• 제목/요약/키워드: Silicon Machining

검색결과 145건 처리시간 0.022초

질화규소 세라믹의 레이저 예열선삭에 관한 연구 (I) - 공정변수에 따른 질화규소의 예열특성 및 산화거동 - (A Study on Laser Assisted Machining for Silicon Nitride Ceramics (I) - Preheating Characteristics and Oxidation Behaviors of Silicon Nitride Ceramics with Machining Parameters -)

  • 김종도;이수진;서정;이제훈
    • Journal of Welding and Joining
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    • 제28권4호
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    • pp.61-66
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    • 2010
  • Silicon nitride is widely used as an engineering ceramics because it has high strength, abrasion resistance and corrosion resistance even at high temperature. However, machining of silicon nitride is difficult due to its high hardness and brittleness. Laser assisted machining(LAM) allows effective cutting using CBN tool by locally heating the cutting part to the softening temperature of YSiAlON using the laser beam. The effect of preheating depending on process parameters were studied to find out the oxidation mechanism. If silicon nitride is sufficiently preheated, the surface is oxidized and $N_2$ gas is formed and escapes from the material, thereby making the cutting process more advantageous. During laser preheating process before machining, high temperature results in strong oxidation which makes the bloating, silicate layers and micro cracks. Using the results of these experiments, preheating characteristics and oxidation behavior were found out.

실리콘의 화학기계적 미세가공 특성 (Characterization of the Chemical Mechanical Micro Machining for Single Crystal Silicon)

  • 정상철;박준민;이현우;정해도
    • 한국정밀공학회지
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    • 제19권1호
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    • pp.186-195
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    • 2002
  • The mechanism of micro machining of reacted layer on silicon surface were proposed. The depth of reacted layer and the change of mechanical property were measured and analyzed. Depth of hydrated layer which is created on the surface of silicon by potassium hydrate was analyzed with SEM and XPS. The decrease of the micro victors hardness of silicon surface was shown with the increase of the concentration of potassium hydrate and the change of the dynamic friction coefficient by chemical reacted layer was measured due to the readiness of machining. The experiment of groove machining was done with 3-axis machine with constant load. With chemical mechanical micro machining the surface crack and burrs generated by both brittle and ductile micro machining were diminished. And the surface profile and groove depth was shown in accordance with the machining speed and reaction time with SEM and AFM.

질화규소 세라믹의 레이저 예열선삭에 관한 연구 (II) - 예열선삭된 SSN 및 HIPSN 질화규소 세라믹의 표면특성 - (A Study on Laser Assisted Machining for Silicon Nitride Ceramics (II) - Surface Characteristics of LAM Machined SSN and HIPSN -)

  • 김종도;이수진;강태영;서정;이제훈
    • Journal of Welding and Joining
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    • 제28권5호
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    • pp.80-85
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    • 2010
  • This study focused on laser assisted machining (LAM) of silicon nitride ceramic that efficiently removes the material through machining of the softened zone by local heating. The effects of laser-assisted machining parameters were studied for cost reduction, and active application in processing of silicon nitride ceramics in this study. Laser assisted machining of silicon nitride allows effective cutting using CBN tool by local heating of the cutting part to the softening temperature of YSiAlON using by the laser beam. When silicon nitride is sufficiently preheated, the surface is oxidized and decomposed and then forms bloating, micro crack and silicate layer, thereby making the cutting process more advantageous. HIPSN and SSN specimens were used to study the machining characteristics. Higher laser power makes severer oxidation and decomposition of both materials. Therefore, HIPSN and SSN specimens were machined more effectively at higher power.

액화질소를 이용한 오픈 셀 실리콘 폼의 냉동 절삭조건 최적화 (Cryogenic Machining of Open-Cell Silicone Foam)

  • 황지홍;조광희;박민수
    • 한국생산제조학회지
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    • 제23권1호
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    • pp.32-37
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    • 2014
  • Open-cell silicon foam is difficult to cut using conventional machining processes because of its low stiffness. That is, open-cell silicon foam is easily pressed down when the tool is engaged, which makes it difficult to remove the material in the form of chip. This study proposes an advanced method of machining open-cell silicon foam by freezing the material using liquid nitrogen. Furthermore, the machining conditions are optimized to maximize the efficiency of material removal and minimize the usage of liquid nitrogen by conducting experiments under various machining conditions. The results show that open-cell silicone foam products with free surface can be successfully machined by employing the proposed method.

