Development of Seam Seal Welding System for Semiconductor Package

반도체 Package용 Seam Seal Welding System 개발

  • 이우영 (한국기술교육대 기계공학부) ;
  • 진경복 (한국기술교육대 제어시스템공학과) ;
  • 오장환 (한국기술교육대 전자공학과 대학원) ;
  • 김경수 ((주)창조엔지니어링)
  • Published : 2003.06.01

Abstract

Seam seal welding on the semiconductor package is a process for sealing the packages of semi-conductors, crystal parts, saw filters and oscillators with lid plate by seam welding. This paper presents the development process of automatic seam seal welding system. In this process, the process algorithm, high precision welding current control, design of welding head, high speed and high precision feeding mechanism and user interface process control program technologies are included.

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