• 제목/요약/키워드: Silicon solar wafer

검색결과 198건 처리시간 0.036초

Design Optimization of the Front Side in n-Type TOPCon Solar Cell

  • Jeong, Sungjin;Kim, Hongrae;Kim, Sungheon;Dhungel, Suresh Kumar;Kim, Youngkuk;Yi, Junsin
    • 한국전기전자재료학회논문지
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    • 제35권6호
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    • pp.616-621
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    • 2022
  • Numerical simulation is a good way to predict the conversion efficiency of solar cells without a direct experimentation and to achieve low cost and high efficiency through optimizing each step of solar cell fabrication. TOPCon industrial solar cells fabricated with n-type silicon wafers on a larger area have achieved a higher efficiency than p-type TOPCon solar cells. Electrical and optical losses of the front surface are the main factors limiting the efficiency of the solar cell. In this work, an optimization of boron-doped emitter surface and front electrodes through numerical simulation using "Griddler" is reported. Through the analysis of the results of simulation, it was confirmed that the emitter sheet resistance of 150 Ω/sq along the front electrodes having a finger width of 20 ㎛, and the number of finger lines ~130 for silicon wafer of M6 size is an optimized technology for the front emitter surface of the n-type TOPCon solar cells that can be developed.

n형 규소 태양전지 emitter형성에 미치는 열처리 변수의 영향 (The effect of heat treatment parameters on the emitter formation of the n-type silicon solar cell)

  • 심지명;김영관
    • 한국결정성장학회지
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    • 제18권5호
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    • pp.179-183
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    • 2008
  • n형 실리콘를 이용히여 후면에 Al-emitter형성에 관해 �x처리조건이 Voc에 어떤 영향을 미치는지 알아보기 위하여 screen printing 방법으로 n-type Si 기판에 Al을 도포하였다. 열처기는 straight profile에서 50 inch/min의 belt speed로 $850^{\circ}C$의 peak temperature로 수행한 경우 가장 높은 Voc(585 mV)값을 보였고, 이 온도보다 낮은 경우에 불 균일한 Al-Si alloy 층이 형성되고, 이 온도보다 높은 경우에 Al층으로 Si 원자의 이동이 극심하게 발생되어 Al-Si alloy층이 파괴되는 현상으로 인하여 Voc가 감소함을 보았다.

알카리 식각과 반응성 이온 식각을 이용한 결정질 실리콘 2단계 표면 조직화 공정 (Two Step Texturing Using RIE and Wet Etching for Crystalline Silicon Solar Cell)

  • 여인환;박주억;김준희;조해성;임동건
    • 한국전기전자재료학회논문지
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    • 제26권2호
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    • pp.140-143
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    • 2013
  • Lowering surface reflectance of silicon wafer by texturization is one of the most important processes to improve the efficiency of silicon solar cells. Generally, the texturing of crystalline silicon was carried out using alkaline solution. The average reflectance of this method was 11% at the wavelength between 400 and 1,000 nm. In this study, the wafers were first texturing by NaOH solution at $80^{\circ}C$ for 35 min. Then the wafers were texturing by $SF_6$ and $O_2$ plasma in RIE (Reactive Ion Etching). The average reflectance of two step texturing was reduced to below 5% at the wavelength between 400 and 1,000 nm.

A Study on High Frequency-Plasma Enhanced Chemical Vapor Deposition Silicon Nitride Films for Crystalline Silicon Solar Cells

  • Li, Zhen-Hua;Roh, Si-Cheol;Ryu, Dong-Yeol;Choi, Jeong-Ho;Seo, Hwa-Il;Kim, Yeong-Cheol
    • Transactions on Electrical and Electronic Materials
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    • 제12권4호
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    • pp.156-159
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    • 2011
  • SiNx:H films have been widely used for anti-reflection coatings and passivation for crystalline silicon solar cells. In this study, SiNx:H films were deposited using high frequency (13.56 MHz) direct plasma enhanced chemical vapor deposition, and the optical and passivation properties were investigated. The radio frequency power, the spacing between the showerhead and wafer, the $NH_3/SiH_4$ ratio, the total gas flow, and the $N_2$ gas flow were changed over certain ranges for the film deposition. The thickness uniformity, the refractive index, and the minority carrier lifetime were then measured in order to study the properties of the film. The optimal deposition conditions for application to crystalline Si solar cells are determined from the results of this study.

