• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.52 no.7
• /
• pp.293-297
• /
• 2003

Silicon dioxide (SiO$_2$) layers were fabricated on Si$_3$N$_4$/SiO$_2$/Si layer structures by low pressure chemical vapor deposition (LPCVD). Potassium and aluminum were then coimplanted by implanting potassium ions with the energy of 100 ［keY］ and dose of 5x10$^{16}$ [cm￣$^2$］ and 1x10$^{17}$ [cm￣$^2$］ into an aluminum buffer layer on the SiO$_2$Si$_3$N4/SiO$_2$/Si structure. The pH, pNa, and pK ion sensitivities of the resulting layers were investigated and compared to those of as-deposited silicon dioxide layer. The pK-sensitivity of the silicon dioxide was enhanced by the K and Al coimplantation. On the contrary, the pH and pNa-sensitivities of the coimplanted silicon dioxides were quite lower than that of the as-deposited silicon dioxide.

• Restorative Dentistry and Endodontics
• /
• v.24 no.1
• /
• pp.156-165
• /
• 1999

The purpose of this study was to evaluate the effect of surface treatments on the shear bond strength between new and old composites. Circular cavities prepared on the center of acrylic resin mold and the prepared cavities were filled with composite resin. They randomly assigned into control group and 8 groups according to the difference in surface treatments of old composites; Control group: no surface treatment, Group 1: surface treated with #120 SiC paper & bonding agent, Group 2: surface treated with #400 SiC paper & bonding agent, Group 3: surface treated with #120 SiC paper, 32% $H_3PO_4$ & bonding agent, Group 4: surface treated with #400 SiC paper, 32% $H_3PO_4$ & bonding agent, Group 5: surface treated with #120 SiC paper, primer & bonding agent, Group 6: surface treated with #400 SiC paper, primer & bonding agent, Group 7: surface treated with #120 SiC paper, 32% $H_3PO_4$, primer & bonding agent, Group 8: surface treated with #400 SiC paper, 32% $H_3PO_4$, primer & bonding agent. New composites were applicated on the old composites of experimental groups. The shear bond strengths for the experimental specimen were measured and the results were analyzed by using one way ANOVA. The observations of surface morphology after SiC paper roughening and debonded surface morphology after shear bond strength test were done by SEM. The results were as follows; 1. Shear bond strengths for specimens roughened with #120 SiC paper matching with the particle size of coarse diamond bur were significantly higher than those for the specimens with #400 SiC paper(P<0.05). By SEM, the surface of the specimens roughened with #120 SiC paper was more irregular than the specimens with #400 SiC paper. 2. Shear bond strengths for specimens treated with 32% $H_3PO_4$ etchant, primer, bonding resin were significantly higher than those for specimens treated with 32% $H_3PO_4$ and bonding resin(P<0.05). 3. Shear bond strengths for the specimens treated with 32% $H_3PO_4$ etchant and bonding resin were significantly higher than those for specimens treated with only bonding resin(P<0.05). There was no remarkable change of surface morphology after 32% $H_3PO_4$ etching. 4. It was possible to observe mixed fracture patterns (the cohesive fracture of old composite and the adhesive fracture between old and new composite) in the specimens roughened with #120 SiC paper, but almost adhesive fracture in the specimens roughened with #400 SiC paper.

• Journal of the Korean Ceramic Society
• /
• v.39 no.8
• /
• pp.783-788
• /
• 2002

In this study, nano-sized Si-C-N precursor powders were synthesized by Chemical Vapor Condensation Method(CVC) using TMS(Tetramethylsilane: Si($CH_3)_4$), $NH_3$ and $H_2$ gases under the various reaction conditions of the reaction temperature, TMS/$NH_3$ ratio and TMS/$H_2$ ratio. XRD and FESEM were used to analysis the crystalline phase and the average particle size of the synthesized powders. It was found that the obtained powders under the considering conditions were all spherical amorphous powder with the particle size of 87∼130 nm. The particle size was decreased as the reaction temperature increased and TMS/$NH_3$ and TMS/$H_2$ ratio decreased. As the results of EA analysis, it was found that the synthesized powders had been formed the powders composed of Si, N, C and H. Through FT-IR results, it was found that the synthesized powders were Si-C-N precursor powders with Si-C, Si-N and C-N bonds.

