Omega$/square와 $X_j$ $1.603{\mu}m$일 때 $I_{sc}$ = 5.478(A), $V_{oc}$ = 0.7013(V), $P_{max}$ = 2.828(W), FF = 73.61(%), Efficiency = 19.03(%)의 고효율을 얻을 수 있다.

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MEMS 응용을 위한 $Ar^+$ 이온 레이저에 의한 단결정/다결정 실리콘 식각 특성 (Characteristics of single/poly crystalline silicon etching by$Ar^+$ ion laser for MEMS applications)

  • 이현기;한승오;박정호;이천
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제48권5호
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    • pp.396-401
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    • 1999

  • In this study, $Ar^+$ ion laser etching process of single/poly-crystalline Si with $CCl_2F_2$ gas is investigated for MEMS applications. In general, laser direct etching process is useful in microelectronic process, fabrication of micro sensors and actuators, rapid prototyping, and complementary processing because of the advantages of 3D micromachining, local etching/deposition process, and maskless process with high resolution. In this study, a pyrolytic method, in which $CCl_2F_2$ gasetches molten Si by the focused laser, was used. In order to analyze the temperature profile of Si by the focused laser, the 3D heat conduction equation was analytically solved. In order to investigate the process parameters dependence of etching characteristics, laser power, $CCl_2F_2$ gas pressure, and scanning speed were varied and the experimental results were observed by SEM. The aspect ratio was measured in multiple scanning and the simple 3D structure was fabricated. In addition, the etching characteristics of $6\mum$ thick poly-crystalline Si on the insulator was investigated to obtain flat bottom and vertical side wall for MEMS applications.

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