금속 불순물 오염에 따른 실리콘 기판 및 태양전지 특성의존성 분석 (Effect of metal impurity contamination on silicon wafer and solar cell properties)

  • 백상훈;이정철;조준식;왕진석;송진수
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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    • pp.167-167
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    • 2009
  • 결정질실리콘 태양전지를 제조함에 있어 실리콘 기판 내의 금속 불순물들은 소자제작 시에 성능 저하의 원인으로 작용한다. 따라서 본 연구에서는 실리콘 기판에 Cr, Cu, Ni 불순물을 강제 오염시킨 후 태양전지를 제작하여 각각의 불순물에 대한 특성을 조사 하였다. p-type 실리콘 기판을 오염시키기 위해 일정 시간동안 표준용액에 담근 후 질소 분위기에서 열처리 하여 불순물을 확산시켰다. 이후 상용 공정을 이용하여 태양전지를 제작하고 기판내 금속불순물 농도에 따른 태양전지의 동작특성을 분석하였다.

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반응성 플라즈마를 이용한 태양전지용 Si기판의 표면 처리 (Surface treatment of Si wafer for solar cell using reactive plasma method)

  • 박병욱;곽동주;성열문
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2007년도 제38회 하계학술대회
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    • pp.1305-1306
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    • 2007
  • To lower the fabrication cost of silicon solar cells, a surface treatment using a dielectric barrier discharge instead of a wet cleaning technique was examined on electrode surfaces on silicon solar cells. The fill factor obtained through measuring current-voltage characteristics was evaluated, and the treated surface state was characterized by energy-dispersive X-ray. It was found that the dielectric barrier discharge effectively activated the electrode surface and the surface treatment on finger electrodes contributed greatly to improve the fill factor.

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Thin wafer를 이용한 결정질 실리콘 태양전지의 효율개선 방안 (The Method of improving efficiency of crystalline silicon solar cell with the thin wafer)

  • 손혁주;박용환;김덕열
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 추계학술대회 초록집
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    • pp.50.1-50.1
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    • 2010
  • 결정질 실리콘 태양전지의 원가에서 Wafer는 60~70%의 매우 높은 비중을 차지하고 있다. 많은 연구들이 원가 절감을 위하여 Wafer의 두께를 감소시키는 것에 집중하고 있다. 그러나 Wafer 두께의 감소는 태양전지의 효율 감소와 공정 진행 중에 파손율이 상승하는 등의 문제가 발생한다. 이에 본 논문에서는 결정질 태양전지 구조 중에서 24.7% 이상의 최고 변환 효율을 갖는 PERL(Passivated Emitter, Rear Locally diffuse) 구조를 대상으로 wafer 두께 감소에 따른 변환 효율 감소의 원인과 해결 방안을 제시하고자 한다. Simulation으로 확인한 결과 370 um 두께의 wafer에서 24.2 %의 효율은 50 um 두께의 wafer에서는 20.8 %로 감소함을 확인할 수 있었다. 얇아진 wafer에서 감소한 효율을 개선하기 위하여 후면 recombination velocity, 후면 fixed charge density, 후면 산화막 두께 등을 다양화하여, 각각의 경우에 대한 cell의 효율 변화를 살펴보았다. 그 결과 후면 recombination velocity, 후면 fixed charge density, 후면 산화막 두께를 최적화 하여, 각각 2.8 %p, 1.5 %p, 2.8 %p의 효율 개선 효과를 얻었다. 위 세 가지 효과를 동시에 적용하면 50 um wafer에서 370 um wafer 효율의 결과와 근접한 24.2 %의 효율을 얻을 수 있었다. 향후에는 위의 결과를 바탕으로 실제 실험을 통하여 확인할 계획이다.

