• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.3
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• pp.317-326
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• 2016

In this study, running stability and ride quality analyses, applying the 'ISO 3888 (double lane change)' and 'ISO 2631-1' (mechanical vibration and shock) tests, were performed for the suspension optimization of the Korean personal rapid transit (PRT) vehicle. The suspension optimization results for running stability and ride quality were derived by applying the multiresponse surface method. From the comparisons of the optimization results for different ratios of the objective functions of running stability and ride quality, we derived the best objective function ratio of 3.9-to-6.1 to improve both the running stability and the ride quality. With the optimized results, the suspension stiffness became 30.68 N/mm, between the value of the $S_2$ and $S_3$ models, and the damping coefficient equaled that of the $D_1$ model. When compared with the suspension of the current PRT vehicle, the roll angle, yaw rate, sideslip angle, and ride comfort were improved by 0.37, 0.37, 2.8, and 5, respectively.

• Korean Journal of Optics and Photonics
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• v.22 no.6
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• pp.262-268
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• 2011

MIRIS(Multi-purpose Infra-Red Imaging System) is the main payload of the STSAT-3(Korea Science and Technology Satellite. 3), which is being developed by KASI(Korea Astronomy & Space Institute). EOC(Earth Observation Camera), which is one of two infrared cameras in MIRIS, is the camera for observing infrared rays from the Earth in the range of $3{\sim}5{\mu}m$. The optical system of the EOC is a Cassegrain prescription with aspheric primary and secondary mirrors, and its aperture is 100mm. A ring type flexure supports the EOC primary mirror with pre-loading in order to withstand expected load due to the shock and vibration from the launcher. Here we attempt to use the same mechanism by which a retainer supports the lens. Through opto-mechanical analysis it was confirmed that the EOC primary mirror is effectively supported.

• Smart Media Journal
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• v.11 no.5
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• pp.75-81
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• 2022

In order to respond to carbon neutrality and climate change in agriculture, agricultural machinery, which has been developed centered on internal combustion engines, needs to be converted to an electric-based technology that does not emit greenhouse gases. In this study, simulations for electric UTV suspension design were performed to reduce vibration and shock of electric UTV for agricultural use and to improve driving stability and control performance of the vehicle. The simulation was performed by dividing the tolerance load of the vehicle body and the loaded load state. The range of motion of the suspension spring of UTV is within 30% of the range of motion under condition B under tolerance, the displacement of the UTV suspension with full load is reduced from 264mm to 121mm, and the damping speed is 260mm/s to 300mm/s that it can be seen that the range of motion is within 60%. Suspension design of electric UTV for multi-purpose agricultural work is a very important factor for maintaining agricultural work ability in towing work such as tillage as well as driving and terrain adaptation. The results of this study can be usefully used to determine the spring parameters with the appropriate damping range so that the electric UTV can be used for various agricultural tasks.

• Korean Journal of Optics and Photonics
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• v.33 no.2
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• pp.74-83
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• 2022

The entire process, from the raw material to the final system qualification test, has been developed to fabricate a large-diameter, lightweight reflective-telescope system for a satellite observation. The telescope with 3 anastigmatic mirrors has an aperture of 700 mm and a total mass of 66 kg. We baked a silicon carbide substrate body from a carbon preform using a reaction sintering method, and tested the structural and chemical properties, surface conditions, and crystal structure of the body. We developed the polishing and coating methods considering the mechanical and chemical properties of the silicon carbide (SiC) body, and we utilized a chemical-vapor-deposition method to deposit a dense SiC thin film more than 170 ㎛ thick on the mirror's surface, to preserve a highly reflective surface with excellent optical performance. After we made the SiC mirrors, we measured the wave-front error for various optical fields by assembling and aligning three mirrors and support structures. We conducted major space-environment tests for the components and final assembly by temperature-cycling tests and vibration-shock tests, in accordance with the qualifications for the space and launch environment. We confirmed that the final telescope achieves all of the target performance criteria.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.