• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.695-698
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• 2006

The photosensitive poly-siloxane material used as the passivation layers for the conventional back channel etched (BCE) thin film transistors (TFTs) has been investigated. Through the organic material, the TFT array fabrication process can be reduced and higher aperture ratio can be achieved for higher LCD panel performance. The interface between the organic passivation layer and the back channel of the amorphous active region has been improved by the back channel oxygen treatment and the devices exhibits lower leakage current than the conventional silicon nitride passivation layer of BCE TFTs. The leakage currents between Indium-tin-oxide (ITO) pixels and the TFT devices and its mechanism have also been investigated in this paper.

• Journal of the Korean Ceramic Society
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• v.38 no.1
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• pp.61-67
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• 2001

비대칭 펄스 직류 반응성 스퍼터링을 이용하여 상온에서 Si(100) 기판 위에 AlN 박막을 증착하였다. 100 kHz에서 200 kHz까지 펄스 주파수의 변화 및 70%에서 90%까지 duty cycle의 변화에 따른 아크 발생과 AlN 박막의 결정성 그리고 미세 조직을 관찰하였다. Duty cycle에서 양의 펄스 유지 시간이 증가함에 따라 증착 중에 아크 발생 빈도가 현저히 감소하였고 AlN 박막의 입자 크기와 결정상의 c축 배향성이 증가하였다. 반면에 펄스 주파수 변화에 따른 아크 발생은 일정한 경향을 나타내지 않았지만 전반적으로 많은 아크가 발생했다. 아크 발생 빈도가 늘어남에 따라 c축 배향성이 감소하였다. 양의 펄스 유지 시간과 펄스 주파수가 감소함에 따라 박막의 증착 속도는 증가하였으며 440$\AA$/min의 높은 증착 속도를 나타냈다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.170-170
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• 2004

박막의 접착강도를 측정하기 위하여 수직력과 수평력을 동시에 측정할 수 있는 0.1∼100 N 용량의 2축 로드셀에 기반을 둔 스크레치 테스터를 개발하였다. 반도체용 Si wafer 기판 위에 Au나 Al 등의 금속이 관은 박막으로 증착된 제품을 table에 고정시킨 후, 2축 로드셀(x, z)이 장착된 하중센서의 선단에 Diamond Tip을 장착하여 기판과 박막에 하중(z-axis)을 증가시키면서 동시에 wafer를 x축 방향으로 이동시킨다. 이런 방식으로 시료의 표면을 긁으면 박막이 벗겨져 나가 Diamond Tip이 기판에 닿을 때 서로 다른 경도차에 의해 진동이 발생하게 되고, 이 진동을 Acoustic Emission 센서에서 감지하여 Crack 발생 시점의 Load와 Stroke를 찾아내게 된다.(중략)

• Journal of the Korean Ceramic Society
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• v.38 no.5
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• pp.474-478
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• 2001

유기 화학 기상 증착법(MOCVD)을 이용하여 반응기체 $O_2$의 양 및 Y와 Mn의 운반기체 비(Y/Mn)를 변화시켜가며 Si(100) 기판 위에서 MFSFET(metal-ferroelectric-semiconductor field effect transistor) 구조의 YMnO$_3$박막을 증착하였다. 반응기체 $O_2$의 양이 150sccm일 때 Y/Mn=2와 3인 경우 단일상의 육방정계 YMnO$_3$박막이 형성되었다. YMnO$_3$박막의 전기적 특성은 사방정계 YMnO$_3$박막에서는 나타나지 않았으나, 육방정계 YMnO$_3$박막의 경우 결정립 크기에 영향을 받아 단일상의 육방정계 YMnO$_3$박막 중 결정립 크기가 150nm~200nm(Y/Mn=2)인 경우에는 잔류분극이 100nC/$ extrm{cm}^2$인 P-E 이력곡선의 특성을 나타내었다.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.16-19
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• 2007

In this paper, we present work that has been carried out using the SLS process to control grain boundary(GB) location in TFT channel region and it is possible to locate the GB at the same location in the channel region of each TFT. We fabricated TFT by applying a new alignment SLS process and compared the TFT characteristics with a normal SLS method and the grain boundary location controlled SLS method. Also, we have analyzed degradation phenomena under hot carrier stress conditions for n-type LDD MOSFETs.

• Journal of the Korean Vacuum Society
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• v.4 no.3
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• pp.313-318
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• 1995

비정질실리콘의 고상결정화 및 다결정실리콘의 열상화를 포함한 고온공정으로 제작한 다결정실리콘 박막 트랜지스터의 서브트레시홀드 특성을 연구하였다. 제작된 소자의 전계효과이동도는 60$ extrm{cm}^2$/V.s 이상, 서브트레시홀드 수윙은 0.65 V/decade 이하로 전기적 특성이 매우 우수하다. 그러나, 소자의 문턱전압이 음게이트전압으로 크게 치우쳐 있으며 n-채널과 p-채널 소자간의 서브트레시홀드 특성이 크게 다르다. 열성장된 게이트 산화막을 가진 다결정실리콘 박막 트랜지스터의 서브트레시홀드 특성을 다결정실리콘 활성층내의 트랩과, 게이트산화막과 다결정실리콘 사이의 계면 고정전하를 이용하여 모델링하였다. 시뮬레이션을 통하여 제안된 다결정실리콘의 트랩모델이 실험결과를 잘 설명할 수 있음을 확인하였다.

