• Journal of Sensor Science and Technology
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• v.5 no.2
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• pp.61-67
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• 1996

The growth and characterization of heteroepitaxial $Si_{1-x}Ge_{x}$ films grown by the RTCVD (Rapid Thermal Chemical Vapor Deposition) method were described. For the growth of $Si_{1-x}Ge_{x}$ heteroepitaxial layers, $SiH_{4}$ / $GeH_{4}$ / $H_{2}$ gas mixtures were used. The growth conditions were varied to investigate their effects on the Si / Ge composition ratios, the interface abruptness and crystalline properties. The experimental data shows that the misfit threading dislocation in $Si_{1-x}Ge_{x}$ / Si heteroepitaxial film of about $400\;{\AA}$ thickness was not observed at the growth temperature of as low as $650^{\circ}C$, and the composition ratios of Si / Ge changed linearly with $SiH_{4}$ / $GeH_{4}$ gas mixing ratios in our experimental ranges. In the in-situ boron doping experiments, the doping abruptness would be controlled within several hundreds ${\AA}$/decade.

• Korean Journal of Materials Research
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• v.10 no.9
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• pp.601-606
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• 2000

Nickel mono-silicide(NiSi) shows no increase of resistivity as the line width decreases below 0.15$\mu\textrm{m}$. Furthermore, thin silicide can be made easily and restrain the redistribution of dopants, because NiSi in created through the reaction of one nickel atom and one silicon atom. Therefore, we investigated the deposition condition of Ni films, heat treatment condition and basic properties of NiSi films which are expected to be employed for sub-0.15$\mu\textrm{m}$ class devices. The nickel silicide film was deposited on the Si wafer by using a dc-magnetron sputter, then annealed at the temperature range of $150~1000^{\circ}C$. Surface roughness of each specimen was measured by using a SPM (scanning probe microscope). Microstructure and qualitative composition analysis were executed by a TEM-EDS(transmission electron microscope-energy dispersive x-ray spectroscope). Electrical properties of the materials at each annealing temperature were measured by a four-point probe. As the results of our study, we may conclude that; 1. SPM can be employed as a non-destructive process to monitor NiSi/NiSi$_2$ transformation. 2. For annealing temperature over $800^{\circ}C$, oxygen pressure $Po_2$ should be kept below $1.5{\times}10^{-11}torr$ to avoid oxidation of residual Ni. 3. NiSi to $NiSi_2$ transformation temperature in our study was $700^{\circ}C$ from the four-point probe measurement.

• Korean Journal of Materials Research
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• v.7 no.2
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• pp.152-156
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• 1997

In this paper, I meritioned ,I study on thc rnechanochernic;~l effec ts of grountl iljckite To investigate the mechanochemical effects of ground tlickite 1,y planet,~r\- mill. a structul-ill i~nalvsis of dickite prepared with different grinding time has been made 11y X-ray diffraction and ilifierenti,~l tl~i.~-ni;~i analysis. 'l'he $SiO_{4}$ hecira was unchanged bl- milling and remained ;is the local ordering unit s t t - ~ c ~ u ~ - c ~ s in the ground dickitc samples I ) v analyzing the radial distribution function. On the other hand, with an increi~se of the grinding time a decrease of coordination number and atomic distance bet\vccn aluminum and oxygen hi1c.r l~een octurreil, and Li~~antitativcl\. coniirrned them This result corresponded to the local c,hange around aliimi~iuni I>V tliftercntii~l t1ii:rm;il ani~lysis. Therefore, the mechanochemical phenomina of ground tiickite werc3 h e to the local c~l~mge around aluminum \IT. the prolonged grinding.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.570-570
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• 2012

