• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.79-84
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• 2014

To investigate the plating properties of a diethylene glycol-based Ag immersion plating solution containing citric acid, silver immersion plating was performed in a range from room temperature to $50^{\circ}C$ using sputtered Cu specimens. The used Cu specimens possessed surface structure with large numbers of pinholes which were created with over-acid etching. The Ag immersion plating performed at $40^{\circ}C$ exhibited that the pinholes and copper surface were completely filled with Ag just after 5 min mainly due to galvanic displacement reaction, indicating the best plating properties. Subsequently, the surface morphology of Ag-coated Cu became rougher as the plating time increased to 30 min because of the deposition of silver nanoparticles created by chemical reduction in the solution. The specimen that its overall surface was covered with silver indicated the start of oxidation at temperature higher than around $50^{\circ}C$ in air as compared with pure Cu, indicating enhanced anti-oxidation properties.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.127-128
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• 2014

현재 기술 산업에서 PET위 무전해 도금을 실행하기 위해 다양한 전처리 공정과 Catalyst가 소개되고 있다. 그 중에서 가장 일반적으로 사용되고 있는 Catalyst는 Palladium으로서 Tin과 산화 환원 반응으로 Electroless Copper Deposition 단계에서 구리 도금의 Target으로 작용하고 있다. 하지만 상대적으로 Palladium은 생산 비용이 높으며 Tin은 쉽게 산화되는 문제점이 남아 있다. 이를 대체하기 위한 대안 공정으로서 Palladium 대신 Silver를 이용하여 Catalyst로서의 역할을 하는 공정이다. 이전에 PET위 전처리 공정으로 Ultra Violet을 사용하여 표면을 개질 시키는 방법을 연구했으며, 그 후 Potassium Permanganate와 Silver Catalyst의 Mechanism을 연구 했다. PET 표면 개질을 거치면서 화학 구조가 바뀌어 표면에 Carbon Carbon Double Bond를 형성한다. 이때 Permanganate ion이 새로이 형성된 이중 결합과 반응하여 두 개의 extra-OH functional group을 생성함과 동시에 $MnO_2$를 만들어 표면에 흡착 시킨다. $MnO_2$는 전위차에 의해 Silver Ion과 Redox Reaction을 일으키며 실질적인 Catalyst 역할을 하게 된다. Silver Catalyst는 무전해 구리 도금 용액 안에서 Copper의 Target으로 작용한다.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1225-1226
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• 2006

Particles of high strength material when coated with silver offer a means of obtaining desirable electrical properties and high strength. The coating process employed aqueous ammoniacal silver-nitrate electrolytes with a formaldehyde solution as the reductant. Modifying additives were also applied. The reduction and subsequent deposition of silver occurred selectively on the surface of the tungsten particles. The morphologies of the coated particles were assessed by SEM imaging. The silver was uniformed coated on tungsten powder and its thickness was estimated to be approximately 100nm on the basis of a mass account.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.257-264
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• 1999

Thin reflective films are synthesized by using PVD methods with a bright metal of Al or Ag. For purposes of improving the reflectance and adhesion of such films particularly, substrate bias was applied during sputtering (namely, ion-plating) to enhance the deposition process with higher energy. And we succeeded in fabricating a quality silver film which possesses an adhesion of $85{\;}Kg/\textrm{cm}^2$ and a high reflectivity of more than 96%. Both of reflectivity and adhesion are better in case of bias sputtering as controlled than nonbias sputtering, particularly the bias of 50-100 V showed most effective. The microstructures of sample films were examined by using various equipments and the XRD spectrum in particular showed that <111> direction is the preferred growth orientation.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.97-97
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• 2017

This study investigated the corrosion protection by electrodeposited copper layer on AZ31 Mg alloy with and without additional silver layer by immersion test, salt spray test, OCP transient and potentiodynamic polarization experiment. The single electrodeposited Cu layer on AZ31 Mg alloy showed a nodular structure with many imperfections of crevices between the nodules, which resulted in the fast initiation of pitting corrosion within first few hours of immersion. Double-layer coating of Cu and outer Ag layer slightly increased the initiation time for pitting corrosion. Triple-layer coatings of Cu/Ag/Cu exhibited the most efficient corrosion protection of AZ31 Mg alloy, compared to the single- and double-layer coatings. Surface morphology of the outer Cu layer in the triple-layer was changed from the nodular structure to fine particle structure with no crevices due to the presence of an additional Ag layer. Thus, the improved corrosion resistance of AZ31 Mg alloy by electrodeposited Cu/Ag or Cu/Ag/Cu layers is readily ascribed to the decreased number of imperfections in the electrodeposited layers due to the additional silver layer. It is concluded that the additional silver layer provides many nucleation sites for the second Cu plating, resulting in the formation of finer and denser structure than the first Cu electrodeposit.