• Journal of the Korean Vacuum Society
• /
• v.16 no.4
• /
• pp.279-285
• /
• 2007

We have demonstrated structural evolution and optical properties of the Si-NWs on Si (111) substrates with synthesized nanoscale Au-Si islands by rapid thermal chemical vapor deposition(RTCVD). Au nano-islands (10-50nm in diameter) were employed as a liquid-droplet catalysis to grow Si-NWs via vapor-liquid-solid mechanism. Si-NWs were grown by a mixture gas of $SiH_4\;and\;H_2$ at pressures of $0.1{\sim}1.0$Torr and temperatures of $450{\sim}650^{\circ}C$. SEM measurements showed the formation of Si-NWs well-aligned vertically for Si (111) surfaces. The resulting NWs are 30-100nm in diameter and $0.4{\sim}12um$ in length depending on growth conditions. HR-TEM measurements indicated that Si-NWs are single crystals convered with about 3nm thick layers of amorphous oxide. In addition, optical properties of NWs were investigated by micro-Raman spectroscopy. The downshift and asymmetric broadening of the Si optical phonon peak with a shoulder at $480cm^{-1}$ were observed in Raman spectra of Si-NWs.

• Korean Journal of Materials Research
• /
• v.7 no.6
• /
• pp.472-478
• /
• 1997

TMS(tetramethysilane, Si(CH$_{3}$)$_{4}$)를 이용하여 RTCVD(rapid thermal chemical vapor deposition)장치에서 Si(111) 기판 위에 $\beta$-SiC(111)를 성장시켰다. 실험변수로는 반응온도, TMS유량, 반응시간, H$_{2}$유량을 변화시켰으며, XRD, IR, SEM, RBS, TEM등을 이용하여 성장된 박막을 분석하였다. 성장된 박막은 crystallized Si, C또한 Si-H, C-H결합은 관찰할 수 없었으나 다결정이었다. TMS의 유량이 증가함에 따라, 성장온도가 감소함에 따라서 미려한 박막을 성장시킬 수 있었으며, 반응의 활성화에너지는 20kcal/molㆍK이었다.

• Korean Journal of Materials Research
• /
• v.3 no.5
• /
• pp.459-465
• /
• 1993

By making the inter-metal PECVD $SiO_2$ as a Si rich oxide under the SOG, the hydrogen and water related diffusants could be captured a t SI dangling bonds. This gettering process was known to prevent the device characteristics degradations related to the H, $H_20$. The basic characteristics of Si rich oxide have been studied according to changing high/low frequency power and $SiH_4/N_2O$ gas flow ratio in PECVD. As increase in low frequency power, deposition rate decreased but K.I. and compressive stress increased. Decrease of the water peaks of FTIR spectra at the wave number range of 3300~3800$\textrm{cm}^{-1}$' also indicated that intensty the films were densified. As increase in SiH, gas flow rate, deposition rate, R.I. and etch rate increased while compressive stress decreased. F'TIK spectra showed that peak intensity corresponding to Si-0-Si stretching vibration decreased and shifted to the lower wave numbers. But AES showed that Si dangl~ng bonds were increased as a result of lower Si:O(l: 1.23) ratlo inthe Si rich oxide as compared to Si : O(1 : 1.98) ratio of usual oxide.

