• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.29 no.4
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• pp.272-278
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• 1993

The trimethylamine-sensing characteristics of ZnO based thin film semiconductors and the sensitivity enhancement by squttering conditions have been investigated to develop a new type sensor for detecting fish freshness. The sensor fabricated with a 300nm of ZnO thin film with 4 wt% Al sub(2) O sub(3) and 1 wt% TiO sub(2) exhibited the highest sensitivity of 155 at 30$0^{\circ}C$ of working temperature and to the 240 ppm TMA gas. Deposition of ZnO thin film using a RF magnetron sputter was carried out at a pressure of 10 super(-2) Torr in pure oxygen gas with an RF power of 100W. The sensor exhibited a large response to the actual gases produced by a mackerel at an early stage of decomposition.

• Journal of Sensor Science and Technology
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• v.31 no.6
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• pp.361-365
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• 2022

Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.

• Journal of Sensor Science and Technology
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• v.4 no.2
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• pp.7-13
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• 1995

A new FET type semiconductor pressure sensor (PSFET : pressure sensitive field effect transistor) was fabricated and its operational characteristics were investigated. A ZnO thin film as a piezoelectric layer, $5000{\AA}$ thick, was deposited on a gate oxide of FET by RF magnetron sputtering. The deposition conditions to obtain a c-axis poling structure were substrate temperature of $300^{\circ}C$, RF power of 140watt, and working pressure of 5mtorr in Ar ambience. The fabricated PSFET device showed good linearity and stability in the applied pressure range($1{\times}10^{5}\;Pa{\sim}4{\times}10^{5}\;Pa$).

• Journal of Sensor Science and Technology
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• v.23 no.2
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• pp.94-98
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• 2014

Aluminum nitride (AlN) thin films with a TiN buffer layer have been fabricated on SUS430 substrate by RF reactive magnetron sputtering at room temperature under 25~75% $N_2$ /Ar. The characterization of film properties were performed using surface profiler, X-ray diffraction, X-ray photoelectron spectroscopy(XPS), and pressure-voltage measurement system. The deposition rates of AlN films were decreased with increasing the $N_2$ concentration owing to lower mass of nitrogen ions than Ar. The as-deposited AlN films showed crystalline phase, and with increasing the $N_2$ concentration, the peak of AlN(100) plane and the crystallinity became weak. Any change in the preferential orientation of the as-deposited AlN films was not observed within our $N_2$ concentration range. But in the case of 50% $N_2$ /Ar condition, the peak of (002) plane, which is determinant in pressure sensing properties, appeared. XPS depth profiling of AlN/TiN/SUS430 revealed Al/N ratio was close to stoichiometric value (45:47) when deposited under 50% $N_2/Ar$ atmosphere at room temperature. The output signal voltage of AlN sensor showed a linear behavior between 26~85 mV, and the pressure-sensing sensitivity was calculated as 7 mV/MPa.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.21 no.2
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• pp.20-27
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• 2007

[ $SF_6$ ] gas for compacted power facilities has a important role as an insulation gas. It is very blown well that $SF_6$ gas has the superior characteristics as an insulation gas. For reliable operation of SF6-gas-based high and medium voltage equipment it is very important to keep the insulation ability within a safe range. And the experimental and measuring system were implemented. The test chamber designed to endure up to 3 atmospheric pressure. The analysis results of the experimental data shows that positive partial discharge can be detected by discharge current and UHF signal. Additionally it is shown the possibility that $CO_2$ gas sensor of semiconductor type can be detect the variation of $SF_6$ gas condition. The UHF sensor shows good feature to detect the variation of $SF_6$ gas condition for partial discharge and breakdown discharge.

• Journal of Electrical Engineering and information Science
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• v.3 no.2
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• pp.239-244
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• 1998

Piezoelectric pressure sensors and pyroelectric infrared detectors based on ZnO thin film have been integrated with GaAs metal-semiconductor field effect transistor (MESFET) amplifiers. Surface micromachining techniques have been applied in a GaAs MESFET process to form both microsensors and electronic circuits. The on-chip integration of microsensors such as pressure sensors and infrared detectors with GaAs integrated circuits is attractive because of the higher operating temperature up to 200 oC for GaAs devices compared to 125 oC for silicon devices and radiation hardness for infrared imaging applications. The microsensors incorporate a 1${\mu}$m-thick sputtered ZnO capacitor supported by a 2${\mu}$m-thick aluminum membrane formed on a semi-insulating GaAs substrate. The piezoelectric pressure sensor of an area 80${\times}$80 ${\mu}$m2 designed for use as a miniature microphone exhibits 2.99${\mu}$V/${\mu}$ bar sensitivity at 400Hz. The voltage responsivity and the detectivity of a single infrared detector of an area 80${\times}$80 $\mu\textrm{m}$2 is 700 V/W and 6${\times}$108cm$.$ Hz/W at 10Hz respectively, and the time constant of the sensor with the amplifying circuit is 53 ms. Circuits using 4${\mu}$m-gate GaAs MESFETs are fabricated in planar, direct ion-implanted process. The measured transconductance of a 4${\mu}$m-gate GaAs MESFET is 25.6 mS/mm and 12.4 mS/mm at 27 oC and 200oC, respectively. A differential amplifier whose voltage gain in 33.7 dB using 4${\mu}$m gate GaAs MESFETs is fabricated for high selectivity to the physical variable being sensed.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.352-356
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• 2018

