• 한국환경과학회지
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• 제16권8호
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• pp.907-912
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• 2007

Ion exchange resin was used to remove silica ion at ultralow concentration. The effects of temperature, type of ion exchange resin and single/mixed-resin systems on removal efficiency were estimated. As temperature increased, the slope of concentration profile became stiff, and the equilibrium concentration was higher. In the single resin system, the removal of silica was continued up to 400 min, but the silica concentration was recovered to initial concentration after 400 min due to the effect of dissolved $CO_2$. In the mixed-resin system it took about 600 min to reach equilibrium. Because of faster cation exchange reaction than anion exchange reaction, the effect of $CO_2$ could be removed. Based on the experimental results carried out in the mixed-resin system, the selectivity coefficients of silica ion for each ion exchange resin were calculated at some specific temperatures. The temperature dependency of the selectivity coefficient was expressed by the equation of Kraus-Raridon type.

• Korean Chemical Engineering Research
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• 제50권6호
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• pp.945-951
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• 2012

광촉매반응기의 충전제로서 glass bead-광촉매담체를 control로 하고 다공성의 silica-based 광촉매담체를 사용하였을 때의 악취 및 VOC를 함유한 폐가스의 광촉매 처리효율에 대한 광촉매담체 다공성의 영향평가를 수행하였다. 다공성의 silica-based-광촉매담체의 광촉매 코팅량은 $1,716.3{\mu}g/cm^2$로서 nonporous glass bead(control)에 담지된 광촉매코팅량인 $670{\mu}g/cm^2$ 값의 약 250%이었다. Porous silica-based 담체가 충전된 광촉매반응기의 황화수소 및 톨루엔 제거효율은 각각 22% 및 82%로서, glass-bead 담체가 충전된 UV/광촉매반응기의 경우의 황화수소 및 톨루엔 제거효율인 각각 19% 및 53%와 비교하였을 때에 황화수소의 경우는 약 16% 증가하였고 톨루엔의 경우는 약 55% 증가하였다. 따라서 다공성의 silica-based 광촉매담체를 사용함으로써 황화수소와 톨루엔의 동시처리효율을 각각 제고하였고, 처리효율의 제고율은 황화수소보다 톨루엔의 경우가 3.4배 높았다.

• 한국연초학회지
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• 제27권2호
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• pp.171-177
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• 2005

Coconut based activated carbon and silica-gels were impregnated with 3-aminopropyltri ethoxysilan(APS) and N-(2-aminoethyl)-3-aminopropyl triethoxysilane (AEAPS) in order to investigate the effect of the amine group and the pore size of the supports on the removal of hydrogen cyanide(HCN) and aldehydes in mainstream smoke(MS). The physicochemical properties of the supports were analyzed by using thermal gravity analyzer(TGA), $N_2$ adsorption and desorption isotherms$(BET,\;N_2)$, and SEM-EDS. According to our experimental data, there was no significant difference in the delivery amount of HCN and aldehydes of non-functionalized silica-gels having meso-pores bigger than $20\AA$. In the case of silica-gels functionalized with APS(APS silica-gel), the delivery amounts of hydrogen cyanide(HCN) and aldehydes decreased with the increase of APS concentration. Silica-gel functionalized with AEAPS(AEAPS silica-gel) showed higher removal efficiency than that of APS silica-gels. The delivery amounts of HCN and aldehydes of activated carbon impregnated with APS and AEAPS increased with the increase of the APS and AEAPS concentrations. In accordance with the specific surface area analysis results, APS and AEAPS molecules decreased the specific surface area by blocking the micro-pores of the activated carbon. The volatile organic components removal efficiency by the micro-pores was higher than that of the amine group impregnated into the activated carbon.

• 한국지반환경공학회 논문집
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• 제12권2호
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• pp.55-61
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• 2011

NDMA(N-Nitrosodimethylamine)는 극저농도(10ng/L)에서도 암을 일으킬 수 있는 물질로 알려져 있지만, 기존의 NDMA 제거율 평가 연구는 고농도의 NDMA를 대상으로 한 것이 대부분이었다. 따라서 극저농도의 NDMA 제거효율 평가가 필요하며 그 기초연구로써 호기성/혐기성 조건에서의 분말활성탄, GS(Granular Sludge), MF(Microfiltration), UF(Ultrafiltration)를 이용한 제거효율과 Silica gel(MCM-41, Diatomite, Spherical silica gel)을 이용한 제거효율을 평가하였다. 그 결과 혐기성 조건에서 GS, PAC를 접촉한 후 UF membrane을 이용한 고액분리가 65%의 제거율로 가장 높았으며, Silica gel(MCM-41)이 6%의 제거율로 가장 낮았다. 본 연구는 극저농도의 NDMA 제거의 기초 연구로서 향후 관련 연구의 기초자료로써 활용을 기대한다.

