• Journal of the Korean Society for Nondestructive Testing
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• v.25 no.6
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• pp.439-445
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• 2005

The stud bolt is one of crucial parts for safe operation of reactor vessels in nuclear power plants, Crack initiation and propagation were reported in stud bolts that arc used for closure of reactor vessel and head, Stud bolts are inspected by ultrasonic technique during overhaul periodically for the prevention of stud bolt failure which could induce radioactive leakage from nuclear reactor, In conventional ultrasonic testing for inspection of stud bolts, cracks are detected by using shadow effect It takes too much time to inspect stud bolts by using conventional ultrasonic technique. In addition, there were numerous spurious signals reflected from every oblique surfaces of thread, In this study, the signal processing technique for enhancing conventional ultrasonic technique was introduced for inspecting stud bolts. The signal processing technique provides removing spurious signal reflected from every oblique surfaces of thread and enhances detectability of defects. Detectability for small crack was enhanced by using this signal processing in ultrasonic inspection of stud bolts in Nuclear Power Plants.

• Proceedings of the KIEE Conference
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• 1999.07b
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• pp.844-846
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• 1999

A speed signal of governor, which control the output and speed of a generator, is important because a signal failure can be causing the shutdown of a power plant. thus, it is necessary to introduce switching method with two complementary signal. This paper presents a comparative study of speed signal switching methods. One of the Proposed methods has been tested at a power plant in Pukcheju and the approach described here is expected to be of wide applicability.

• Composites Research
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• v.17 no.2
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• pp.28-33
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• 2004

Failure detection in a cross-ply laminated composite beam under tensile loading were performed using a fiber Bragg grating (FBG) sensor. A Passive Mach-Zehnder interferometric demodulator was proposed to enhance sensitivity and bandwidth. The proposed FBG sensor system without active device such as a phase modulator is very simple in configuration, easy to implement and enables the measurement of high-frequency vibration with low strain amplitude such as impact or failure signal. Failure signals detected by a FBG sensor had offset value corresponding to the strain shift with vibration at a maximum frequency of several hundreds of kilohertz. at the instant of transverse crack propagation in the 90 degree layer of composite beam.

• The Journal of the Korea institute of electronic communication sciences
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• v.10 no.10
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• pp.1079-1086
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• 2015

This paper introduces the architecture of OUTPUT module that is suitable using in safety related system having SIL4 and proposes the quantitative target that is required for OUTPUT module. Especially, only output type that is made up Relay output signal and analog signal among various output ways is applied in output module that is a part of safety related system. The FMEA(Failure Modes and Effect Analysis), FTA(Fault Tree Analysis) are used as analysis method. As a result, it proposes to the architecture and failure frequency of the Output module that is used in SIL4 safety related system.

• Tribology and Lubricants
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• v.18 no.5
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• pp.351-356
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• 2002

The surfaces of machine components in sliding contact such as bearing, gears and pistons etc. frequently operate under the condition of mixed lubrication due to high load, high speed and slip. These machine components often undergo the inception of scuffing in practical application. The scuffing failure is a critical problem in modern machine components, especially for the requirement of high efficiency and small size. However, it is difficult to find a universal mechanism to explain all scuffing phenomena because there are so many factors affecting the onset of scuffing. In this study, scuffing experiments are conducted using Acoustic Emission(AE) measurement by an indirect sensing approach to detect scuffing failure. Acoustic Emission(AE) signal has been widely utilized to monitor the interaction at the friction interface. Using AE signals we can get an indication about the state of the friction processes, about the quality of solid and liquid layers on the contacting surfaces in real time. The FFT(Fast Fourier Transform) analyses of the AE signal are sued to understand the interfacial interaction and the relationship between the AE signal and the state of contact is presented.

• Journal of Sensor Science and Technology
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• v.21 no.2
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• pp.103-108
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• 2012

Radiofrequency(RF) signal is a key medium to the most of the present wireless communication devices including RF identification devices(RFID) and smart sensors. However, the most critical barrier to overcome in RFID application is in the failure rate in detection. The most notable improvement in the detection was from the introduction of EPC Class1 Gen2 protocol, but the fundamental problems in the physical properties of the RF signal drew less attention. In this work, we focused on the physical properties of the RF signal in order to understand the failure rate by noting the existence of the ground planes and noise sources in the real environment. By using the mathematical computation software, Maple, we simulated the distribution of the electromagnetic field from a dipole antenna when ground planes exist. Calculations showed that the dark area can be formed by interference. We also constructed a test system to measure the failure rate in the detection of a RFID transponder. The test system was composed of a fixed RFID reader and an EPC Class1 Gen2 transponder which was attached to a scanner to sweep in the x-y plane. Labview software was used to control the x-y scanner and to acquire data. Tests in the laboratory environment showed that the dark area can be as much as 43 %. One who wants to use RFID and smart sensors should carefully consider the extent of the dark area.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.79-94
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• 2002