그래핀(graphene)은 육각형의 탄소원자 한층으로 이루어진 이차원 구조체로써 우수한 물리적, 전기적 특성으로 인해 다양한 분야에서 응요을 위한 연구가 활발히 진행되고 있다. 특히, 그래핀과 금속 나노입자의 복합구조는 수소 저장체, 가스센서, 연료전지, 화학 촉매등의 다양한 분야에서 응용이 가능하다. 현재까지 그래핀/금속나노입자 복합구조의 제작 방법에는 열증발(thermal evaporation), 전기도금법(electrodeposition), 표면 기능화(surface functionalization)를 이용한 방법이 보고되었다. 하지만 이러한 방법은 긴 공정시간이 요구되며, 나노입자의 크기 분포가 넓다는 단점을 지닌다. 본 연구에서는 화학기상증착법을 통해 합성된 그래핀이 전사된 SiO2 (300nm)/Si 기판에 염화기가 포함된 백금 화합물 분산용액을 스핀코팅(spin-coating)하고 MeV 전자빔을 조사하여 Pt/grapheme 복합구조를 형성하였다. 이 방법은 균일한 크기 분포의 나노입자의 형성이 가능하며, 간단하고, 대면적 공정이 가능하며, 다른 방법에 비해 그래핀의 결함형성이 적다는 장점을 지닌다. Pt/grapheme 의 기하학적 구조를 주사전자현미경(scanning electron microscopy)와 투과전자현미경(transimission)을 통해 분석하였고, Pt와 graphene의 일함수(workfunction)의 차이에 의해 야기되는 전하이동에 의한 도핑(doping)현상을 라만 분광기(Raman spectroscopy)와 X-선 광전자 분광기(X-ray photoelectron spectroscopy)를 통해 분석하였다.

• Korean Journal of Plant Taxonomy
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• v.38 no.4
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• pp.565-571
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• 2008

In the course of execution for Inventories and Management of Plant Resources of Korea, We found new habitats of 4 plant species which distribution ranges are obscure and/or extremely restricted. A subtropical fern distributed in Jeju-do, Woodwardia japonica (L. f.) Sm., was found in Mt. Gambang-san of Hampyeong-gun, Jeollanam-do. A saprophytic orchid, Galeola septentrionalis Reichb., was found in Mt. Ggachi-bong of Boseong-gun, Jeollanam-do. Peristrophe japonica (Thunb.) Bremek., known in Jeollanam-do, was newly found in Mt. Mudeung-san of Gwangju-si. Viburnum furcatum Blume mainly distributed in Jeju-do and Ulleung-do was found in Mt. Jabyeong-san of Gangneung-si, Gangwon-do.

• Korean Journal of Materials Research
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• v.8 no.7
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• pp.634-640
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• 1998

A well- shaped trench was investigated in view of the defect distribution along trench sidewall and bottom using high resolution transmission electron microscopy. The trench was formed by HBr plasma and additive gases in magnetically enhanced reactive ion etching system. Adding $0_2$ and other additive gases into HBr plasma makes it possible to eliminate sidewall undercut and lower surface roughness by forming the passivation layer of lateral etching, resulted in the well filled trench with oxide and polysilicon by subsequent deposition. The passivation layer of lateral etching was mainly composed of $SiO_xF_y$ $SiO_xBr_y$ confirmed by chemical analysis. It also affects the generation and distribution of lattice defects. Most of etch induced defects were found in the edge region of the trench bottom within the depth of 10$\AA$. They are generally decreased with the thickness of residue layer and almost disappeared below the uni¬formly thick residue layer. While the formation of crystalline defects in silicon substrate mainly depends on the incident angle and energy of etch species, the region of surface defects on the thickness of residue layer formed during trench etching.

• Journal of the Korean Magnetics Society
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• v.3 no.3
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• pp.179-184
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• 1993

