• The Journal of Korean Academy of Prosthodontics
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• 제34권1호
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• pp.125-142
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• 1996

Bond strength of four different cements to dental casting alloys which were treated with #600 emery, tin-plating, and $50{\mu}m$ sandblasting were evaluated. The alloy specimens were Type III Gold alloy(Degulor C), Palladium-Silver alloy(Pors on 4), Nickel-Chromium(Rexillium III) alloy, which were embedded in acrylic resin disc. The specimens were treated with #600 emery and tin plating, #600 emery and sandblasting, then bonded using Fuji I, Ketac Cem(Glass ionomer cements), Poly F, Livcarbo(Polycarboxylate cements). The specimens were immersed in water for 24 hours and shear bond strengths were evaluated by Instron Machine. Tin plated, sandblasted, and debonded alloy surfaces were observed using scanning electron microscope. On the basis of this study, the following conclusions could be drawn. 1. In the tin plated alloy group, increase in bond strength of glass ionomer cements was statistically insignificant. 2. In the tin plated alloy group, increase in bond strength of polycarboxylate cements was statistically significant, except nickel-chromium alloy. 3. Sandblasted alloy group showed higher bond strength than that of tin-plated alloy group.

• Journal of the Korean Society for Heat Treatment
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• 제24권5호
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• pp.243-250
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• 2011

When alloys are vacuum-deposited on cooled substrates, super-rapidly cooled alloy films in the unequilibrium state can be obtained. As an application of this method, Ag-Cu, Ag-Ni and Ag-C alloys were successfully produced, and their mechanical properties with tempering temperature were investigated. The following results were obtained : (1) In case of Ag-Cu alloys, the solid solution was hardened by tempering at $150^{\circ}C$. The hardening is considered to occur when the solid solution begins to decompose into ${\alpha}$ and ${\beta}$ phases. The Knoop hardness number of a 40 at.%Ag-Cu alloy film deposited on a cooled glass substrate was 390 $kg/mm^2$. The as-deposited films were generally very hard but fractured under stresses below their elastic limits. (2) In case of Ag-Ni and Ag-C alloys, after the tempering of 4 at.%Ni-Ag alloy at $400^{\circ}C$ and of 1 and 2 at.%C-Ag alloys at $200^{\circ}C$, they were hardened by the precipitation of fine nickel and carbon particles. The linear relationship between proof stress vs. $(grain\;diameter)^{-l/2}$ for bulk silver polycrystals can be applied to vacuum-deposited films up to about 0.1 ${\mu}m$ grain diameter, but the proof stress of ultra-fine grained silver with grain diameters of less than 0.1 ${\mu}m$ was smaller than the value expected from the Petch's relation.

• Journal of Korea Foundry Society
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• 제22권5호
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• pp.265-270
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• 2002

A novel jewelry master pattern manufacturing process which reduce manufacturing steps by employing a Duraform rapid prototyping mold and a low melting alloy has been suggested. The novel process follows the steps of 'jewelry 3D CAD design ${\rightarrow}$ Durafrom RP mold ${\rightarrow}$ low melting alloy master pattern' while the previous process follows more complicated steps of 'jewelry idea sketch ${\rightarrow}$ detailed drawing ${\rightarrow}$ wax carving ${\rightarrow}$ flask ${\rightarrow}$ silver master pattern.' An upper and a lower part of molds have been manufactured of Duraform powder, of which melting point is $190^{\circ}C$. A maser pattern was manufactured by pouring a low melting alloy of Pb-Sn-Bi-Cd, so called Woods Metal, of which melting point is $70^{\circ}C$, into the mold. The master pattern is a shape of a disk of 20mm diameter that contains various design factors. The variations of dimensions, surface roughness, surface pore ratio were measured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of were maeasured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of low melting alloy has sufficient surface hardness, and surface pore ratio to be used as the jewelry master pattern.

