• Journal of the Korea Academia-Industrial cooperation Society
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• v.3 no.2
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• pp.74-79
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• 2002

In the a rapid changes of the semiconductor manufacturing technologies for early 21st century, it may be safely said that a kernel of terms is the size increase of Si wafer and the size decrease of semiconductor devices. As the size of Si wafers increases and semiconductor device is miniaturized, the units of cleaning processes increases. A present cleaning technology is based upon RCA cleaning which consumes vast chemicals and ultra pure water (UPW) and is the high temperature process. Therefore, this technology gives rise to the environmental issue. To resolve this matter, candidates of advanced cleaning processes has been studied. One of them is to apply the electrolyzed water. In this work, Compared with surface on Si wafer with electrolyzed water cleaning and various chemicals cleaning, and analyzed Si wafer surface condition treated with elecoolyzed water by cleaning temperature and cleaning time. Especially. concentrate upon the contact angle. finally, contact angle on surface treated with cathode water cleaning is 17.28, and anode water cleaning is 34.1.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.86-86
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• 2010

Micro- and nanoscale texturing and control of surface energy have been considered for superhydrophobicity on polymer and silicon. However these surfaces have been reported to be difficult to meet the robustness and transparency requirements for further applications, from self cleaning windows to biochip technology. Here we provided a novel method to fabricate a nearly superhydrophobic soda-lime glass using two-step method. The first step involved wet etching process to fabricate micro-sale patterns on soda-lime glass. The second step involved application of $SiO_x$-incorporated DLC to generate high intrinsic contact angle on the surface using chemical vapor deposition (CVD) process. To investigate the effect of surface roughness, we used both positive and negative micro-scale patterns on soda-limeglass, which is relatively hard for surface texturing in comparison to quartz or Pyrex glasses due to the presence of impurities, but cheaper. For all samples we tested the static wetting angle and transparency before and after 100 cycles of wear test using woolen steel. The surface morphology is observed using optical and scanning electron microscope (SEM). The results shows that negative patterns had a greater wear resistance while the hydrophobicity was best achieved using positive patterns having static contact angle up to 140 deg. with about 80% transparency. The overall experiment shows that positive patterns at etching time of 1 min shows the optimum transparency and hydrophobicity. The optimization of micro-scale pattern to achieve a robust, transparent, superhydrophobic soda-lime glass will be further investigated in the future works.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.3
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• pp.988-1004
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• 1996

The characteristics of flow and oxygen concentration are numerically studied in Czochralski 8" silicon crystal growing process considering radiative heat transfer. The analysis of net radiative heat flux on all relevant surfaces shows growing crystal affects the heater power. Furthermore, the variation of the radiative heat flux along the crystal surface in the growing direction is confirmed and should be a cause of thermal stress and defect of the crystal. The calculated distributions of temperature and, heat flux along the wall boundaries including melt/crystal interface, free surface and crucible wall indicate that the frequently used assumption of the thermal boundary conditions of insulated crucible bottom and constant temperature at crucible side wall is not suitable to meet the real physical boundary conditions. It is necessary, therefore, to calculate radiative heat transfer simultaneously with the melt flow in order to simulate the real CZ crystal growth. If only natural convection is considered, the oxygen concentration on the melt/crystal interface decreases and becomes uniform by the application of a cusp magnetic filed. The heater power needed also increases with increasing the magnetic field. For the case of counter rotation of the crystal and crucible, the magnetic field suppresses azimutal flow produced by the crucible rotation, which results in the higher oxygen concentration near the interface.

• Journal of Korean Dental Hygiene Science
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• v.5 no.1
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• pp.13-19
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• 2022

Background: In this study, zirconia copings were fabricated by setting clinically acceptable inner values for prostheses using computer-aided design/computer-aided manufacturing (CAD/CAM). The processed copings were evaluated for the marginal and internal fit of each abutment shape with a CAD program using the silicone replica technique. Methods A total of 20 copings was produced by selecting models commonly used in clinical practice. After injecting the sample, the minimum thickness, internal adhesion interval, and distance to the margin line were set to 0.5, 0.05, and 1.00 mm using a dental CAD program, respectively. It was measured using a 2D section function in a three-way program of the silicon replication technology. Although the positions and number of measurements of the anterior and posterior regions differed, nine parts of each pre-tube were designated and measured by referring to a previous study to compare the two samples. Results As a result, the average margin of the mesial, distal, and buccal (labial) surfaces was 59.90 ㎛ in the anterior region and 60.40 ㎛ in the posterior region. The mean axial wall margin was 67.25 ㎛ in the anterior region and 69.25 ㎛ in the posterior region. In occlusion, the anterior teeth (77.70 ㎛), posterior teeth (77.60 ㎛), and both anterior and posterior regions were within the clinically acceptable range. Conclusion The edge and inner fit of zirconia coping manufactured using the CAD/CAM system showed clinically applicable results. To reduce errors and increase accuracy, materials and machine errors that affect the manufacture of prosthetics should be investigated. Based on our results, the completeness of prosthetics could increase if the inner value and characteristics of the material are adjusted when applied in clinical practice.

