• Journal of the Korean Society of Radiology
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• v.11 no.6
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• pp.525-529
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• 2017

As a photoconductive material with a high X-ray sensitivity, many researches about mercury iodide has been carried out to substitute for amorphous selenium. However, it has many limitations in commercialization because of the high leakage current. In this study, we fabricated $HgI_2$ unit-cells with mixed silicon oxide($SiO_2$) and titanium oxide($TiO_2$) to reduce a high leakage current and we evaluated an electrical properties of the fabricated unit-cells. As a result, we confirmed that both mixtures were effective in reduing the leakage current of the $HgI_2$ and x-ray sensitivity were significantly increased in fabricated $HgI_2-TiO_2$ unit-cell.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.405-406
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• 2013

Ga-doped ZnO (GZO)는 $300^{\circ}C$ 이상의 온도에서는 전기적으로 불안정하기 때문에 CIGS, CdTe, DSC와 같은 태양전지의 높은 공정온도 때문에 사용이 제한적이다. ZTO thin film은 Al2O3, SiO2, TiO2, ZnO tihin film과 비교하여 산소 및 수분에 대하여 투과성이 상대적으로 낮은 것으로 알려져 있다. 따라서 GZO single layer에 비하여 ZTO-GZO multi-layer를 구성하여 TCO를 제작하면, 높은 공정온도에서도 사용 가능하다. 실제 제작된 GZO single layer (300 nm)에서 비저항이 $7.69{\times}10^{-4}{\Omega}{\cdot}cm$에서 $500^{\circ}C$에서 열처리 후 $7.76{\times}10^{-2}{\Omega}{\cdot}cm$으로 급격하게 상승한다. ZTO single layer (420 nm)는 as-grown에서는 측정 불가했지만, $400^{\circ}C$에서 열처리 후 $3.52{\times}10^{-1}{\Omega}{\cdot}cm$ $500^{\circ}C$에서 열처리 후 $4.10{\times}10^{-1}{\Omega}{\cdot}cm$으로 열처리에 따른 큰 변화가 없다. 또한 ZTO-GZO multi-layer (720 nm)의 경우 비저항이 $2.11{\times}10^{-3}{\Omega}{\cdot}cm$에서 $500^{\circ}C$에서 열처리 후 $3.67{\times}10^{-3}{\Omega}{\cdot}cm$으로 GZO에 비하여 상대적으로 변화폭이 작다. 또한 ZTO의 두께에 따른 영향을 확인하기 위하여 ZTO를 2 scan, 4 scan, 6 scan 공정 진행 및 $500^{\circ}C$에서 열처리 후 ZTO, ZTO-GZO thin film의 비저항을 측정하였다. ZTO의 경우 $3.34{\times}10^{-1}{\Omega}{\cdot}cm$ (2 scan), $3.62{\times}10^{-1}{\Omega}{\cdot}cm$ (4 scan), $4.1{\times}10^{-1}{\Omega}{\cdot}cm$ (6 scan)으로 큰 차이가 없으며, ZTO-GZO에서도 $3.73{\times}10^{-3}{\Omega}{\cdot}cm$ (2 scan), $3.42{\times}10^{-3}{\Omega}{\cdot}cm$ (4 scan), $3.67{\times}10^{-3}{\Omega}{\cdot}cm$ (6 scan)으로 큰 차이가 없음을 확인하였다. 염료감응 태양전지에 적용하여 기존에 사용되는 FTO대신에 ZTO-GZO를 사용하며, 가격적 측면, 성능적 측면에서 개선 가능할 것으로 생각된다.

• Journal of the Korean Solar Energy Society
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• v.40 no.4
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• pp.13-22
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• 2020

