• Journal of Korean Ophthalmic Optics Society
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• v.3 no.1
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• pp.39-73
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• 1998

In the 60's to 70's, frame selection was a purely mechanical consideration almost entirely dominated by the optician and his subjective judgments. Toddy the cosmetic factor is predominant. The variety of frame color, materials, and style means that the main burden of selection has passed to the customer, leaving the optician control a subtle factor often difficult to exert. Common materials include nickel silver, Hi-nickel alloy, bronze, stainless steel, gold, gold plated, gold clad, copper beryllium, titanium and sometimes aluminium. In manufacturing of metal frames with the materials, even though fashion is the stimulant of consumer demand, all the metal frame for the prescription to refractive correction should be designed correctly styled eyewear which is cosmetically pleasing, functional correct, physically comfortable, mechanically and structurally perfectible, and temperamentally acceptable.

• Analytical Science and Technology
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• v.7 no.3
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• pp.371-378
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• 1994

The detection range of this galvanic oxygen sensor for oxygen concentration was 0.0% to 20.0%. By using gold or silver as cathode, reproducible response time and sensitivity to change of oxygen concentration were observed. The anode was Pb-Sn-Ca alloy. Oxygen selective permeable membrane was hydrophobic and porous Teflon film. The effect of the membranes varying in thickness have been studied on the temperature($10{\sim}50^{\circ}C$) and relative humidity(R. H 0~99%). Lead acetate buffer solution as the electrolyte has shown a high output voltage and longer life.

• Korean Journal of Metals and Materials
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• v.47 no.12
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• pp.842-851
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• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

• Korean Journal of Materials Research
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• v.10 no.1
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• pp.41-48
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• 2000

In this study, microstructure and mechanical properties and electrical conductivities of in situ Cu-Fe-Xi(Xi=Ag, Cr or Co) alloy wires obtained by cold drawing combined with intermediate heat treatments have investigated. During cold working the primary and secondary dendrite arms are aligned along the drawing direction and elongated into filaments after deformation processing. The addition of Ag was found to be more effective in reducing the microstructural scale at the given draw ratio than that of Co or Cr throughout the drawing processing. The ultimate tensile strength and the conductivity of the Cu-Fe based composites containing Ag were higher than those of Cu-Fe composites containing Co or Cr. The good mechanical and electrical properties of Cu-Fe-Ag wires may be associated with the more uniform distribution of the finer filaments in the wires containing silver. The strength of Cu-Fe-Xi composites is dependent on the spacing of the Fe filaments in accord with a Hall-Petch relationship. The fracture surfaces of all the specimens showed ductile-type fracture and iron filaments occasionally observed on the fracture surfaces.

• Journal of the Korean Institute of Telematics and Electronics
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• v.18 no.3
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• pp.42-51
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• 1981

Boron was predeposited into p (100) Si wafer at 94$0^{\circ}C$ for 60minutes to make the back surface field. High tempreature diffusion process at 1145$^{\circ}C$ for 3 hours was immediately followed without removing boron glass to obtain high surface concentration Back boron was annealed at 110$0^{\circ}C$ for 40minutes after boron glass was removed. N+ layer was formed by predepositing with POCI3 source at 90$0^{\circ}C$ for 7~15 minutes and annealed at 80$0^{\circ}C$ for 60min1es under dry Of ambient. The triple metal layers were made by evaporating Ti, Pd, Ag in that order onto front and back of diffused wafer to form the front grid and back electrode respectively. Silver was electroplated on front and back to increase the metal thickness form 1~2$\mu$m to 3~4$\mu$m and the metal electrodes are alloyed in N2 /H2 ambient at 55$0^{\circ}C$ and followed by silicon nitride antireflection film deposition process. Under artificial illumination of 100mW/$\textrm{cm}^2$ fabricated N+PP+ cells showed typically the open circuit voltage of 0.59V and short circuit current of 103 mA with fill factor of 0.80 from the whole cell area of 3.36$\textrm{cm}^2$. These numbers can be used to get the actual total area(active area) conversion efficiency of 14.4%(16.2%) which has been improved from the provious N+P cell with 11% total area efficiency by adding P+ back.

• 보존과학연구
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• s.27
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• pp.129-143
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• 2006

This report is on a scientific investigation of 3 pairs of 금제태환이식 which were excavated from 황남대총 납분. 태환 is a main part of 태환이식 and it could be classified with 4 types in how to produce, especially how many the golden petal was used. In this investigation, they,3 pairs of 금제태환이식 from 황남대총 남분, were in 3 of 4 types and also I could find that this result was not on the technical progress but on the ingredient of metal. Also, In the result of ingredient assay, I could find that although they were in one pair of 태환 one piece was made in gold and silver alloy and the other piece was made in 99.5 percent of pure Ag with gold amalgam plating. And the another pair was getting red from others because of making in 33percent of Ag and 77 percent of gold, high Ag content. And All pairs of 태환 have a small quantity of Copper. As above, although they are one pair they have the difference of how to produce and the difference of volume and ingredient content, it means that these pairs of 태환 from 황남대총 남분 were made in pressure of time. From now on, if we investigate the ingredient and how to produce of 태환이식 in the local comparative analysis, namely natural science method, we can find out the metal art technique and the social aspect of the ancient times as not analogical inference but scientific basis.

• The Journal of Korean Academy of Prosthodontics
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• v.39 no.3
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• pp.243-249
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• 2001

Statement of the problem. The interest in all-ceramic restorations has increased as more techniques have become available. With the introduction of machinable dental ceramics and CAD/CAM systems or Copy-milling systems there is a need for evaluating the quality levels of these new fabrication techniques. Purpose. This study was to evaluate the fitting accuracy of machined all-ceramic crowns made out of an industrially prefabricated feldspathic porcelain. Material and Methods. Three master models with different cutting depth (0.8mm/1.0mm/1.2mm)were produced using a palladium-silver alloy. A total of 36 working dies, 12 of each form, was used for the modellation of prototype resin copings and 36 additional crowns, 12 of each cutting depth, were produced by using the $CEREC^{(R)}2$ system for all crowns. The maginal fit of all 72 crowns was then evaluated on their respective master die at 54 circularly staggered points of measurement per crown under a fixation pressure of 30 N by using a computerized video image system. Results. The medians of the copy-milled $CELAY^{(R)}$ crowns ranged from 29 to $36{\mu}m$. The highest value for the marginal gap was found in group B (cutting depth 1.0mm) at $107{\mu}m$. The median for the $CEREC^{(R)}2$ crowns was found between 43.5 and $70{\mu}m$. The maximum values for all three groups ranged from $181{\mu}m$ to $286{\mu}m$. With $286{\mu}m$ the highest value for marginal gap was found in group C. the Kruskal-Wallis test and multiple comparisons analysis procedure revealed a significant influence of the production technique on the marginal fit in all three groups (p<0,02). Conclusion. 1. The $CELAY^{(R)}$ system is capable to produce all-ceramic crowns with a significantly better marginal fit than the $CEREC^{(R)}2$ system. 2. As far as premolar crowns produced with the $CEREC^{(R)}2$ system are concerned, the cutting depth has a significant influence on fitting accuracy. 3. The production of crowns with an acceptable marginal fit is possible with both systems. However, adhesive luting is recommended for milled feldspathic porcelain crowns.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.