• Steel and Composite Structures
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• v.49 no.3
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• pp.307-323
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• 2023

In this research, the study of the thermoelastic flexural analysis of silicon carbide/Aluminum graded (FG) sandwich 2D uniform structure (plate) under harmonic sinusoidal temperature load over time is presented. The plate is modeled using a simple two dimensional integral shear deformation plate theory. The current formulation contains an integral terms whose aim is to reduce a number of variables compared to others similar solutions and therefore minimize the computation time. The transverse shear stresses vary according to parabolic distribution and vanish at the free surfaces of the structure without any use of correction factors. The external load is applied on the upper face and varying in the thickness of the plates. The structure is supposed to be composed of "three layers" and resting on nonlinear visco-Pasternak's-foundations. The governing equations of the system are deduced and solved via Hamilton's principle and general solution. The computed results are compared with those existing in the literature to validate the current formulation. The impacts of the parameters (material index, temperature exponent, geometry ratio, time, top/bottom temperature ratio, elastic foundation type, and damping coefficient) on the dynamic flexural response are studied.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.115-116
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• 2012

The demand for flexible electronic systems such as wearable computers, E-paper, and flexible displays has increased due to their advantages of excellent portability, conformal contact with curved surfaces, light weight, and human friendly interfaces over present rigid electronic systems. This seminar introduces three recent progresses that can extend the application of high performance flexible inorganic electronics. The first part of this seminar will introduce a RRAM with a one transistor-one memristor (1T-1M) arrays on flexible substrates. Flexible memory is an essential part of electronics for data processing, storage, and radio frequency (RF) communication and thus a key element to realize such flexible electronic systems. Although several emerging memory technologies, including resistive switching memory, have been proposed, the cell-to-cell interference issue has to be overcome for flexible and high performance nonvolatile memory applications. The cell-to-cell interference between neighbouring memory cells occurs due to leakage current paths through adjacent low resistance state cells and induces not only unnecessary power consumption but also a misreading problem, a fatal obstacle in memory operation. To fabricate a fully functional flexible memory and prevent these unwanted effects, we integrated high performance flexible single crystal silicon transistors with an amorphous titanium oxide (a-TiO2) based memristor to control the logic state of memory. The $8{\times}8$ NOR type 1T-1M RRAM demonstrated the first random access memory operation on flexible substrates by controlling each memory unit cell independently. The second part of the seminar will discuss the flexible GaN LED on LCP substrates for implantable biosensor. Inorganic III-V light emitting diodes (LEDs) have superior characteristics, such as long-term stability, high efficiency, and strong brightness compared to conventional incandescent lamps and OLED. However, due to the brittle property of bulk inorganic semiconductor materials, III-V LED limits its applications in the field of high performance flexible electronics. This seminar introduces the first flexible and implantable GaN LED on plastic substrates that is transferred from bulk GaN on Si substrates. The superb properties of the flexible GaN thin film in terms of its wide band gap and high efficiency enable the dramatic extension of not only consumer electronic applications but also the biosensing scale. The flexible white LEDs are demonstrated for the feasibility of using a white light source for future flexible BLU devices. Finally a water-resist and a biocompatible PTFE-coated flexible LED biosensor can detect PSA at a detection limit of 1 ng/mL. These results show that the nitride-based flexible LED can be used as the future flexible display technology and a type of implantable LED biosensor for a therapy tool. The final part of this seminar will introduce a highly efficient and printable BaTiO3 thin film nanogenerator on plastic substrates. Energy harvesting technologies converting external biomechanical energy sources (such as heart beat, blood flow, muscle stretching and animal movements) into electrical energy is recently a highly demanding issue in the materials science community. Herein, we describe procedure suitable for generating and printing a lead-free microstructured BaTiO3 thin film nanogenerator on plastic substrates to overcome limitations appeared in conventional flexible ferroelectric devices. Flexible BaTiO3 thin film nanogenerator was fabricated and the piezoelectric properties and mechanically stability of ferroelectric devices were characterized. From the results, we demonstrate the highly efficient and stable performance of BaTiO3 thin film nanogenerator.