• 한국세라믹학회지
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• 제44권2호
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• pp.98-102
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• 2007

The stability of slurry and removal rate during recycling of colloidal silica slurry was evaluated in silicon wafer polishing. The particle size distribution, pH, and zeta potential were measured to investigate the stability of colloidal silica. Large particles appeared as recycling time increased while average size of slurry did not change. Large particles were identified by EDS(energy dispersive spectrometer) as foreign substances from pad or abraded silicon flakes during polishing. As the recycling time increased, pH of slurry decreased and removal rate of silicon reduced but zeta potential decreased inversely. Hence, it could be mentioned that decrease of removal rate is related to consumption of $OH^-$ ions during recycling. Attention should be given to the control of pH of slurry during polishing.

• 대한기계학회논문집A
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• 제38권9호
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• pp.1037-1041
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• 2014

반도체 연마용 슬러리를 이온교환법, 가압방법 및 다단계 주입방법으로 제조하여 입자 크기와 형상에 따른 화학적 기계적 연마에 미치는 영향을 연구하였다. 이온교환법을 이용하여 구형의 콜로이달실리카를 크기별로 입자로 제조하였다. 이렇게 제조한 구형의 실리카를 다시 가압방법을 이용해 입자간의 결합을 유도해 비구형의 형상을 가진 콜로이달 실리카를 제조하였고, 이온교환법과 가압방법의 특징을 살려 실리식산을 다단계로 주입하여 입자 표면과 실리식산의 반응으로, 2~3 개의 입자가 결합한 형상의 콜로이달 실리카를 제조하였다. 이렇게 제조한 입자를 CMP 에 적용하여 콜로이달 실리카의 입자 형상에 따른 연마율을 기존의 상용 슬러리와 비교하였다. pH 가 높을수록 연마율은 높아졌고, 입자가 결합한 비구형의 콜로이달 실리카는 가장 높은 연마율과 양호한 비균일도를 나타내었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.161-161
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• 2008

The oxide film of silicon wafer has been mainly polished by fumed silica, colloidal silica or ceria slurry. Because colloidal silica slurry is uniform and highly dispersed composed of spherical shape particles, by which the oxide film polished remains to be less scratched in finishing polishing process. Even though the uniformity and spherical shape is advantage for reducing the scratch, it may also be the factor to decrease the removal rate. We have studied the correlation of silica abrasive particles and CMP characteristics by varying pH, down force, and table rotation rate in polishing. It was found that the CMP polishing is dependent on the morphology, aggregation, and the surface property of the silica particles.

• 산업기술연구
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• 제26권A호
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• pp.199-205
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• 2006

Ozone alone and catalytic ozone processes were introduced for treatment of humic acid, which is representative refractory organic compound. The treatment efficiencies of humic acid in each process were analyzed in pH variation, DOC removal, and $UV_{254}$ decrease. Mn loaded GAC catalyst was prepared by loading potassium permanganate onto the granular activated carbon surface. BCM-GAC and BCM-Silica gel catalyst were prepared by BCM. $UV_{254}$ decrease in all processes was comparatively high with efficiency over 87%. DOC removal in ozone/GAC process was the highest with 78%, and removal rates for other processes followed the order ozone/BCM-GAC(62%) > ozone/BCM-silica gel(45%) > ozone/silica gel(43%) > ozone/Mn Loaded GAC(42%) > ozone alone(37%).

• 한국신뢰성학회지:신뢰성응용연구
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• 제14권1호
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• pp.11-19
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• 2014

A colloidal silica slurry has been manufactured by mixing nano silica powders having different grain size to improve the reliability of Sapphire wafer CMP process. The main reliability problem of CMP process such as the breaking of wafer can be prevented by reducing the size of particles in a slurry. While existing commercial colloidal silica slurries are usually made of single grain size silica powder of about 120nm, in the present study 40nm and 100nm silica powders are mixed to achieve a similar removal rate. The new colloidal silica slurry showed wafer removal rate of $3.04{\mu}m/120min$ while that of a commercial colloidal silica slurry was $3.03{\mu}m/120min$. The roughness was less than $4{\AA}$ and scratch was 0. It is also expected that the reduction of the size of nano silica particles can improve the dispersion stability and prolong the useful life of the slurry.

• Korean Chemical Engineering Research
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• 제59권4호
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• pp.596-610
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• 2021

스토버 방식에 의한 구형 단분산 입자와 에멀젼 액적을 미세 반응기로 활용하여 합성한 주름진 표면을 갖는 실리카 입자 및 거대 기공을 갖는 다공질 실리카 입자를 커플링제로 표면 개질하여 흡착제로 활용하였다. 아민기를 포함하는 실란 또는 타이타네이트 커플링제를 활용하여 기존의 실리카 재료로는 흡착이 어려웠었던 중금속과 음이온성 염료에 대한 흡착력이 향상된 것을 관찰할 수 있었다. 음이온 염료에 대한 흡착에서는 APTES로 표면 개질한 다공질 실리카가 흡착 효율이 가장 높은 결과를 나타내었고, 중금속 구리에 대한 흡착 결과는 AAPTS로 표면 개질한 다양한 실리카 분말에서 모두 100%에 가까운 흡착 효율을 얻을 수 있었다.