The X-ray diffraction pattern of amorphous $Fe_{78}Si_{9}B_{13}$ alloy was analyzed to obtain the radial distribution function (RDF) where the first peak was in the form of Gaussian function. The calculated coordination number of the form of Gaussian functiono The calculated coordination number of the sample is 13.5, the mean distance betweeon near-neighbor atoms $r_{0}$ is $2.595{\AA}$ and a Gaussian parametet ${\delta}r$ indicating near-neighbor atomic distri-bution is $0.27{\AA}$. The temperature dependence of saturated magnetization at low temperature could be explained by spin wave excitations theory yielding the spin wave stiffness constant as $117.8\;meV\;{\AA}^2$. Also, we tried to fit the observed temperature dependence of saturated magnetization with the Handrich's equation of the modified molecular field theory for the amorphous ferromagnet. Nice fittings are obtained when we used the parameters ${\Delta}=0.32$(S=1/2) and ${\Delta}=0.23$(S=1), respectively. Finally, the calculated spin wave stiffness constant using the parameters and the structural data are $149\;meV\;{\AA}^2$ for S=1/2 and $138\;meV\;{\AA}^2$ for S=1, respectively. The mean exchange coupling integral between near-neighbor atoms was estimated to be 17.9 meV for S=1/2 and 6.7 meV for S=1.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.6
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• pp.383-388
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• 2019

High purity SiC fine powder with metal impurity contents of less than 1 ppm was synthesized by improved carbothermal reduction process, and the synthesized powder was used for SiC single crystal growth in RF heating PVT device at temperature above 2,100℃. In-situ x-ray image analyzer was used to observe the sublimation of the powder and single crystal growth behavior during the growth process. SiC powder was used as a source of single crystal growth, exhausted from the outside of the graphite crucible at the growth temperature and left graphite residues. During the growth, the flow of raw materials was concentrated in the middle and influenced the growth behavior of SiC single crystals. This is due to the difference in temperature distribution inside the crucible due to the fine powder. After the single crystal growth was completed, the single crystal ingot was cut into a 1 mm thick single crystal substrate and finely polished using a diamond abrasive slurry. A dark yellow 4H-SiC was observed overall of single crystal substrate, and the polycrystals generated in the outer part may be caused by the incorporation of impurities such as the bubble layer mixed in the process of attaching the seed crystal to the seed holder.

• Korean Chemical Engineering Research
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• v.40 no.6
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• pp.752-756
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• 2002

Green-emitting $Zn_2SiO_4:Mn$ phosphors for PDP(Plasma Display Panel) application were synthesized by colloidal seed-assisted spray pyrolysis process. The codoping with $Gd^{3+}/Li^+$, which replaces $Si^{4+}$ site in the willemite structure, was performed to improve the luminous properties of the $Zn_2SiO_4:Mn$ phosphors. The particles prepared by spray pyrolysis process using fumed silica colloidal solution had a spherical shape, small particle size, narrow size distribution, and non-aggregation characteristics. The $Gd^{3+}/Li^+$ codoping amount affected the luminous characteristics of $Zn_2SiO_4:Mn$ phosphors. The codoping with proper amounts of $Gd^{3+}/Li^+$ improved both the photoluminescence efficiency and decay time of $Zn_2SiO_4:Mn$ phosphor particles. In spray pyrolysis, the post-treatment temperature is another factor controlling the luminous performance of $Zn_2SiO_4:Mn$ phosphors. The $Zn_{1.9}SiO_4:Mn_{0.1}$ phosphor particles containing 0.1 mol% $Gd^{3+}/Li^+$ co-dopant had a 5% higher PL intensity than the commercial product and 5.7 ms decay time after post-treatment at $1,145^{\circ}C$.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.12
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• pp.2899-2904
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• 2015

This paper introduces about the effect on $I_{DS}-V_{GS}$ characteristic of transistor that interface trap charge is created by damage due to heat in a 3D sequential inverter. A interface trap charge distribution in oxide layer in a 3D sequential inverter is extracted using two-dimensional device simulator. The variation of threshold voltage of top transistor according to the gate voltage variation of bottom transistor is also described in terms of Inter Layer Dielectric (ILD) length of 3D sequential inverter, considering the extracted interface trap charge distribution. The extracted interface trap density distribution shows that the bottom $HfO_2$ layer and both the bottom and top $SiO_2$ layer were relatively more affected by heat than the top $HfO_2$ layer with latest process. The threshold voltage variations of the shorter length of ILD in 3D sequential inverter under 50nm is higher than those over 50nm. The $V_{th}$ variation considering the interface trap charge distribution changes less than that excluding it.