• The Journal of Korean Academy of Prosthodontics
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• v.41 no.3
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• pp.379-386
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• 2003

Statement of problem. Resin cements are widely used in adhesive dentistry specially on all ceramic restorations. It is needed to find out adequate bonding strength between different porcelain surface treatments, commercially available porcelains, and different resin cement systems. Purpose. The purpose of this study was to evaluate shear bond strength of resin cements bonded to porcelains in three different modalities; 5 different porcelain surface treatments, 3 different resin cement systems and 3 different commercially available pressable porcelains. Material and Method. This study consisted of 3 parts. Part I examined the effect of five different surface treatments on the pressable porcelain. Fifty discs (5 mm in diameter and 3 mm in height) of Authentic porcelain were randomly divided into 5 groups (n = 10). The specimens were sanded with 320 grit SiC paper followed by 600 grit SiC paper. The specimens were treated as follow: Group 1-Sandblasting (aluminum oxide) only, Group 2 - sandblasting/ silane, Group 3 - sandblasting/ acid etching/ silane, Group 4 - acid etching only, Group 5 - acid etching/ silane. Part II examined the shear bond strength of 3 different resin cement systems (Duolink, Variolink II, Rely X ARC) on acid etching/ silane treated Authentic pressable porcelain. Part 3 examined the shear bond strength of Duolink resin cement on 3 different pressable porcelains (Authentic, Empress I, Finesse). All cemented specimens were stored in distilled water for 2 hours and tested with Ultradent shear bond strength test jig under Universal Instron machine until fracture. An analysis of variance(ANOVA) test was used to evaluate differences in shear bond strength. Result. The shear bond strength test resulted in the following: (1) Acid etched porcelains recorded greater shear bond strength values to the sandblasted porcelains. (2) Silane treated porcelains recorded greater shear bond strength values to non-silane treated porcelains. (3) There was no significant difference between sandblasting/ acid etching/ silane treated and acid etching/ silane treated porcelains. However those values were much higher than other three groups. (4) The shear bond strength with Variolink II was lower than the value of Duolink or Rely X ARC. (5) The shear bond strength of Finesse was lower than the value of Authentic or Empress I.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.33-36
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• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina $(Al_2O_3)$ abrasive containing slurry with 5 % $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with 5 % $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

• Membrane Journal
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• v.24 no.4
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• pp.301-310
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• 2014

In this study, the silica nanoparticles were considerably chosen to improve a dimensional stability, proton transport and electrochemical performance of the resulting inorganic-organic nanocomposite membranes. For this purpose, hydrophobic silica (Aerosil$^{(R)}$ 812, Degussa) and hydrophilic silica (Aerosil$^{(R)}$ 380, Degussa) nanoparticles were, respectively, introduced into a Sulfonated poly(arylene ether sulfone) (SPAES) polymer matrix. The $SiO_2$ particles are evenly dispersed in a SPAES matrix by the aid of a non-ionic surfactant (Pluronics$^{(R)}$ L64). A $SiO_2$ content plays an important role in membrane microstructures and membrane properties such as proton conductivity and water uptake. Therefore, to study nanocomposite membranes with excessive amount of silica, the content of silica nanoparticles were increased up to 5 wt%. Interestingly, a hydrophobic $SiO_2$ containing nanocomposite membrane showed better electrochemical performance (29% higher than pristine SPAES) despite of low proton conductivity due to its adhesive properties with a catalyst layer in a single cell test. All the silica-SPAES membranes exhibited better performance than a pristine SPAES membrane.

