• Journal of Electrical Engineering and Technology
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• 제7권1호
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• pp.91-96
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• 2012

We introduce an understanding of silver (Ag) inkjet overlap-printing characteristics from the viewpoints of cohesion between ink droplets and adhesion between an ink droplet and a surface. The printing characteristics were closely monitored by changing the surface energy to elucidate the effect of adhesion and cohesion on printing instability, such as droplet merging and line bulging. The surface energy of the substrate was changed through the hydrophilization of a hydrophobic fluorocarbon-coated surface. The surface energy and ink wettability of the prepared surfaces were characterized using sessile drop contact angle analysis, and printing instability was observed using an optical microscope after drop-on-demand inkjet printing with a 50% overlap in diameter of deposited singlet patterns. We found that the surface energy is not an appropriate indicator based on the experimental results of Ag ink printing on a hydrofluoric-treated silicon surface. The analytical approach using adhesion and cohesion was helpful in understanding the instability of the inkjet overlap-printing, as adhesion and cohesion represent the direct interfacial relationship between the Ag inks used and the substrate.

• 한국세라믹학회지
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• 제41권10호
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• pp.788-791
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• 2004

입자크기가 수 nm인 고농도 은 나노 졸을 이용하여 잉크젯 기법으로 은 미세라인을 형성하고자 하였다. 고분자전해질을 사용하여 합성한 $10wt\%$ 농도의 은 나노 졸의 입자크기는 10nm 이하였으며, 은 나노 졸을 이용한 미세 라인의 인쇄특성은 은 나노 졸의 접촉각에 매우 깊은 관계를 갖고 있었다. 순수한 ITO 기판에서 은 나노 졸은 높은 접촉각을 나타내었으며, dot 형상이 나타났다. 그러나 100ppm의 Polyethylenimine(PEI)을 코팅한 ITO 기판은 젖음성이 크게 개선되었으며, 잉크젯 기법을 이용하여 $60\~100{\mu}m$의 선폭을 갖는 은 나노 졸의 미세라인 형성이 가능함을 확인할 수 있었다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1491-1494
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• 2005

We have studied ink-jet printing method for patterning conductive line on flexible plastic substrates. Synthesized silver nano-particles of ${\sim}$20nm were used for the conductive ink and the printed patterns exhibit a smooth line whose linewidth is below 100 ${\mu}m$. This ink-jet printing technique can be applied to flexible displays and electronics.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1525_1526
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• 2009

In this paper, we have studied the bulging phenomenon of ink-jet printed silver lines. The used silver inks are DGP-40LT-15C and DGH-55HTG of Advanced Nano Product (ANP) Company. We investigated the behavior of bulging by changing the polarity of the inks, the surface energy of substrate and droplet spacing in printing. The contact angle of the polar inks increased much more sensitively than the nonpolar ink as the surface energy of the substrate increases. In the case of the nonpolar ink, the bulging phenomenon occurred seriously as the droplet spacing decreased at the constant surface energy.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1553-1555
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• 2008

Super-hydrophobic treated Polyimide film was used as a flexible substrate for developing a new method of metallization. Hydrophilic patterns were fabricated by IN irradiation through shadow mask. Patterned super-hydrophobic substrate was dipped into a bath containing silver nano ink Silver ink was only coated on hydrophilic patterned area. Metal lines of $600{\mu}m$ pitch were fabricated successfully. However, their thickness was too thin to serve as interconnection. To overcome this problem, iterative dipping was conducted. After repeating five times, the thickness of silver metal lines were increased to over than $2{\mu}$. After heat treatment of silver lines, their resistivities were reduced to order of $30{\mu}{\Omega}$-cm the similar level of values reported in other literatures. So, a new method of metallization has high potential for application of RFID antenna and flexible electronics substrates.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.623-624
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• 2013

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.951-952
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.549-550
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• 2007

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.889-892
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• 2009

We have developed a practical printing technology for the gate electrode of organic thin film transistors(OTFTs) by combining screen-printing with wet-etching process using nano-silver ink as a conducting material. The screen-printed and wet-etched Ag electrode exhibited a minimum line width of ~5 um, the thickness of ~65 nm, and a resistivity of ${\sim}10^{-6}{\Omega}{\cdot}cm$, producing good geometrical and electrical characteristics for gate electrode. The OTFTs with the screen-printed and wet-etched Ag electrode produced the saturation mobility of $0.13cm^2$/Vs and current on/off ratio of $1.79{\times}10^6$, being comparable to those of OTFT with the thermally evaporated Al gate electrode.

• 센서학회지
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• 제32권4호
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• pp.252-256
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• 2023

A one-step method for nanoscale patterning of silver ionic ink on a substrate is developed using a microscale, elastic mold deformation. This method yields unique micro/nanoscale metallic structures that differ from those produced using the original molds. The linewidth of these metallic structures is significantly reduced (approximately 10 times) through the sidewall deformation of the original mold cavity on a thin liquid film, as verified by finite element analysis. The process facilitates the fabrication of various, isolated and complex micro/nanoscale metallic structures with negligible residual layers at low cost and high throughput. These structures can be utilized for various applications, including optoelectronics, wearable sensors, and metaverse-related devices. Our approach offers a promising tool for manipulation and fabrication of micro/nanoscale structures of various functional materials.