• Journal of the Semiconductor & Display Technology
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• v.18 no.3
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• pp.144-149
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• 2019

This paper describes the results of a study on the unmanned maintenance robot that simultaneously performs the cleaning and inspection of the photovoltaic panels. The robot has a special adsorptive device, an infrared sensor, a vacuum level sensor and a camera. The robot uses two SSC (Sliding Suction Cup) adsorptive devices to move up and down the slope. First, the forces generated when the robot moves up the slope are mechanically analyzed, and the required design and control of the adsorption system are suggested. The robot was designed and manufactured to operate stably by using the presented results. Next, the normal force between the panel and the wheel was measured to confirm that the robot was manufactured and operated as intended, and the robot motion was tested on the inclined panel. It has been proven that robots are well designed and built to clean and inspect sloped panels.

• Journal of the Semiconductor & Display Technology
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• v.13 no.1
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• pp.51-55
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• 2014

In this paper, an hybrid automatic focusing method has been proposed for speedy and reliable measurement and inspection in industry. It can improve reliability of focusing position by using not a focusing measure but the hybrid one that is incorporated with sobel operator and auto-correlation. Also, it can not only reduce control time of focusing position using adaptive step size, but also improve accuracy of focusing position by gaussian interpolation. Its performance is verified by experiments. It is expected that it can apply to optical system for measurement and inspection in industry fields.

• Journal of the Semiconductor & Display Technology
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• v.12 no.2
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• pp.57-61
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• 2013

This paper presents adaptive neuro-fuzzy inference based defect detection method for various defect types, such as micro-crack, fingerprint and contamination, in heterogeneously textured surface of polycrystalline solar wafers. Polycrystalline solar wafer consists of various crystals so the surface of solar wafer shows heterogeneously textures. Because of this property the visual inspection of defects is very difficult. In the proposed method, we use local binary feature and fuzzy reasoning for defect detection. Experimental results show that our proposed method achieves a detection rate of 80%~100%, a missing rate of 0%~20% and an over detection (overkill) rate of 9%~21%.

• Journal of the Semiconductor & Display Technology
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• v.17 no.2
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• pp.26-31
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• 2018

In this paper, surface defects and typical illumination mechanisms for steel plates are analyzed, and then optimum illumination mechanism is selected using discrete wavelet transform (DWT) synthetic images and discriminant measure (DM). The DWT synthetic images are generated using component images decomposed by Haar wavelet transform filter. The best synthetic image according to surface defects is determined using signal to noise ratio (SNR). The optimum illumination mechanism is selected by applying discriminant measure (DM) to the best synthetic images. The DM is applied using the tenengrad-euclidian function. The DM is evaluated as the degree of contrast using the defect boundary information. The performance of the optimum illumination mechanism is verified by quantitative data and intuitive image looks.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.14-18
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• 2021

Electric Vehicle industry requires high technologies to stabilize apparatuses for the Coolant heater manufacturing. Vibrations of Leak Machine are one of the most critical factors for causing delivered of the defective product or poor inspection, which are the main reasons of the defects. In this study, the structure of the Leak Machine was analyzed through the experiment and the computer simulation to investigate the main reasons of the vibrations, and further to alter the design for the improved stability. And that design alterations were applied to the machine to identify the effects of those alterations. The result of the study shows that design alterations of the Leak Machine can effectively suppress about 97.8% of the vibrations, and further can improving the Inspection precision of the Coolant heater.

• The Transactions of the Korea Information Processing Society
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• v.5 no.10
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• pp.2737-2749
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• 1998

Recently, vision system is widely used in factory automation processes. In this paper, the method which detects the badness in the position, slop, and the lead of chips is proposed for the inspection of semiconductor chips. The conventional methods mainly inspect semiconductor IC with the features which is extracted in image. But we propose the method which segments the lead part by the morphology and inspects the lead faults by the invariant moment. In the simulation. the results of the proposed method is better than those of the conventional method for the noisy and noiseless images .

• International Journal of Quality Innovation
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• v.6 no.1
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• pp.58-73
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• 2005

The objective of this study is to evaluate the equipment risk before and after SEMI S2-93A implementation, thus providing a guideline for safety improvement. Semiconductor Plant A located in Taiwan's Hsinchu Science Based Industrial Park with 147 manufacturing machines was used for risk assessment. This study was carried out in three steps. First, a preliminary hazard analysis was conducted. A detailed process safety evaluation was conducted (Hazard and Operability Study, HAZOP); and finally, the equipment risk comparison before and after Semiconductor Equipment Manufacturing Instruction (SEMI S2-93A) implementation. The preliminary hazard analysis results showed high risk in 21.77% of the manufacturing machines under risk assessment at Plant A. The largest percentage existed in the Diffusion Department. The machine types specified by the hazardous work site review and inspection according to Article 26 of Labor Inspection Regulation (the machines that use such chemicals as, $SiH_4$, HF, HCL, etc. and that are determined to be highly hazardous through preliminary hazard analysis) were added to the detailed process analysis and evaluation. In the third part of this evaluation, the machines at Plant A used for detailed process safety assessment were divided into two groups based on the manufacturing data before and after 1993. The severity, possibility, and actual accident analysis before and after SEMI S2-93A implementation were compared. The Semiconductor Equipment Manufacturing Instruction (SEMI S2-93A) implementation can reduce the severity and possibility of hazard occurrence.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.63-64
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• 2007

• Journal of Radiation Protection and Research
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• v.40 no.2
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• pp.110-117
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• 2015

Recently, Due to the increased industry using radiation inspection equipment in the semiconductor, this demand of technology research is increasing. Although semiconductor inspection equipment is using low energy X-ray from 40 keV to 120 keV, Studies of radiation damage about the low energy X-ray are lacking circumstance in our country. Therefore, It is study that BJT (bipolar junction transistor) of one type of semiconductor elements are received radiation damage by low energy X-ray. BJT were used to the NXP semiconductor company's BC817-25 (NPN type), and Used the X-ray generator for the irradiation. Radiation damage of BJT was evaluated that confirm to analyse change of collector-emitter voltage of before and after X-ray irradiation when current gain fixed to 10. X-ray generator of tube voltage was setting 40 kVp, 60 kVp, 80 kVp, 100 kVp, 120 kVp and irradiation time was setting 180s, 360s, 540s into 180s intervals. As the result, We confirmed radiation damage in BJT by low energy X-ray under 120 keV energy, and Especially the biggest radiation damage was appeared at the 80 kVp. It is expected that ELDRS (enhanced low dose rate sensitivity) phenomenon occurs on the basis of 80 kVp. This studies expect to contribute effective dose administration of semiconductor inspection equipment using low energy X-ray, Also Research and Development of X-ray filter.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.05a
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• pp.136-139
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• 2011

The conventional semiconductor equipment has adopted SRAM module as the test pattern memory, which has a simple design and does not require refreshing. However, SRAM has its disadvantages as it takes up more space as its capacity becomes larger, making it difficult to meet the requirements of large memories and compact size. if DRAM is adopted as the semiconductor inspection equipment, it takes up less space and costs less than SRAM. However, DRAM is also disadvantageous because it requires the memory cell refresh, which is not suitable for the semiconductor examination equipments that require correct timing. Therefore, In this paper, we will proposed an algorithm for punctuality guarantee of memory-free inspection equipment using DDR2 SDRAM. And we will produced memory controller using punctuality guarantee algorithm.