• JSTS:Journal of Semiconductor Technology and Science
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• 제1권2호
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• pp.125-131
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• 2001

When the program voltage is applied to a word line, a part of the boosted channel charge in inhibited bit lines is lost due to the coupling between the string select line (SSL) and the adjacent word line. This phenomenon causes the program disturbance in the cells connected to the inhibited bit lines. This program disturbance becomes more serious, as the word line pitch is decreased. To reduce the word line coupling, the rising edge of the word-line voltage waveform was changed from a pulse step into a ramp waveform with a controlled slope. The word-line ramping circuit was composed of a timer, a decoder, a 8 b D/A converter, a comparator, and a high voltage switch pump (HVSP). The ramping voltage was generated by using a stepping waveform. The rising time and the stepping number of the word-line voltage for programming were set to $\mutextrm{m}-$ and 8, respectively,. The ramping circuit was used in a 512Mb NAND flash memory fabricated with a $0.15-\mutextrm{m}$ CMOS technology, reducing the SSL coupling voltage from 1.4V into a value below 0.4V.

• The Journal of Korean Institute for Practical Engineering Education
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• 제1권1호
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• pp.30-37
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• 2009

The purpose of this study is the development and application of practical education program for the security of semiconductor equipments maintenance technology. For securing the semiconductor equipments maintenance technology, this study aims to research on the Training and Development. The main field of HRD is about the Training and Development. We develop the practical education program applying the ADDIE Model to conduct the education training. This developed program tests the education training on the officers of Samsung Electronics, the maker of semiconductor. By the test, we hope to provide the technology education program focusing on the practical experiences of systematic and effective companies.

• Journal of the Korea Safety Management & Science
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• 제21권2호
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• pp.25-42
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• 2019

The government announced that it would ask the contractors not only the supplier but also the contractors to take the same responsibilities if they did not observe industrial accident safety measures from 2019. The semiconductor manufacturing process belongs to the representative disaster industry group in which the facility is directly located inside a closed space called clean room. According to previous studies, the semiconductor industry group used checklists for safety management of their suppliers. This study has developed a model for assessing suppliers by constructing a quantitative checklist item through the risk assessment methodology, laws and regulations. The evaluation model of the supplier set up through this study becomes the safety management standard in the semiconductor industry. Furthermore, it is applied to the partner companies in the operation of ISO 14001, 45001, I would like to apply it as a measure of performance management for CSR (Corporate Social Responsibility).

• Journal of Practical Engineering Education
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• 제7권2호
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• pp.125-134
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• 2015

The purpose of this study is to develop semiconductor equipment maintenance technician train program for the effective train of professional maintenance technician in the semiconductor industry. To achieve the purpose, both of the actual condition survey and the literature investigation had been proceeded for the prediction of educational train manpower requirements in the field of semiconductor equipment maintenance in and outside the country. In addition, tasks and education contents were also analyzed through job analysis. Based on the result, we suggest that the education program for semiconductor equipment maintenance technician train.

• Journal of the Semiconductor & Display Technology
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• 제19권4호
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• pp.18-21
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• 2020

Undetected wafer slip during the lift pin-down motion in semiconductor equipment may affect the center to edge variation, wafer warpage, and pattern misalignment in plasma equipment. Direct measuring of the amount of wafer slip inside the plasma process chamber is not feasible because of the hardware space limitation inside the plasma chamber. In this paper, we demonstrated a practice for the wafer lift pin-up and down motions with respect to the gear ratio, operating voltage, and pulse width modulation to maintain accurate wafer position using remote control linear servo motor with an experimentally designed chamber mockup. We noticed that the pin moving velocity and gear ratio are the most influencing parameters to be control, and the step-wised position control algorithm showed the most suitable for the reduction of wafer slip.

• Proceedings of the KIEE Conference
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• 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(I)
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• pp.403-406
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• 1987

CMOS operational amplifier is most useful building bloch in analog circuit. This paper represents the analysis and design method of CMOS OP AMP to use general purpose such as the A/D and D/A converter, PCM encoder and decoder etc. The required specifications is obtained by changing W/L ration of CMOS devices. The design procedure must be iterative in as much as it is almost impossible to relate all specifications simultaneously. This is performanced with IBM-PC XT by using SPICE(SIMULATION PROGRAM WITH INTEGRATED CIRCUIT EMPHASIS)program.

• Journal of the Semiconductor & Display Technology
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• 제20권2호
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1204-1207
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• 2009

We investigated the device performance of bulk heterojunction solar cells depending on the active layer thickness. For the systematic comparison, the polymer solar cells comprising RR-P3HT:PCBM (1:0.8 (wt%:wt%)) blend films with different thickness were characterized by impedance spectroscopy, and J-V measurement in dark and solar simulated illumination. The device with 120 nm thickness of active layer exhibited maximum power conversion efficiency of 3.5 % under AM 1.5 100mW/$cm^2$ illumination condition.

• Journal of the Semiconductor & Display Technology
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• 제2권2호
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• pp.21-24
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• 2003

Seam seal welding on the semiconductor package is a process for sealing the packages of semi-conductors, crystal parts, saw filters and oscillators with lid plate by seam welding. This paper presents the development process of automatic seam seal welding system. In this process, the process algorithm, high precision welding current control, design of welding head, high speed and high precision feeding mechanism and user interface process control program technologies are included.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• 제29권3호
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• pp.278-288
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• 2019

Objectives: The objectives of this study are to summary controversy over health risks among semiconductor workers, to review major cancer risk results conducted in semiconductor operation and to evaluate occupational health activities in Korea for controlling hazardous agents generated in semiconductor operations Methods: Major occupational health issues that has been social controversies among semiconductor workers since 2007 were reviewed through an extensive literature, report and article review. Results: Since a female semiconductor worker aged 22 died from leukemia in 2007, job-association of a number of former semiconductor workers with various types of cancer and rare diseases have been denied by the Korea Workers' Compensation and Welfare Service (KWCWS), but some of them were later awarded compensation as an occupational disease by the administrative court. Two epidemiologic cancer risk studies conducted in Korea found increased risks in leukemia and non-Hodgkin's lymphoma among semiconductor workers. Various legal occupational health activities taken in semiconductor industry were found to fail to assess a complex characteristics of semiconductor operations, such as drastic changes in chemical use, processes, and technology, multiple exposure. National compensation regulation also showed the limitation to evaluate job-association of semiconductor workers who had worked in semiconductor operation. Conclusions: National legal measures should be taken to improve several occupational health activities and duties for protecting workers. In addition, the KWCWS program should be revised so that all workers who meet minimal job or environment associations can be compensated.