This paper relates to a technology for monitoring a liquefied gas storage tank in the special gas field where demand is increasing owing to the continuous growth of related fields such as the semiconductor, display, and ICT convergence electronics industries. We have proposed a system for real - time monitoring using wireless sensor network technology, and implemented a system consisting of a sensor unit, transmitter module, and receiver module to be attached to a liquefied gas storage tank. The system was applied to LCO2 tanks among various liquefied gas storage tanks to verify the feasibility. The storage tanks employed in the experiments has capacities of 16,179 l and was 1,920 mm in inner diameter. Furthermore, the density was 1.03 g/l. The measured data were compared with reference data on the remaining gas level versus the $CO_2$ height of the surface, expressed using a conventional water meter, provided by an existing storage tank supplier. The experimental results show that the data is similar to the standard data provided by the tank supplier, and has a high accuracy and reliability within an error range of 0.03%.

• Transactions of the Korean hydrogen and new energy society
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• v.3 no.2
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• pp.17-24
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• 1992

Hydrogen gas sensors were fabricated after the form of metal/insulator/semiconductor(MIS) structure on a p-type silicon wafer and a insulating layer (silicon dioxide) thickness was changed from $500{\AA}$ to $5000{\AA}$. Their electrical properties were investigated with the variation of the hydrogen gas concentration at room temperature. At the applied forward bias of lV to both ends of Pd-MIS sensors the current was decreased logarithmically with the increase of hydrogen concentration in air. In the case of a thin $SiO_2$ layered ($500{\AA}$) sensor the current ratio was decreased to 25 % at 1 % of hydrogen concentration in air and 50% for a thick $SiO_2$ layered ($5000{\AA}$) sensor. And the response time of the thick insulating layered sensor to 1% hydrogen containing air was about 50 seconds and regeneration time was 2.5 minutes. When a 0.5mA current was appied to the thick insulating layered sensor the maximun voltage shift was calculated to 0.8V in the case of ${\theta}$ = 1 and the Pd surface coverage of hydrogen was increased logarithmically with hydrogen partial pressure.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.11 no.2
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• pp.1005-1018
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• 2017

This paper proposes an App Visualization (AppV) based on IoT Self-diagnosis Micro Control Unit (ISMCU) for accident prevention. It collects a current status of a vehicle through a sensor, visualizes it on a smart phone and prevents vehicles from accident. The AppV consists of 5 components. First, a Sensor Layer (SL) judges noxious gas from a current vehicle and a driver's driving habit by collecting data from various sensors such as an Accelerator Position Sensor, an O2 sensor, an Oil Pressure Sensor, etc. and computing the concentration of the CO collected by a semiconductor gas sensor. Second, a Wireless Sensor Communication Layer (WSCL) supports Zigbee, Wi-Fi, and Bluetooth protocol so that it may transfer the sensor data collected in the SL to ISMCU and the data in the ISMCU to a Mobile. Third, an ISMCU integrates the transferred sensor information and transfers the integrated result to a Mobile. Fourth, a Mobile App Block Programming Tool (MABPT) is an independent App generation tool that changes to visual data just the vehicle information which drivers want from a smart phone. Fifth, an Embedded Module (EM) records the data collected through a Smart Phone real time in a Cloud Server. Therefore, because the AppV checks a vehicle' fault and bad driving habits that are not known from sensors and performs self-diagnosis through a mobile, it can reduce time and cost spending on accidents caused by a vehicle's fault and noxious gas emitted to the outside.

• Electrical & Electronic Materials
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• v.8 no.1
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• pp.102-113
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• 1995

일반적으로 단결정 실리콘은 거의 모든 전자소자의 재료로서 널리 사용되고 있으며 제조공정기술 또한 상당한 수준에 도달하고 있다. 최근에는 실리콘 자체의 우수한 압저항효과, 기계적 특성 그리고 반도체 제조공정을 이용한 미세가공기술인 마이크로머시닝을 이용하는 반도체 압력센서에 대한 연구가 활발히 진행되고 있다. 기계식 압력센서에 비해서 전기적 변화를 이용하는 반도체 압력센서에서는 소형, 저가격, 고신뢰성, 고감도, 다기능, 고분해, 고성능 및 집적화 등의 우수한 특성을 지니고 있다. 본고에서는 이러한 특성을 가지는 반도체 압력센서중 특히, 압저항형과 용량형 압력센서의 구조와 원리, 그리고 연구.개발동향 및 향후 전망에 관해서 기술하였다.