• Title/Summary/Keyword: Siloxane

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Control of Molecular Weight, Stereochemistry and Higher Order Structure of Siloxane-containing Polymers and Their Functional Design

  • Yusuke Kawakami;Yuning Li;Yang Liu;Makoto Seino;Chitsakon Pakjamsai;Motoi Oishi;Cho, Yeong-Bee;Ichiro Imae
    • Macromolecular Research
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    • v.12 no.2
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    • pp.156-171
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    • 2004
  • We describe the precision synthesis schemes of siloxane-containing polymers, i.e., the control of their molecular weight, stereoregularity, and higher-order structures. First, we found a new catalytic dehydrocoupling reaction of water with bis(dimethylsilyl)benzene to give poly(phenylene-disiloxane). Together with this reaction, we applied hetero-condensations to the synthesis of thermally stable poly(arylene-siloxane)s. The dehydrocoupling reaction was applied to the synthesis of syndiotactic poly(methylphenylsiloxane) and poly(silsesquioxane)s, which we also prepared by hydrolysis and deaminative condensation reactions. We discuss the tendency for loop formation to occur in the synthesis of poly(silsesquioxane) by hydrolysis, and provide comments on the design of functionality of the polymers produced. By taking advantage of the low energy barrier to rotation in the silicon-oxygen bond, we designed selective oxygen-permeable membrane materials and liquid crystalline materials. The low surface free energy of siloxane-containing systems allows surface modification of a blend film and the design of holographic grating materials.

Sterilization effect of atmospheric pressure non-thermal air plasma on dental instruments

  • Sung, Su-Jin;Huh, Jung-Bo;Yun, Mi-Jung;Chang, Brian Myung W.;Jeong, Chang-Mo;Jeon, Young-Chan
    • The Journal of Advanced Prosthodontics
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    • v.5 no.1
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    • pp.2-8
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    • 2013
  • PURPOSE. Autoclaves and UV sterilizers have been commonly used to prevent cross-infections between dental patients and dental instruments or materials contaminated by saliva and blood. To develop a dental sterilizer which can sterilize most materials, such as metals, rubbers, and plastics, the sterilization effect of an atmospheric pressure non-thermal air plasma device was evaluated. MATERIALS AND METHODS. After inoculating E. coli and B. subtilis the diamond burs and polyvinyl siloxane materials were sterilized by exposing them to the plasma for different lengths of time (30, 60, 90, 120, 180 and, 240 seconds). The diamond burs and polyvinyl siloxane materials were immersed in PBS solutions, cultured on agar plates and quantified by counting the colony forming units. The data were analyzed using one-way ANOVA and significance was assessed by the LSD post hoc test (${\alpha}$=0.05). RESULTS. The device was effective in killing E. coli contained in the plasma device compared with the UV sterilizer. The atmospheric pressure non-thermal air plasma device contributed greatly to the sterilization of diamond burs and polyvinyl siloxane materials inoculated with E. coli and B. subtilis. Diamond burs and polyvinyl siloxane materials inoculated with E. coli was effective after 60 and 90 seconds. The diamond burs and polyvinyl siloxane materials inoculated with B. subtilis was effective after 120 and 180 seconds. CONCLUSION. The atmospheric pressure non-thermal air plasma device was effective in killing both E. coli and B. subtilis, and was more effective in killing E. coli than the UV sterilizer.

Synthesis of Epoxy Functional Siloxane and its Effect on Thermal Stress

  • Hyun, Dae-Sup;Jeong, Noh-Hee
    • Journal of the Korean Applied Science and Technology
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    • v.26 no.4
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    • pp.379-384
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    • 2009
  • Epoxy resin based encapsulants are widely used in semiconductor packaging applications. Epoxy resin based encapsulants are often subject to crack or delamination during the reliability test due to the thermal stress caused by high modulus nature of epoxy resins. Epoxy functional siloxanes are often added into epoxy resin to reduce the modulus so that the thermal stress can be reduced. Epoxy functional siloxanes, additives for reduced modulus, were synthesized and added into the curable epoxy resins. The modulus and the coefficient of thermal expansion (CTE) were also measured to investigate the thermal stress and to see whether the epoxy functional siloxane adversely affects the CTE or not. As a result, around 26% to 72% of thermal stress reduction was observed with no adverse effect on CTE.