Root cause -Thermal expansion coefficient mismatch -Tape warpage -Initial die crack (die roughness) Guideline for failure prevention -Optimized tape/Substrate design for minimizing the warpage -Fine surface of die backside Root cause -Thermal expansion coefficient mismatch - Repetitive bending of a signal trace during TC cycle - Solder mask damage Guideline for failure prevention - Increase of trace width - Don't make signal trace passing the die edge - Proper material selection with thick substrate core Root cause -Thermal expansion coefficient mismatch -Creep deformation of solder joint(shear/normal) -Material degradation Guideline for failure Prevention -Increase of solder ball size -Proper selection of the PCB/Substrate thickness -Optimal design of the ball array -Solder mask opening type : NSMD -In some case, LGA type is better

• Journal of Korean Neurosurgical Society
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• v.61 no.1
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• pp.97-104
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• 2018

Objective : Diffusion-weighted magnetic resonance imaging (DW-MRI) has proven useful in the study of the natural history of ischemic stroke. However, the potential of DW-MRI for the evaluation of chronic subdural hematoma (CSDH) has not been established. In this study, we investigated DW-MRI findings of CSDH and evaluated the impact of the image findings on postoperative outcomes of CSDH. Methods : We studied 131 CSDH patients who had undergone single burr hole drainage surgery. The images of the subdural hematomas on preoperative DW-MRI and computed tomography (CT) were divided into three groups based on their signal intensity and density : 1) homogeneous (iso or low) density on CT and homogeneous low signal intensity on DW-MRI; 2) homogeneous (iso or low) density on CT and mixed signal intensity on DW-MRI; and 3) heterogeneous density on CT and mixed signal intensity on DW-MRI. On the basis of postoperative CT, we also divided the patients into 3 groups of surgical outcomes according to residual hematoma and mass effect. Results : Analysis showed statistically significant differences in surgical (A to B : p<0.001, A to C : p<0.001, B to C : p=0.129) and functional (A to B : p=0.039, A to C : p<0.001, B to C : p=0.108) outcomes and treatment failure rates (A to B : p=0.037, A to C : p=0.03, B to C : p=1) between the study groups. In particular, group B and group C showed worse outcomes and higher treatment failure rates than group A. Conclusion : CSDH with homogeneous density on CT was characterized by signal intensity on DW-MRI. In CSDH patients, performing DW-MRI as well as CT helps to predict postoperative treatment failure or complications.

• Journal of the Korea Society of Computer and Information
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• v.8 no.3
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• pp.179-187
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• 2003

This study investigate the reasons of organizational failure in detection and appropriate response to risk signal. The Crisis does not come true suddenly, there is some risk signals in crisis. If Organization detect the risk signals the crisis is come true opportunities, if not the crisis is come true disastrous outcome. This is use the system dynamics approach. System Dynamics assume the system as a collection of causal feedback loop, so we understand the dynamics around the problems. This investigate suggest that, the focus on growth is the a kind of promotional pressure and the pressure drive the organization to less attention the risk signal, so the risk is underestimate In proportion to real risk. Ultimate, the organization entrap the promotional climate and insensible to security. This study is a kind of hypothesis-discovering research, in the further study, the discovered hypothesis will be empirically tested.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.1485-1488
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• 1997

The capacity of memory chip has increased vert quickly and 64MDRAM becomes main product in semiconductor manufacturing lines consists of many sequential processes, including etching process. although it needs direct sensing of wafer state for the accurae detching, it depends on indirect esnsing and sample test because of the complexity of the plasma etching. This equipment receives the inner light of etch chamber through the viewport and convets it to the voltage inetnsity. In this paper, EDP voltage signal has a new role to detect etching failure. First, we gathered data(EPD sigal, etching time and etchrate) and then analyzed the relationships between the signal variatin and the etch rate using two neural network modeling. These methods enable to predict whether ething state is good or not per wafer. For experiments, it is used High Density Inductive coupled Plasma(HDICP) ethcing equipment. Experiments and results proved to be abled to determine the etching state of wafer on-line and analyze the causes by modeling and EPD signal data.