• Journal of the Korean Vacuum Society
• /
• v.7 no.1
• /
• pp.29-34
• /
• 1998

The solid-phase crystallization (SPC) of plasma-enhanced chemical vapor depsoited (PECVD) amorphous silicon (a-Si) films ha s been investigated by x-ray diffraction (XRD). The a-Si films were prepared on Si (100) wafers using $SiH_4$ gas and without $H_2$ dilution at the substrate temperatures between $120^{\circ}C$ and $380^{\circ}C$, and than annealed at $600^{\circ}C$ for crystallization. The annealed samples exhibited (111), (220), and (311) XRD peaks with preferential orientation of (111). The XRD peak intensities increased as the substrate temperature decreased, and the $H_2$dilution suppressed the solid-phase crystallization. The average grain size estimated by XRD analysis for the (111) texture has increased from about 10 nm to about 30 nm, as the substrate temperature decreased. The deposition rate also increased with the decreasing substrate temperature and the grain size was closely dependent on the deposition rate of the films. The grain size enhancement was attributed to an increase of the structural disorder of the Si network.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.08a
• /
• pp.169.2-169.2
• /
• 2013

본 연구에서는 gas를 이용한 PECVD 공법중 이온화 에너지가 높고 대면적 코팅이 용이한 Hybrid 코팅 장비에서 Linear Ion-Gun 이용하여 탄화수소 계열의 gas인 $C_2H_2$ 와 Si을 함유한 TMS (tetramethylsilane, $Si(CH_3)_4)$ gas를 이용하여 저마찰, 고경도 특성을 갖는 Si-DLC 코팅에 대한 연구를 수행하였다. Si-DLC 코팅에 앞서 전처리 공정으로 Linear Ion-Gun에 Ar gas를 주입하고 고전압의 DC 전원을 인가하여 제품 표면의 건식세정 및 표면 활성화를 진행 후, $C_2H_2$ 와 TMS gas를 Linear Ion-Gun에 주입하여 Si-DLC 코팅 공정을 진행하였다. Si-DLC 코팅시 $C_2H_2$ gas 주입량을 고정하고 TMS 가스 유량을 5~20sccm으로 조절하여 Si 함유량에 따른 Si-DLC 코팅막의 특성을 분석하였다. 이렇게 코팅된 Si-DLC의 박막 특성 분석으로 마찰계수 측정을 위해 ball-on-disk 타입의 tribometer를 사용하였으며, 박막 경도 측정은 Nano-indenter를 이용하여 분석을 진행하였다. 그 결과 Si을 포함하지 않는 DLC의 경우 마찰계수가 ~0.2를 가지는 반면, Si-DLC의 경우 Si 함유량이 약 1.5at%일 때, 마찰계수 ~0.04 저마찰의 우수한 특성을 지니며, 박막의 경도는 22[Gpa]로 고경도의 Si-DLC 코팅을 확인할 수 있었다.

• Journal of the Korean Ceramic Society
• /
• v.24 no.5
• /
• pp.500-506
• /
• 1987

In order to synthesize monodispersed spherical silica fine particles, we investigated the reaction of hydrolysis of 0.05∼4.0 mole Si(OC2H5)4-0.01∼7.60mole NH3 -0.24∼38.40 mole H2O-2.62∼16.88mole C2H5OH systems. The range of the composition of solution which spherical silica particles were formed was enlarged according to an increase in concentration of Si(OC2H5)4. Larger particles were obtained at higher molar ratios of Si(OC2H5)4/C2H5OH, NH3/H2O and H2O/Si(OC2H5)4 and at a lower reaction temperature.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.7 no.3
• /
• pp.487-493
• /
• 1997

Ti/sic(4H) Schottky barrier diodes were fabricated. The donor concentration and the built-in potential obtained by capacitance-voltage(C-V) measurement was about $2.0{\times}10^{15}{\textrm}{cm}^{-3}$ and 0.65 V, respectively. The ideality factor of 1.07 was obtained from the slope of current-voltage(I-V) characteristics at low current density. The breakdown field under the reverse bias voltage was about $1.7{\times}10^3V/{\textrm}{cm}$ and was very high. The barrier height of Ti for SiC(4H) was 0.91 V, which was determined by the analysis of the saturation current-temperature and the C-V characteristics.