Characterization for Blend of Siloxane Prepolymer onto Epoxy Resin (Siloxane Prepolymer의 에폭시수지 블렌드 특성)

  • Kim, Kong-Soo;Park, Jun-Ha;Shin, Jae-Sup;Kim, Yeong-Jun
    • Elastomers and Composites
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    • v.32 no.3
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    • pp.179-185
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    • 1997
  • In solution and melting state, SiOD prepolymer was prepared by cured excess DDM with epoxy-terminated siloxane oligomers to control phase separation when DGEBA was blended with PDMS. DGEBA/SiOD prepolymer was also cured at $150^{\circ}C$ for 3hrs. Mechanical and thermal properties of the cured prepolymer specimen were investigated. DGEBA/SiOD60 specimen blended SiOD prepolymer had the best flexural strength, modulus and impact strength. To show crack-formation procedure to morphology, DGEBA/DDM neat specimen was flowed homogeneously in direction of crack energy, whereas DGEBA/SiOD$(30{\sim}60)$ specimen showed heterogeneously dispersed particles and scattered domain of crack energy, but DGEBA/SiOT specimen showed homogeneous phase.

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Dielectric Relaxation of Siloxane-Epoxy Copolymers

  • Kim, Chy-Hyung;Shin, Jae-Sup
    • Bulletin of the Korean Chemical Society
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    • v.23 no.3
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    • pp.413-416
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    • 2002
  • The dielectric responses of 10 and 40 wt% siloxane-epoxy copolymers were investigated in temperature range near the glass transition of polydimethylsiloxane at which the dielectric transitions were also observed. On the other hand, the pure epoxy did not show any dielectric transition in measurement temperature range -90 to 150 $^{\circ}C.$ The experimental data showed that for the copolymer investigated, the temperature-frequency super-position principle could be applied to the dielectric response. From the Cole-Cole equation, the dielectric relaxation of the 10 wt% siloxane near the glass transition temperature resulted in a broad distribution with ${\beta}=$ 0.19 and the relaxation time at -70 $^{\circ}C$ was 5.3 ${\times}$ $10^{-2}$s. The glass transition temperature, 188 K, was estimated by using WLF relation, which was consistent with the data presented in experiment.

Electrical Properties of Silicone Rubber Filled with Surface Treated Alumina Trihydrate

  • Jung, Se-Young;Kim, Byung-Kyu
    • Transactions on Electrical and Electronic Materials
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    • v.7 no.3
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    • pp.134-140
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    • 2006
  • The effect of surface treatment of fillers on the mechanical, electrical properties, and tracking performance of silicone rubber insulators have been investigated. For base polymer, $\alpha,\;\omega$) vinyl poly(dimethyl-methylphenyl) siloxane(VPMPS) containing dimethyl siloxane and methylphenyl siloxane was prepared by the equilibrium polymerization. High voltage silicone rubber composites(HVSRC) were prepared from VPMPS, nano-silica, and alumina trihydrate (ATH) modified by various coupling agents. Bound rubber of uncured silicone rubber, cross-linking density of the vulcanizate as well as the mechanical, electrical properties, and tracking performance were measured.

Biaxial Tensile Behaviors of Elastomeric Polymer Networks

  • Shinzo, Kohjiya
    • Elastomers and Composites
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    • v.38 no.2
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    • pp.175-179
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    • 2003
  • For the total description of mechanical behaviors of elastomers, it is necessary to know the so-called rheological constitutive equation i.e. the strain-energy density function (W) in case of elastomers, which necessitates biaxial tensile results of elastic body. This paper first describes the experimental results of biaxial tensile measurements on poly(siloxane) model networks. W was estimated from its differential form i.e. the $1^{st}$ differential of W is stress. The W was found to reproduce the experimental stress-strain results, and the W estimated for silica filled poly(siloxane) networks suggest a different behavior between conventional precipitated silica and in situ formed silica. The difference suggests the different surface property of the two silicas.