• Corrosion Science and Technology
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• v.7 no.1
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• pp.50-60
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• 2008

The majority of the described experimental results deal with relatively pure aluminium. Variations were made in the pretreatment of the aluminum substrates and an investigation was performed on the resulting changes in oxide layer composition and chemistry. Subsequently, the bonding behavior of the surfaces was investigated by using model adhesion molecules. These molecules were chosen to represent the bonding functionality of an organic polymer. They were applied onto the pretreated surfaces as a monolayer and the bonding behavior was studied using infrared reflection absorption spectroscopy. A direct and clear relation was found between the hydroxyl fraction on the oxide surfaces and the amount of molecules that subsequently bonded to the surface. Moreover, it was found that most bonds between the oxide surface and organic functional groups are not stable in the presence of water. The best performance was obtained using molecules, which are capable of chemisorption with the oxide surface. Finally, it was found that freshly prepared relatively pure aluminum substrates, which are left in air, rapidly lose their bonding capacity towards organic functional groups. This can be attributed to the adsorption of contamination and water to the oxide surface. In addition the adhesion of a typical epoxy-coated aluminum system was investigated during exposure to water at different temperatures. The coating was found to quite rapidly lose its adhesion upon exposure to water. This rapid loss of adhesion corresponds well with the data where it was demonstrated that the studied epoxy coating only bonds through physisorptive hydrogen bonding, these bonds not being stable in the presence of water. After the initial loss the adhesion of the coating was however found to recover again and even exceeded the adhesion prior to exposure. The improvement could be ascribed to the growth of a thin oxyhydroxide layer on the aluminum substrate, which forms a new, water-stable and stronger bond with the epoxy coating. Two routes for improvement of adhesion are finally decribed including an interphasial polymeric thin layer and a treatment in boiling water of the substrate before coating takes place. The adhesion properties were finely also studied as a function of the Mg content of the alloys. It was shown that an enrichment of Mg in the oxide could take place when Mg containing alloys are heat-treated. It is expected that for these alloys the (hydr)oxide fraction also depends on the pre-treatment and on the distribution of magnesium as compared to the aluminium hydroxides, with a direct impact on adhesive properties.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.146-150
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• 2001

Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe. And the cascade transmission matrix conversion was performed. The same measurements and conversion techniques were conducted on the assembled test chip and substrate at the same frequency range. Then impedance values in ACF flip-chip interconnection were extracted from cascade transmission matrix. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of SiO$_2$filler to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. High frequency behavior of metal Au stud bumps was investigated. The resonance frequency of the metal stud bump interconnects is higher than that of ACF flip-chip interconnects and is not observed at the microwave frequency band. The extracted model parameters of adhesive flip chip interconnects were analyzed with the considerations of the characteristics of material and the design guideline of ACA flip chip for high frequency applications was provided.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.9-17
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• 2018

Aluminum (Al) and its alloys have been used widely in a variety of industries such as structural, electronic, aerospace, and particularly automotive industries due to their lightweight characteristic, outstanding ductility, formability, high oxidation and corrosion resistance, and high thermal and electrical conductivity. Al have different kinds of alloys according to the various additional elements system and they should be selected properly depending on their effectiveness and suitability for their particular purpose. The major elements for Al alloys are silicon (Si), magnesium (Mg), manganese (Mn), copper (Cu), and zinc (Zn). In order for Al alloys to use for each industry, it is necessary to study of Al to Al joining and/or the Al to dissimilar materials joining to combine the individual parts into one. Many studies on joining technologies about Al to Al and Al to dissimilar materials have been performed such as press joining, bolted joint, welding, soldering, riveting, adhesive bonding, and brazing. This study reviews a variety of Al alloys and their joining method including its principles and properties with recent trends.

• Development and Reproduction
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• v.19 no.1
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• pp.25-31
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• 2015

We have launched an investigation for Embryonic Development, Larvae and Juvenile Morphology, of Buenos aires tetra in order to build basic data of Characidae and fish seeding production. We brought 50 couples of Characidae from Bizidduck aquarium in Yeosu-si, Jeollanamdo, from Korea on March of 2015. We put them in the tetragonal glass aquarium ($50{\times}50{\times}30cm$). Breeding water temperature was $27.5{\sim}28.5^{\circ}C$ (mean $28.0{\pm}0.05^{\circ}C$) and being maintained. The shape of fertilized egg was round shape, and it was adhesive demersal egg. The egg size was 0.63~0.91 mm (mean $0.74{\pm}0.07mm$, n=20). After getting fertilized egg, the developmental stage was gastrula stage, and embryo covered almost two-thirds of Yolk. Incubation was happened after 16 hours 13 minutes from gastrula stage, and the tail of juvenile came out first with tearing egg capsule. Immediately after the incubation, prelarvae had 3.78~3.88 mm length (mean $3.84{\pm}0.04mm$, n=5), and it had no mouth and anus yet. 34 days after hatching from the incubation, juvenile had 8.63~13.1 mm (mean $10.9{\pm}1.66mm$), and it had similar silver-colored body shape with its mother.