As the supply of photovoltaic (PV) increases worldwide, the cumulative installations in 2018 were 7.9 and 560 GW in Korea and the world, respectively. Typically, when the ground on commercial PV modules is installed, the area is limited; hence, new designs of PV modules are required to install additional PVs. Among the new design of PV modules, lightweight PV modules can be utilized in PV systems, such as buildings, farmlands, and floating PV. Concerning the investigation of lightweight PV modules, several studies on materials for replacing low-iron tempered glass, which comprises approximately 65% of the PV module weight, have been conducted. However, materials that are used as substitutes for glass should possess similar lightweight properties and reliability as glass. In this study, experimental tests were performed to evaluate the applicability of ethylene tetrafluoroethylene (ETFE) film with excellent resistance to water and aging as a front material of PV modules. The transmittance and ultraviolet properties of the ETFE film were determined and compared with those of glass. A 1-cell module and laboratory-scale 24-cell module were manufactured using the ETFE film and glass, and the electrical output was measured and analyzed. Furthermore, damp heat and thermal cycle tests were conducted to evaluate the reliability of the ETFE film module. Based on the experimental results, the electrical output and reliability of the ETFE film module were similar to those of the glass module, and the ETFE film could be used as the front material of PV modules.

• 한국신재생에너지학회:학술대회논문집
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• 2005.11a
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• pp.561-566
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• 2005

Polycrystalline silicon films were deposited using hot wire CVD (HWCVD). The deposition of silicon thin films was approached by the theory of charged clusters (TCC). The TCC states that thin films grow by self-assembly of charged clusters or nanoparticles that have nucleated in the gas phase during the normal thin film process. Negatively charged clusters of a few nanometer in size were captured on a transmission electron microscopy (TEM) grid and observed by TEM. The negatively charged clusters are believed to have been generated by ion-induced nucleation on negative ions, which are produced by negative surface ionization on a tungsten hot wire. The electric current on the substrate carried by the negatively charged clusters during deposition was measured to be approximately $-2{\mu}A/cm^2$. Silicon thin films were deposited at different $SiH_4$ and $H_2$ gas mixtures and filament temperatures. The crystalline volume fraction, grain size and the growth rate of the films were measured by Raman spectroscopy, X-ray diffraction and scanning electron microscopy. The deposit ion behavior of the si1icon thin films was related to properties of the charged clusters, which were in turn controlled by the process conditions. In order to verify the effect of the charged clusters on the growth behavior, three different electric biases of -200 V, 0 V and +25 V were applied to the substrate during the process, The deposition rate at an applied bias of +25 V was greater than that at 0 V and -200 V, which means that the si1icon film deposition was the result of the deposit ion of charged clusters generated in the gas phase. The working pressures had a large effect on the growth rate dependency on the bias appled to the substrate, which indicates that pressure affects the charging ratio of neutral to negatively charged clusters. These results suggest that polycrystalline silicon thin films with high crystalline volume fraction and large grain size can be produced by control1ing the behavior of the charged clusters generated in the gas phase of a normal HWCVD reactor.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.11-11
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• 2010

Thin-film-transistors (TFTs) that can be deposited at low temperature have recently attracted lots of applications such as sensors, solar cell and displays, because of the great flexible electronics and transparent. Transparent and flexible transistors are being required that high mobility and large-area uniformity at low temperature [1]. But, unfortunately most of TFT structures are used to be $SiO_2$ as gate dielectric layer. The $SiO_2$ has disadvantaged that it is required to high driving voltage to achieve the same operating efficiency compared with other high-k materials and its thickness is thicker than high-k materials [2]. To solve this problem, we find lots of high-k materials as $HfO_2$, $ZrO_2$, $SiN_x$, $TiO_2$, $Al_2O_3$. Among the High-k materials, $Al_2O_3$ is one of the outstanding materials due to its properties are high dielectric constant ( ~9 ), relatively low leakage current, wide bandgap ( 8.7 eV ) and good device stability. For the realization of flexible displays, all processes should be performed at very low temperatures, but low temperature $Al_2O_3$ grown by sputtering showed deteriorated electrical performance. Further decrease in growth temperature induces a high density of charge traps in the gate oxide/channel. This study investigated the effect of growth temperatures of ALD grown $Al_2O_3$ layers on the TFT device performance. The ALD deposition showed high conformal and defect-free dielectric layers at low temperature compared with other deposition equipments [2]. After ITO was wet-chemically etched with HCl : $HNO_3$ = 3:1, $Al_2O_3$ layer was deposited by ALD at various growth temperatures or lift-off process. Amorphous InGaZnO channel layers were deposited by rf magnetron sputtering at a working pressure of 3 mTorr and $O_2$/Ar (1/29 sccm). The electrodes were formed with electron-beam evaporated Ti (30 nm) and Au (70 nm) bilayer. The TFT devices were heat-treated in a furnace at $300^{\circ}C$ and nitrogen atmosphere for 1 hour by rapid thermal treatment. The electrical properties of the oxide TFTs were measured using semiconductor parameter analyzer (4145B), and LCR meter.