• Journal of the Korean Vacuum Society
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• v.14 no.2
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• pp.91-96
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• 2005

The silicon-on-insulator (SOI) wafer fabrication technique has been developed by using ion-cut process, based on proton implantation and wafer bonding techniques. It has been shown by SRIM simulation that 65keV proton implantation is required for a SOI wafer (200nm SOI, 400nm BOX) fabrication. In order to investigate the optimum proton dose and primary annealing condition for wafer splitting, the surface morphologic change has been observed such as blistering and flaking. As a result, effective dose is found to be in the $6\~9\times10^{16}\;H^+/cm^2$ range, and the annealing at $550^{\circ}C$ for 30 minutes is expected to be optimum for wafer splitting. Direct wafer bonding is performed by joining two wafers together after creating hydrophilic surfaces by a modified RCA cleaning, and IR inspection is followed to ensure a void free bonding. The wafer splitting was accomplished by annealing at the predetermined optimum condition, and high temperature annealing was then performed at $1,100^{\circ}C$ for 60 minutes to stabilize the bonding interface. TEM observation revealed no detectable defect at the SOI structure, and the interface trap charge density at the upper interface of the BOX was measured to be low enough to keep 'thermal' quality.

• Horticultural Science & Technology
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• v.31 no.2
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• pp.159-164
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• 2013

A white powder-like substance, so called 'bloom', is formed on the surface of fruits of many varieties of cucumber. Although it is a natural phenomenon, bloomed fruits are accepted lower in quality compared to bloomless fruits by consumers. The experiments were conducted to obtain basic informations for breeding rootstocks, and to develop promising bloomless rootstocks from basic source materials collected and selected by seed company. The surfaces of bloomless fruits were appeared on the bladder cell of glandular trichome and the epicuticular waxes. Those of bloom fruits appeared with an injured bladder cell and many particles, which were not seen on those of bloomless fruits. The chromaticity was investigated on the surface of the bloom and the bloomless fruits. The 'a' and 'b' value of the bloom and the bloomless fruits did not show any significant difference. The 'L' value was significantly different and that of bloom fruits was higher than that of bloomless fruits. Fruit Si content was conspicuously lower in the fruits of cucumber plants grafted on the bloomless rootstock than in the fruits of those grafted on general bloom rootstocks.

• Restorative Dentistry and Endodontics
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• v.22 no.2
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• pp.609-621
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• 1997

The purpose of this study was to evaluate the shear bond strength of three light-cured glass ionomer cements to blood contaminated bovine dentin. The materials used in this study were Fuji II LC, Dyract and Variglass VLC. The dentin conditioners were 10% polyacrylic acid, 10% maleic acid and 10% phosphoric acid. 180 lower anterior bovine teeth were selected in this study. The teeth were embedded in acrylic resin and were grounded with 320 to 600 grit silicon carbide paper to create a flat dentin surface. The teeth were divided into SIX groups. The experimental procedures in six groups were as follows; Group l(GF) : Samples bonded to dentin surface with Fuji II LC after 10% polyacrylic acid treatment. Group 2(BGF) : Samples bonded to dentin surface with Fuji II LC after 10% polyacrylic acid treatment and blood contamination. Group 3(MD) : Samples bonded to dentin surface with Dyract after 10% maleic acid treatment. Group 4(BMD) : Samples bonded to dentin surface with Dyract after 10% maleic acid treatment and blood contamination. Group 5(PV) : Samples bonded to dentin surface with Variglass VLC after 10% phosphoric acid treatment. Group 6(BPV) : Samples bonded-to dentin surface with Variglass VLC after 10% phosphoric acid treatment and blood contamination. Group 1,3 and 5 were classified into the control groups, while group 2,4 and 6 were classified into the experimental groups. Each group contained 30 samples. After 24 hours water storage at $37^{\circ}C$, all smples were subjected to a shear load to fracture at a cross head speed of 1.0 mm/min with Instron universal testing machine(No. 4467). Debonded surfaces were observed under Scanning Electron Microscope(Hitachi S-2300) at 20kvp. The data were evaluated statistically at the 95% confidence level with Student's t-test. The following results obtained; 1. Shear bond strengths were higher in the control groups(1,3,5 group) than in the experimental groups(2,4,6 group). 2. The shear bond strength of group 5(PV) was the highest in the control groups, and the group 5 was significantly higher than the group l(GF) on the shear bond strength. 3. The group 4(BMD) was the highest on the shear bond strength, and the group 2(BGF) was the lowest in the experimental groups. The group 4(BMD) and 6(BPV) showed a significant difference with the group 2 on the shear bond strength. 4. All the groups showed an adhesive-cohesive failure. except the group 2(BGF) showing adhesive failure.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.39-45
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• 2012

Three-dimensional integrated circuit(3D IC) technology has become increasingly important due to the demand for high system performance and functionality. In this work, BOE and HF wet etching of Cu line surfaces after CMP were conducted for Cu-Cu pattern direct bonding. Step height of Cu and $SiO_2$ as well as Cu dishing after Cu CMP were analyzed by the 3D-Profiler. Step height increased and Cu dishing decreased with increasing BOE and HF wet etching times. XPS analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE and HF wet etching treatment. BOE treatment showed not only the effective $SiO_2$ etching but also reduced dishing and Cu surface oxide rather than HF treatment, which can be used as an meaningful process data for reliable Cu-Cu pattern bonding characteristics.