• Proceedings of the Korean Magnestics Society Conference
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• 2001.04a
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• pp.146-147
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• 2001

• Journal of Powder Materials
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• v.15 no.3
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• pp.221-226
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• 2008

Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution $(NH_4OH/(NH_4)_2SO_4)$ at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were $NH_4OH/(NH_4)_2SO_4$ molar ratio 4, concentration of reductant 15g/l and feeding rate of silver ions solution 2 ml/min.

• Journal of Electrochemical Science and Technology
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• v.8 no.3
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• pp.215-221
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• 2017

The electroless plating process largely consists of substrate cleaning, seed formation (activator formation), and electroless plating. The most widely used activator in the seed formation step is Pd, and Sn ions are used to facilitate the formation of this Pd seed layer. This is problematic because the Sn ions interfere with the reduction of Cu ions during electroless plating; thus, the Sn ions must be removed by a hydrochloric acid cleaning process. This method is also expensive due to the use of Pd. In this study, Cu electroless plating was performed by forming a seed layer using a silver nanosol instead of Pd and Sn. The effects of the Ag nanosol concentration in the pretreatment solution and the pretreatment time on the thickness and surface morphology of the Cu layer were investigated. The degrees of adhesion to the substrate were similar for the electroless-plated Cu layers formed by conventional Pd activation and those formed by the Ag nanosol.

• Journal of the Korean Society of Clothing and Textiles
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• v.29 no.1 s.139
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• pp.149-156
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• 2005

The purpose of this study was to produce the high quality of electromagnetic wave shielding fabrics. In this study, we have produced polyester fabrics by electroless Ag plating. The untreated polyester was etched with $4\%$ NaOH solution added accelerant(Benzyl Dimethyl Dodecyl Ammonium Chloride) then it was catalyzed by $SnCl_2$ solution and activated by $PdCl_2$ solution. Electroless Ag plating was carried out by changing conditions such as temperature. time, weight loss rate of polyester and kind of reducing agents. The electromagnetic wave shielding effectiveness of polyester fabric by electroless Ag plating was measured by RF Impedance Analyzer and element of electromagnetic wave shielding substance was measured using Electron probe micro analyzer. The results were as follows; The plating bath using potassium sodium tartrate by reducing agent was excellent electromagnetic wave shielding effectiveness. Element of electromagnetic wave shielding substance was silver. Electromagnetic wave shielding effectiveness was shown over 64dB at the temperature of $40^{\circ}C$, treating time 30min., weight loss rate $20\%$.

• Resources Recycling
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• v.32 no.2
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• pp.12-18
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• 2023

In 2018, the demand for silver (referred to as Ag) in the electrical and electronics sector was 249 million tons. The demand stood at 81 million tons in the solar module production sector. Currently, due to the rapid increase in solar module installation, the demand for silver is increasing drastically in Korea. However, Korea's natural metal resources and reserves are insufficient in comparison to their consumption, and the domestic silver ore self-sufficiency rate was as low as 2.2% as of 2021. This implies that a recycling technology is necessary to recover valuable metal resources contained in the waste plating solution generated in the metal industry. Therefore, this study compared and analyzed, the results of the impact evaluation through life cycle assessment according to an improvement in the process of recovery of valuable metals in the waste plating solution. The process improvement resulted in reducing GWP (Global Warming Potential) and ADP(Abiotic Depletion Potential) by 50% and 67%, respectively. The GWP of electricity and industrial water was reduced by 98% and 93%, respectively, which significantly contributed to the minimization of energy and water consumption. Thus, the improvement in recycling technology has a high potential to reduce chemical and energy use and improve resource productivity in the urban mining industry.