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http://dx.doi.org/10.4150/KPMI.2008.15.3.221

Synthesis of Ag-Cu Composite Powders for Electronic Materials by Electroless Plating Method  

Yoon, C.H. (Minerals and Material Processing Division, Korea Institute of Geosciences and Mineral Resources(KIGAM))
Ahn, J.G. (Minerals and Material Processing Division, Korea Institute of Geosciences and Mineral Resources(KIGAM))
Kim, D.J. (Minerals and Material Processing Division, Korea Institute of Geosciences and Mineral Resources(KIGAM))
Sohn, J.S. (Minerals and Material Processing Division, Korea Institute of Geosciences and Mineral Resources(KIGAM))
Park, J.S. (Minerals and Material Processing Division, Korea Institute of Geosciences and Mineral Resources(KIGAM))
Ahn, Y.G. (Department of chemistry, Konyang University)
Publication Information
Journal of Powder Materials / v.15, no.3, 2008 , pp. 221-226 More about this Journal
Abstract
Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution $(NH_4OH/(NH_4)_2SO_4)$ at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were $NH_4OH/(NH_4)_2SO_4$ molar ratio 4, concentration of reductant 15g/l and feeding rate of silver ions solution 2 ml/min.
Keywords
Ag-Cu composite powders; Electroless plating; Electronic materials; EMI shielding; Surface characteristics;
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Times Cited By KSCI : 3  (Citation Analysis)
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