• Journal of the Korean Institute of Telematics and Electronics
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• v.18 no.3
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• pp.42-51
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• 1981

Boron was predeposited into p (100) Si wafer at 94$0^{\circ}C$ for 60minutes to make the back surface field. High tempreature diffusion process at 1145$^{\circ}C$ for 3 hours was immediately followed without removing boron glass to obtain high surface concentration Back boron was annealed at 110$0^{\circ}C$ for 40minutes after boron glass was removed. N+ layer was formed by predepositing with POCI3 source at 90$0^{\circ}C$ for 7~15 minutes and annealed at 80$0^{\circ}C$ for 60min1es under dry Of ambient. The triple metal layers were made by evaporating Ti, Pd, Ag in that order onto front and back of diffused wafer to form the front grid and back electrode respectively. Silver was electroplated on front and back to increase the metal thickness form 1~2$\mu$m to 3~4$\mu$m and the metal electrodes are alloyed in N2 /H2 ambient at 55$0^{\circ}C$ and followed by silicon nitride antireflection film deposition process. Under artificial illumination of 100mW/$\textrm{cm}^2$ fabricated N+PP+ cells showed typically the open circuit voltage of 0.59V and short circuit current of 103 mA with fill factor of 0.80 from the whole cell area of 3.36$\textrm{cm}^2$. These numbers can be used to get the actual total area(active area) conversion efficiency of 14.4%(16.2%) which has been improved from the provious N+P cell with 11% total area efficiency by adding P+ back.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.66.2-66.2
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• 2010

미니탭(Minitab) 프로그램에 있는 실험계획법(Design of experiment)를 이용하여 박막실리콘 I-layer의 주효과 및 교호작용에 대한 연구를 실시하였다. I-layer의 주요 특성은 증착속도 및 전도도에 대하여 분석을 하였으며, 최종적으로 선택된 증착조건을 사용하여 비정질 실리콘 태양전지를 제조하여 확인 하였다. 실험설계는 2수준 5인자 완전설계요인법을 사용하였다. 분석결과 단막의 증착속도에 영향을 주는 주효과로는 Power와 E/S거리고 나타났으며, Power와 E/S거리, Power와 Pressure에서 큰 교호작용이 일어남을 확인 할 수 있었다. 암전도의 영향을 주는 주효과는 Sub. Temp.를 제외하고는 모두 영향을 주고 있었으며, 상당히 복잡한 교호작용을 이루고 있어 정확한 분석을 할 수는 없었다. 광전도도의 경우도 주효과에서 SiH4 flow rate를 제외하고는 모두 영향을 주고 있었으며, 복잡한 교호작용으로 정확한 분석이 어려웠다. 따라서 P-value를 분석하여 최종 R-제곱값이 증착속도는 97%이상의 높은 값을 얻었으나 전도도의 경우 최대차수 3차항으로 70~80%정도의 낮은 값을 얻었을 수 있었다. 낮은 값을 얻은 이유로는 실험설계시 몇몇 조건이 불안정한 plasma 상태로 인하여 전도도의 측정 편차가 커 분석오차가 높았을 것으로 추정된다. 암전도를 망소특성, 광전도도를 망대특성으로 광민감도 $10^5$으로 최적화 하여 비정질 태양전지를 만들어 평가한 결과 약 9%대의 광변환 효율을 얻을 수 있었으나 만족도 40%대의 낮은 값으로 향후 이와 관련한 더 정밀한 측정 및 분석이 요구된다.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.619-619
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• 2009