• The Journal of Korean Academy of Prosthodontics
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• 제27권1호
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• pp.143-179
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• 1989

To observe the bonding behavior of palladium-based alloys to porcelain; 1. Pd-Co binary alloy with the higher cobalt content, 2. Pd-Co binary alloy with the lower cobalt content, 3. Pd-Ag-Sn ternary alloy, 4. Pd-Ag binary alloy, 5. Pd-Cu-Au ternary alloy and 6. Pd-Cu binary alloy were made as 6 groups of experimental alloys. Each group of alloy was divided into 4 sub-groups such as one sub-group that was not degassed and three sub-groups that degassed for 5 minutes, 10 minutes and 15 minutes. On each specimen, weight changes after degassing, morphological changes of oxide layer by changing the degassing time, compositional changes at metal-ceramic interface and bond strength of metal-ceramic measured with planar shear test were observed and compared. The results of the present study allow the following conclusions to be drawn: 1. The alloy showing the greatest bond strength was Pd-Cu alloy without gold and bond strength was decreased by alloying gold to them. 2. Although Pd-Co alloy showed the most prominent oxidation behavior, bond strength of them to porcelain was not greatly high by the formation of porosities at metal-ceramic interfaces. 3. Likewise tin, cobalt formed the peaks on line profiles at metal-ceramic interface, however copper did not exhibit such peaks on line profiles. 4. Mainly, oxide layer on Pd-Co alloy was composed with cobalt, and for Pd-Co alloy with higher cobalt content the rise of bond strength was not significant by increased degassing time. 5. On Pd-Ag alloy not containing tin, during degassing for 15 minutes silver content was increased at metal-ceramic interface. 6. As an oxidized element, tin formed the oxide layers that widen their area by increasing the degassing time, while cobalt and copper showed the morphological changes of particle or crystal on oxide layer.

• Transactions on Electrical and Electronic Materials
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• 제15권5호
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• pp.275-278
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• 2014

We deposited TiAgN and ZrAgN nanocomposite coatings on pure Titanium specimens, by using arc ion plating (AIP) with single alloy targets. TiAg ZrAg alloy targets of 5 wt.%, 10 wt.% silver content by vacuum arc remelting (VAR), followed by homogenization for 2 hours at $1,100^{\circ}C$ in non-active Ar gas atmosphere and characterized these samples for morphology and chemical composition. We investigated the biocompatibility of TiAg and ZrAg alloys by examining the proliferation of L929 fibroblast cells by MTT test assay, after culturing the cells ($4{\times}10^4cells/cm^2$) for 24 hours; and exploring the antibacterial properties of thin films by culturing Streptococus Mutans (KCTC3065), using paper disk techniques. Our results showed no cytotoxic effects in any of the specimens, but the antibacterial effects against Streptococus Mutans appeared only in the 10 wt.% silver content specimens.

• The Journal of Korean Academy of Prosthodontics
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• 제27권1호
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• pp.31-47
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• 1989

The purpose of this study was to evaluate the chemical bond strength of successively recast Pd-Ag ceramic alloys with porcelain and to investigate changes of quantity of trace elements at the metal-porcelain interface. Porcelain was fired as usual manner on the each successively recast specimen. Rectangular planar shear test was performed and bond strength was measured by Instron universal testing machine. Diffusion of trace elements at the each interface was observed by ESCA (Electron Spectroscopy for Chemical Analysis). The obtained results were as follows : 1. Chemical bond strength was significantly decreased after second recasting. But in case of first recasting, there was no significant decrease of bond strength statistically (p<0.05). 2. Bond strength was not significantly decreased in each generation, when fifty percents new alloy was added (p<0.05). 3. Ag, Sn and In were observed at the porcelain interface. But Pd was not observed. 4. The quantity of Ag, In ions were progressively increased at the metal-porcelain interface as the casting was repeated. Silver ion was most significantly increased.

• Journal of the Korean Ceramic Society
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• 제43권4호
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• pp.224-229
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• 2006

Ag-Pd alloy nanoparticles were prepared by a chemical reduction method using hydrazine $(N_2H_4)$ as a reductant in $AgNO_3\;and\;Pd(NO_3)_2$ aqueous solutions. Characterization of these particles by X-ray powder diffraction revealed a bimetallic and crystalline silver-palladium alloy. The average size of the particles was influenced not by the reductant $(N_2H_4)$ concentration, but the concentration of the starting materials $(AgNO_3\;and\;Pd(NO_3)_2)$.