실리콘 상부 전극의 기계적 가공 연구 (A Study of Mechanical Machining for Silicon Upper Electrode)

  • 이은영;김문기
    • 반도체디스플레이기술학회지
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    • 제20권1호
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    • pp.59-63
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    • 2021
  • Upper electrode is one of core parts using plasma etching process at semiconductor. The purpose of this study is to analyze effects of cutting conditions for mechanical machining of silicon upper electrode. For this research, surface roughness of machined workpiece and depth of damage inside of silicon electrode are experimented and analyzed and different values of feed rate and depth of cut are applied for the experiments. From these experiments, it is verified that the surface roughness and internal damaged layer get worse according to take more fast feed rate. In conclusion, cutting condition is very important factor for machining. Results of this study can use to develop various parts which are made from single crystal silicon and affect various benefits to the semiconductor industry for better productivity.

질화규소 세라믹의 레이저 예열선삭에 관한 연구 (IV) - 질화규소 세라믹의 레이저예열선삭 메커니즘 및 적용 - (A Study on Laser Assisted Machining for Silicon Nitride Ceramics (IV) - Mechanism and Application of LAM for Silicon Nitride Ceramics -)

  • 김종도;이수진;박서정;이제훈
    • Journal of Welding and Joining
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    • 제28권6호
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    • pp.40-44
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    • 2010
  • Laser assisted machining (LAM) has been researched in order to machine the silicon nitride ceramics economically and effectively. LAM is an effective machining method by local heating of the cutting part to the softening temperature of the silicon nitride using laser beam. When silicon nitride ceramics is heated using a laser beam, the surface of silicon nitride ceramic is softened, oxidized and decomposed. And then surface hardness is decreased. Through machining in low viscosity and hardness conditions, silicon nitride was machined effectively and the life span of tool was increased. The plastic deformation was occurred due to softening of amorphous YSiAlON above $ 1,000^{\circ}C$. Transgranular fracture of ${\beta}-Si_3N_4$ was occurred when YSiAlON was not softened, but mostly intergranular fracture was occurred by the plastic deformation of softened YSiAlON.

나노스케일 절삭가공에서의 비절삭저항 변화 및 원인 분석 (Analysis of Variation of Specific Cutting Resistance in Nanoscale Cutting)

  • 권예필;김시훈;전은채
    • 한국기계가공학회지
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    • 제19권11호
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    • pp.23-28
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    • 2020
  • In general, lithography techniques are applied when machining single-crystal silicon in nanoscale applications; however, these techniques involve low degrees of freedom for the vertical shapes. By applying mechanical techniques to machine silicon, nanopatterns having various types of vertical shapes can be manufactured. In this study, we determined the ductile-brittle machining transition point and analyzed the- variation of the specific cutting resistance within the ductile machining region in nanoscale applications. When brittle fracture occurred during the nanoscale cutting, the depth of cut and cutting force increased and decreased rapidly, respectively. The first point of rapid increase in the depth of cut was defined as the ductile-brittle machining point. Subsequently, the shape of the machining tool was observed using a scanning electron microscope to calibrate the machining area, considering the tip blunting. The specific cutting resistance decreased continuously and converged to a certain value during the nanoscale cutting. The decrease and convergence in the value can be attributed to the decrease in the ratio of the arc length to the area of the machining tool and silicon.

가공력 제어 위치 서보 시스템을 이용한 초음파 가공기의 개발 (Development of Ultrasonic Machine with Force Controlled Position Servo System)

  • 장인배;이승범;전병희
    • 소성∙가공
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    • 제13권3호
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    • pp.253-261
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    • 2004
  • The machining technology for the brittle materials such as ceramics are applied to the fields of MEMS(micro electromechanical system) by the progress of new machining technologies such as Etching, Diamond machining, Micro drilling, EDM(Electro discharge machining), ECDM(Electro discharge machining), USM(Ultrasonic machining), LBM(Laser beam machining), EBM(Electron beam machining). Especially, the USM technology can be applied to the dieletric brittle materials such as silicon, borosilicate glass, silicon nitride, quartz and ceramics with high aspect ratio. The micro machining system with machining force controlled position servo is developed in this paper and the optimized ultrasonic machining algorithm is constructed by the force controlled position servo control. The load cell is adapted in the force measuring and the servo control algorithm, suit for the ultrasonic machining characteristics, is estabilished with using the PID auto-tunning functions at the PMAC system which is generally adapted in the field of robot industries. The precision force signal amplifier is constructed with high precision operational amplifier AD524. The vacuum adsorption chuck which is made of titanum and internal flow line is engraved, is used in the workpiece fixing. The mahining results by USM shows that there are some deviation between the force command and the actual machining force that the servo control algorithm should be applied in the machining procedures. Therefore, the constant force controlled position servo system is developed for the micro USM system and by the examination machining process in USM, the stable USM system is realized by tracking the average value of machining force.