Recently, silica nanostructures are widely used in various applicationary areas such as chemical sensors, biosensors, nano-fillers, markers, catalysts, and as a substrate for quantum dots etc, because of their excellent physical, chemical and optical properties. Additionally, these days, semiconductor silica and silicon with high purity is a key challenge because of their metallurgical grade silicon (MG-Si) exhibit purity of about 99% produced by an arc discharge method with high cast. Tremendous efforts are being paid towards this direction to reduce the cast of high purity silicon for generation of photovoltaic power as a solar cell. In this direction, which contains a small amount of impurities, which can be further purified by acid leaching process. In this regard, initially the low cast rice-husk was cultivated from local rice field and washed well with high purity distilled water and were treated with acid leaching process (1:10 HCl and $H_2O$) to remove the atmospheric dirt and impurity. The acid treated rice-husk was again washed with distilled water and dried in an oven at $60^{\circ}C$. The dried rice-husk was further annealed at different temperatures (620 and $900^{\circ}C$) for the formation of silica nanospheres. The confirmation of silica was observed by the X-ray diffraction pattern and X-ray photoelectron spectroscopy. The morphology of obtained nanostructures were analyzed via Field-emission scanning electron microscope(FE-SEM) and Transmission electron microscopy(TEM) and it reveals that the size of each nanosphares is about 50-60nm. Using the Inductively coupled plasma mass spectrometry(ICP-MS), Silica was analyzed for the amount of impurities.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.469-469
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• 2011

고효율 염료감응형 태양전지(DSSC, Dye-Sensitized Solar Cell)의 구현을 위해서 유용한 방법중 하나는 정렬된 기공 (pore)을 $TiO_2$막 내에 형성시키는 것이다. 메조포러스 (mesoporous) $TiO_2$막은 dip coating이나 spin coating과 같은 방법으로 주로 증착되고 있으며, P123이나 F127과 같은 amphiphilic triblock copolymer를 메조포러스 구조를 만들기 위한 뼈대로 사용하고 있다. 또한, 이렇게 생성된 구조에서 amphiphilic triblock copolymer는 열처리 공정을 통하여 쉽게 제거될 수 있다. 고효율 태양전지를 구현하는 또 다른 방법으로는 패턴 된 기판을 사용하는 것이다. 패턴 된 기판은 빛의 반사를 억제하여 흡수율을 높이는 역할을 한다. 그러나 패턴 된 기판 위에서 메조포러스 $TiO_2$막의 형성에 관한 연구는 부족한 실정이다. 본 연구에서는 spin coating 방법으로 패턴 된 Si (111) 기판 위에 메조포러스 $TiO_2$를 성장하고 그 미세구조를 분석하였다. 패턴 된 기판은 nanosphere lithography(NSL) 법으로 mask를 증착한 후 건식 식각 (dry etching) 공정을 통해서 제작되었으며, 마스크와 불순물 등 은 초음파 세척 등으로 제거되었다. 메조포러스 $TiO_2$막은 1-propanol, P123, titanium isopropoxide와 HCl을 섞어 만든 용액으로 1 cm${\times}$1 cm 기판 위에 3000 rpm과 4000 rpm으로 각각 증착하였으며, 5일 동안 4도에서 에이징한 후 350도에서 3시간 열처리하였다. 이렇게 형성한 메조포러스 막의 형상과 미세구조적 특성이 주사전자현미경(SEM, scanning electron microscope), X-선 회절(XRD, X-ray diffraction) 등을 이용하여 연구되었다. 특히, 증착 조건에 따른 메조포러스 $TiO_2$박막의 형성 기구에 관한 고찰이 진행되었다. 나아가, $TiO_2$박막과 패턴 사이에 형성되는 계면 구조에 관한 연구를 투과전자현미경을 이용하여 진행하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.10
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• pp.665-669
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• 2015

We investigated and compared two methods of in-situ oxidation and chemical etching treatment (CET) to remove the boron rich layer (BRL). The BRL is generally formed during boron doping process. It has to be controlled in order not to degrade carrier lifetime and reduce electrical properties. A boron emitter is formed using $BBr_3$ liquid source at $930^{\circ}C$. After that, in-situ oxidation was followed by injecting oxygen of 1,000 sccm into the furnace during ramp down step and compared with CET using a mixture of acid solution for a short time. Then, we analyzed passivation effect by depositing $Al_2O_3$. The results gave a carrier lifetime of $110.9{\mu}s$, an open-circuit voltage ($V_{oc}$) of 635 mV at in-situ oxidation and a carrier lifetime of $188.5{\mu}s$, an $V_{oc}$ of 650 mV at CET. As a result, CET shows better properties than in-situ oxidation because of removing BRL uniformly.