• Journal of the Korean institute of surface engineering
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• v.38 no.4
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• pp.144-149
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• 2005

ZnO films were produced on the Si(100) and sapphire(0001) wafers by RF magnetron sputtering in terms of processing variables such as substrate temperature and RF power. The stress in films was obtained from the Stoney's formula using a laser scanning device. The stress levels in the films showed the range from $\~40$ MPa to $\~-1100$MPa depending on processing variables. The specimens were thermally cycled from R.T. to $250^{\circ}C$ to investigate the stress variation as a function of temperature. SEM was employed to characterize the microstructure of te films. As the substrate temperature increased, the film surface became rougher and the films showed coarser grains. The optical property o the films was studied by PL measurements. At the highest substrate temperature $800^{\circ}C$ the film exhibited sharper UV peaks unlike other conditions.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.30.1-30.1
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• 2011

Silicon is one of useful materials in various industry such as semiconductor, solar cell, and secondary battery. The metallic silicon produces generally melting process for ingot type or chemical vapor deposition (CVD) for thin film type. However, these methods have disadvantages of high cost, complicated process, and consumption of much energy. Electrodeposition has been known as a powerful synthesis method for obtaining metallic species by relatively simple operation with current and voltage control. Unfortunately, the electrodeposition of the silicon is impossible in aqueous electrolyte solution due to its low oxidation-reduction equilibrium potential. Ionic liquids are simply defined as ionic melts with a melting point below $100^{\circ}C$. Characteristics of the ionic liquids are high ionic conductivities, low vapour pressures, chemical stability, and wide electrochemical windows. The ionic liquids enable the electrochemically active elements, such as silicon, titanium, and aluminum, to be reduced to their metallic states without vigorous hydrogen gas evolution. In this study, the electrodeposion of silicon has been investigated in ionic liquid of 1-butyl-3-methylpyrolidinium bis (trifluoromethylsulfonyl) imide ([bmpy]$Tf_2N$) saturated with $SiCl_4$ at room temperature. Also, the effect of electrode materials on the electrodeposition and morphological characteristics of the silicon electrodeposited were analyzed The silicon electrodeposited on gold substrate was composed of the metallic Si with single crystalline size between 100~200nm. The silicon content by XPS analysis was detected in 31.3 wt% and the others were oxygen, gold, and carbon. The oxygen was detected much in edge area of th electrode due to $SiO_2$ from a partial oxidation of the metallic Si.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05a
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• pp.53-56
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• 2004

The a-Si:H TFT using ferroelectric of SrTi $O_3$as a gate insulator is fabricated on glass. Dielectric characteristics of ferroelectric are superior to $SiO_2$and S $i_3$ $N_4$. Ferroelctric increases on-current, decreases thresh old voltage of TFT and also improves breakdown characteristics. The a-SiN:H has optical band gap of 2.61 eV, refractive index of 1.8~2.0 and resistivity of 10$^{13}$ - 10$^{15}$ $\Omega$cm, respectively. Insulating characteristics of ferroelectrics are excellent because dielectric constant of ferroelectric is about 60~100 and breakdown strength is over 1MV/cm. TFT using ferroelectric has channel length of 8~20${\mu}{\textrm}{m}$ and channel width of 80~200${\mu}{\textrm}{m}$. And it shows that drain current is 3.4$mutextrm{A}$ at 20 gate voltage, $I_{on}$ / $I_{off}$ is a ratio of 10$^{5}$ - 10$^{8}$ and $V_{th}$ is 4~5 volts, respectively. In the case of TFT without ferroelectric, it indicates that the drain current is 1.5 $mutextrm{A}$ at 20 gate voltage and $V_{th}$ is 5~6 volts. With the improvement of the ferroelectric thin film properties, the performance of TFT using this ferroelectric has advanced as a gate insulator fabrication technology is realized.zed.d.

• Journal of Korean Ophthalmic Optics Society
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• v.3 no.1
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• pp.217-222
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• 1998

Coating films of $SiO_2-TiO_2-AgO$ have been prepared on soda-lime-silica slide glasses and single crystal silicon wafer by the sol-gel method using a spin-coating technique. Commercially available tetraethyl orthosilicate, titanium trichloride, and silver-nitrates were used as starting materials. The heat treatment temperature of this coating films was $500^{\circ}C$ properly, obtained from TG-DTA result. The films with thickness of 310 nm were prepared by 5 times coating. In the case of l0 mol% AgO, the film showed a crack-free and smooth surface, but the higher Ago content exhibited the more pin hole and the segregated cluster of AgO. The IR absorbance of the films decreased in the range of 400 nm to 700 nm with the increase of annealing temperature. And the reflectance of the coating films decreased and the color was changed light yellow to white yellow with the increase of Ago content.