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결정질 실리콘 태양전지 도핑 확산 공정에서 시간과 온도 변화에 의한 Drive-in 공정 연구 (Optimization of Drive-in Process with Various Times and Temperatures in Crystalline Silicon Solar Cell Fabrication)

  • 이희준;최성진;명재민;송희은;유권종
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2011년도 추계학술발표대회 논문집
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    • pp.51-55
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    • 2011
  • In this paper, the optimized doping condition of crystalline silicon solar cells with 156 ${\times}$ 156 mm2 area was studied. To optimize the drive-in condition in the doping process, the other conditions except drive-in temperature and time were fixed. After etching 7 ${\mu}m$ of the surface to form the pyramidal structure, the silicon nitride deposited by the PECVD had 75~80 nm thickness and 2 to 2.1 for a refractive index. The silver and aluminium electrodes for front and back sheet, respectively, were formed by screen-printing method, followed by firing in $400-425-450-550-850^{\circ}C$ five-zone temperature conditions to make the ohmic contact. Drive-in temperature was changed in range of $828^{\circ}C$ to $860^{\circ}C$ and time was from 3 min to 40 min. The sheet resistance of wafer was fixed to avoid its effect on solar cell. The solar cell fabricated with various conditions showed the similar conversion efficiency of 17.4%. This experimental result showed the drive-in temperatures and times little influence on solar cell characteristics.

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Boron doping with fiber laser and lamp furnace heat treatment for p-a-Si:H layer for n-type solar cells

  • Kim, S.C.;Yoon, K.C.;Yi, J.S.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.322-322
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    • 2010
  • For boron doping on n-type silicon wafer, around $1,000^{\circ}C$ doping temperature is required, because of the relatively low solubility of boron in a crystalline silicon comparing to the phosphorus case. Boron doping by fiber laser annealing and lamp furnace heat treatment were carried out for the uniformly deposited p-a-Si:H layer. Since the uniformly deposited p-a-Si:H layer by cluster is highly needed to be doped with high temperature heat treatment. Amorphous silicon layer absorption range for fiber laser did not match well to be directly annealed. To improve the annealing effect, we introduce additional lamp furnace heat treatment. For p-a-Si:H layer with the ratio of $SiH_4:B_2H_6:H_2$=30:30:120, at $200^{\circ}C$, 50 W power, 0.2 Torr for 30 min. $20\;mm\;{\times}\;20\;mm$ size fiber laser cut wafers were activated by Q-switched fiber laser (1,064 nm) with different sets of power levels and periods, and for the lamp furnace annealing, $980^{\circ}C$ for 30 min heat treatment were implemented. To make the sheet resistance expectable and uniform as important processes for the $p^+$ layer on a polished n-type silicon wafer of (100) plane, the Q-switched fiber laser used. In consequence of comparing the results of lifetime measurement and sheet resistance relation, the fiber laser treatment showed the trade-offs between the lifetime and the sheet resistance as $100\;{\omega}/sq.$ and $11.8\;{\mu}s$ vs. $17\;{\omega}/sq.$ and $8.2\;{\mu}s$. Diode level device was made to confirm the electrical properties of these experimental results by measuring C-V(-F), I-V(-T) characteristics. Uniform and expectable boron heavy doped layers by fiber laser and lamp furnace are not only basic and essential conditions for the n-type crystalline silicon solar cell fabrication processes, but also the controllable doping concentration and depth can be established according to the deposition conditions of layers.

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PV모듈의 cell crack 방지를 위한 EVA Sheet의 최적 Gel content 특성 (The Optimimum Gel Content Characteristics for Cell Cracks Prevention in PV Module)

  • 강경찬;강기환;김경수;허창수;유권종
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2008년도 제39회 하계학술대회
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    • pp.1108-1109
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    • 2008
  • To survive in outdoor environments, photovoltaic modules rely on packaging materials to provide requisite durability. We analyzed the properties of encapsulant materials that are important for photovoltaic module packaging. Recently, the thickness of solar cell gets thinner to reduce the quantity of silicon. And the reduced thickness make it easy to be broken while PV module fabrication process. Solar cell's micro cracks are increasing the breakage risk over the whole value chain from the wafer to the finished module, because the wafer or cell is exposed to tensile stress during handling and processing. This phenomenon might make PV module's maximum power and durability down. So, when using thin solar cell for PV module fabrication, it is needed to optimize the material and fabrication condition which is quite different from normal thick solar cell process. Normally, gel-content of EVA sheet should be higher than 80% so PV module has long term durability. But high gel-content characteristic might cause micro-crack on solar cell. In this experiment, we fabricated several specimen by varying curing temperature and time condition. And from the gel-content measurement, we figure the best fabrication condition. Also we examine the crack generation phenomenon during experiment.

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