• Journal of Technologic Dentistry
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• 제31권3호
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• pp.15-20
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• 2009

The success of the porcelain fused to gold alloy restoration depends not only on the choice of materials but to a larger degree on the technical skills. The porcelain fused to metal(PFM) alloys containing gold are commonly use for dental purposes in dental laboratory. The gold-colored alloys contain primarily gold, platinum, palladium, and silver, with minimum amounts of such metals as tin, iridium, or titanium. The purpose of this study is on the metal-porcelain fusing layer in porcelain fused to high gold alloy Principal results are as follows. The hardness number(Hv) of PFG is respectively $140.2{\pm}12.6$ in as-casted, $164.3{\pm}14.3$ in heat-treated, $186.6{\pm}20.4$ in fired-treated. The formation of the fusing(intermediate) layer caused by components fusing the interface of porcelain and gold alloy. The main components of the fusing(intermediate) layer are Na, Al, Si, K, Zn, Zr and Ce. The intermediate layer formed by the 2nd firing is more larger than the intermediate layer formed by the 1st firing.

• Korean Journal of Materials Research
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• 제16권4호
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• pp.257-263
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• 2006

We have investigated the effect of silver added to Cu films on the microstructure evolution, resistivity, surface morphology, stress relaxation temperature, and adhesion properties of Cu(Ag) alloy thin films deposited on Mo glue layer upon annealing. In addition, pure Cu films deposited on Mo has been annealed and compared. The results show that the silver in Cu(Ag) thin films control the grain growth through the coarsening of its precipitates upon annealing at $300^{\circ}C{\sim}600^{\circ}C$ and the grain growth of Cu reveals the activation energy of 0.22 eV, approximately one third of activation energy for diffusion of Ag dopant along the grain boundaries in Cu matrix (0.75 eV). This indicates that the grain growth can be controlled by Ag diffusion along the grain boundaries. In addition, the grain growth can be a major contributor to the decreased resistivity of Cu(Ag) alloy thin films at the temperature of $300^{\circ}C{\sim}500^{\circ}C$, and decreases the resistivity of Cu(Ag) thin films to $1.96{\mu}{\Omega}-cm$ after annealing at $600^{\circ}C$. Furthermore, the addition of Ag increases the stress relaxation temperature of Cu(Ag) thin films, and thus leading to the enhanced resistance to the void formation, which starts at $300^{\circ}C$ in the pure Cu thin films. Moreover, Cu(Ag) thin films shows the increased adhesion properties, possibly resulting from the Ag segregating to the interface. Consequently, the Cu(Ag) thin films can be used as a metallization of advanced TFT-LCDs.

• Economic and Environmental Geology
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• 제24권2호
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• pp.151-165
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• 1991

The Au-Ag deposits of the Euiseong area occurred in quartz veins which filled fissures in Cretaceous sedimentary and volcanic rocks. These ore veins can be classified in two types of deposits based on metallic mineral assemblages as follow: a pyrite type gold-silver deposit (Hoedong mine), characterized by Cu sulfides with Au-Ag alloy, and a Sb-rich silver deposit (Keumdongdo mine), characterized by base metal with Ag-bearing sulfosalts. Mineralogic and fluid inclusion evidences suggest that the ore minerals of these deposits was deposited from initial high temperatures (near $350^{\circ}C$) to later lower temperatures ($200^{\circ}C$) with moderate salinity fluids ranging from 5.8 to 3.8 eq. wt. % NaCl. The gold-silver mineralization of the Hoedong mine occurred at temperatures between 300 and $200^{\circ}C$ from fluids with log $f_{s_2}$ of -10 ~ -16 atm. The antimony - silver mineralization of the Keumdongdo mine were deposited at the higher temperatures (350 to $250^{\circ}C$) and $f_{S_2}$ (-10 ~ -13 atm) than gold mineralization of the Hoedong mine. The calculated log f02 of fluids at $250^{\circ}C$ in two deposits are -32 to -34 atm and -36.5 to -38.5 atm, respectively. Boiling evidences indicate that the ore mineralization of the Hoedong mine occurred at more shallow depth (0.5km) than that (1km) of the Keumdongdo mine. The above differences of depositional environments between two deposits caused the compositional changes of ore minerals such as electrum and sphalerite.