• Current Photovoltaic Research
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• v.4 no.2
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• pp.59-63
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• 2016

A key point of a soldering process for photovoltaic (PV) modules is to increase an adhesive strength leading a low resistivity between ribbon and cell. In this study, we intended to optimize a heating condition for the soldering process and characterize the soldered joint via physical and chemical analysis methods. For the purpose, the heating conditions were adjusted by IR lamp power, heating time and hot plate temperature for preheating a cell. Since then the peel test for the ribbon and cell was conducted, consequently the peel strength data shows that there is some optimum soldering condition. In here, we observed that the peel strength was modified by increasing the heating condition. Such a soldering property is affected by a various factors of which the soldered joint, flux and bus bar of the cell are changed on the heating condition. Therefore, we tried to reveal causes determining the soldering property through analyzing the soldered interface.

• Journal of Veterinary Clinics
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• v.29 no.4
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• pp.319-322
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• 2012

This case presents application of bioadhesive for inguinal hernia repair of Jeju native pigs. An inguinal hernia was diagnosed in Jeju native pigs, respectively, 3 days of age and 30 days of age, by physical and radiographic examination. Inguinal herniorrhaphy was performed under sedation with azaperone. After excision of scrotal sac, gently separated testis and intestinal loops. Herniated testis was isolated from scrotal sac and intestinal loops were replaced in the abdominal cavity. The external inguinal ring surface and skin closed using the technique of tissue adhesive. The patients were recovered without post-operative complications. This result considered that bioadhesive application could be a simple method to reduction of scrotal hernia without post-treatment like removal of sutures.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.132.2-132.2
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• 2017

플라즈마 전해 산화(Plasma Electrolytic Oxidation, PEO)는 Al, Ti, Mg 합금과 같은 경량 금속소재에 대한 표면처리기술로서 주목을 받고 있다. PEO 처리에 의해 표면에 치밀하게 형성되는 세라믹 산화층은 우수한 내식성, 내마모성을 보유하기 때문에, 이와 같은 특성이 요구되는 분야에 적용하기 위한 연구가 활발하다. 특히 PEO 세라믹 코팅층의 응착마모(adhesive wear)와 절삭마모(abrasive wear)에 관한 연구는 상당부분 이루어지고 있으나, 캐비테이션 침식과 같은 침식마모(erosive wear) 특성에 관한 연구는 부족한 실정이다. 본 연구에서는 알루미늄 합금 소지에 제작된 PEO 코팅층의 캐비테이션 손상 특성을 고찰하였으며, 전해액 조성이 PEO 코팅층의 미세조직과 캐비테이션 손상 특성에 미치는 영향을 살펴보았다. PEO 처리를 위해 사용된 소재는 상용 5083-O합금 판재로서 $2cm{\times}2cm$로 절단하여, 에머리페이퍼로 1000번까지 연마하여 사용하였다. 사용된 전해액은 증류수에 KOH(1 g/L)을 base로 하여 $Na_2SiO_3$(2 g/L)의 첨가유무를 변수로 하였다. 시편을 양극으로 하고 STS304를 음극으로 하여 각각 DC 전원 공급기의 +극과 -극에 연결하였으며, 정전류 조건에서 30분간 $0.1A/cm^2$의 전류밀도를 인가하였다. PEO 처리후 시편은 SEM, EDS, XRD를 이용하여 표면 특성 평가를 실시하였다. PEO코팅층의 캐비테이션 특성 평가는 초음파 진동식 캐비테이션 발생 장치를 이용하였으며, 캐비테이션 실험 후 시간에 따른 표면 거칠기의 변화 거동을 분석하였다.