• Journal of Digital Convergence
• /
• v.15 no.7
• /
• pp.223-229
• /
• 2017

Europe, the US and Japan have acquired test results on impact coefficient for a long time and applied it to equipment design to secure safety of structures. However, Korean enterprises use the impact factor held by advanced business to design equipment as it is difficult for them to obtain it through tests. In this paper, NX/NASTRAN, was used to perform static load analysis and impact load analysis of a PCB Handler, semiconductor test equipment, and the result was employed to study how to calculate the impact coefficient with the finite element analysis. The calculation method was applied to the JIS(Japanese Industrial Standard), and the impact coefficient of the PCB handler was calculated as 1.27 for the sudden start or stop. The impact coefficient generated by the analysis is expected to make a great contribution to the industry as it can be used to improve the equipment structure and develop on existing equipment in the future.

• Korean Journal of Cognitive Science
• /
• v.9 no.1
• /
• pp.31-39
• /
• 1998

This paper describes an electronic performance support system called HELPS(Handler Electronic Learning Performence Support) for semiconductor testing e equipment. The purpose of this system is to improve productivity of operators by providing just-in-time, on-the-job, mutimedia-based system information for operational support, training, and knowledge-based trouble shooting and repair. HELPS is composed of a operation module and a trouble shooting module. The operation module uses multimedia and hypermedia to provide the detailed and easily accessible information about equipment to users. Multimedia incorporate multiple. media forms including still and video images. animations 'texts' graphics. and audio. Hypermedia a are provided through a hierarchical information structure which offers not only specific information which is needed to perform a task to experienced operators. but detailed system guidance and information to novice operators. The trouble shooting module is composed of an integrated mutimedia-supported expert system which assists operators in trouble shooting and equipment repair. After diagnosis through the use of the expert system. multimedia advice is presented to the user in either still images with text or motion sequences with sound HELPS is evaluated in term of training time and trouble shooting and repair time. It improved productivity by saving more than 30% of the total time used without the system. This s system has the potential to improve productivity when it is used with ICAIOntellignet Computer Aided Instruction) and virtual reality.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.239-240
• /
• 2012

With advancements in semiconductor device technologies, manufacturing processes are getting more complex and it became more difficult to maintain tighter process control. As the number of processing step increased for fabricating complex chip structure, potential fault inducing factors are prevail and their allowable margins are continuously reduced. Therefore, one of the key to success in semiconductor manufacturing is highly accurate and fast fault detection and classification at each stage to reduce any undesired variation and identify the cause of the fault. Sensors in the equipment are used to monitor the state of the process. The idea is that whenever there is a fault in the process, it appears as some variation in the output from any of the sensors monitoring the process. These sensors may refer to information about pressure, RF power or gas flow and etc. in the equipment. By relating the data from these sensors to the process condition, any abnormality in the process can be identified, but it still holds some degree of certainty. Our hypothesis in this research is to capture the features of equipment condition data from healthy process library. We can use the health data as a reference for upcoming processes and this is made possible by mathematically modeling of the acquired data. In this work we demonstrate the use of recurrent neural network (RNN) has been used. RNN is a dynamic neural network that makes the output as a function of previous inputs. In our case we have etch equipment tool set data, consisting of 22 parameters and 9 runs. This data was first synchronized using the Dynamic Time Warping (DTW) algorithm. The synchronized data from the sensors in the form of time series is then provided to RNN which trains and restructures itself according to the input and then predicts a value, one step ahead in time, which depends on the past values of data. Eight runs of process data were used to train the network, while in order to check the performance of the network, one run was used as a test input. Next, a mean squared error based probability generating function was used to assign probability of fault in each parameter by comparing the predicted and actual values of the data. In the future we will make use of the Bayesian Networks to classify the detected faults. Bayesian Networks use directed acyclic graphs that relate different parameters through their conditional dependencies in order to find inference among them. The relationships between parameters from the data will be used to generate the structure of Bayesian Network and then posterior probability of different faults will be calculated using inference algorithms.

• Korean Chemical Engineering Research
• /
• v.48 no.3
• /
• pp.401-404
• /
• 2010

A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study. In cleaning of electronic and semiconductor equipment, a substrate(IPC-A-36) was used to test the jet forces of the agent. And according to the jet forces time of the cleaning agent, the corresponding moving distances were compared with the spray times, and for the pollutants of iron powder and dust, the cleaning efficiency was tested with the IPC-A-36 by a weight method. The moving distance increased with the spray cleaning time longer. For a spray cleaning time of 3sec, the cleaning efficiency decreased with the amount of dust and the iron powder. It was also observed that the dust was remarkably removed, compared to the iron powder.

• Korean Journal of Materials Research
• /
• v.34 no.6
• /
• pp.303-308
• /
• 2024

The semiconductor and display industries require the development of plasma resistant materials for use in high density plasma etching process equipment. Yttria (Y₂O₃) is a ceramic material mainly used to ensure good plasma resistance properties, which requires a dense microstructure. In commercial production, a sintering process is applied to reduce the sintering temperature of Y₂O₃. In this study, the effect of the addition of glass frit to the sintered specimen was examined when manufacturing yttria sintered specimens for semiconductor process equipment parts. The Y₂O₃ specimen was shaped into a Ø50 mm size and then sintered at 1,600 ℃ for 1~8 h. The characteristics, X-ray diffraction pattern, densities, contraction rate of the specimen, and swelling of the surface of the Y₂O₃ specimens were investigated as a function of the sintering time and glass frit addition. The Y₂O₃ specimen exhibited a density of over 4.9 g/cm³ as the sintering time increased, and the swelling phenomenon characteristics were improved by glass frit, by controlling particle size.

• Journal of the Korea Convergence Society
• /
• v.9 no.10
• /
• pp.257-263
• /
• 2018

The purpose of this study is to develop an automatic inspection system for a part of the differential drive gear into the transmission. This technology will make using the microvision automatic test equipment and automatic test equipment microlaser. This is that the operator intends to make the defect rate 0 in the inspection stage of the product which has been carelessly processed. The equipment developed in this research project will be applied to many areas. Packaging companies, nut bolt processing company, precisely supplier for printing on top of the semiconductor, SMT, etc. The company wants to sell the vision inspection equipment for various applications. If the defective rate of 0 is achieved through this research project, it is also possible to secure a stable supply from the parent company, and to lay the foundations for exporting based on product reliability. When the automatic inspection system is applied to domestic automobile parts processing companies, the reliability of automobiles in Korea will be greatly increased.

• Journal of Practical Engineering Education
• /
• v.6 no.1
• /
• pp.37-42
• /
• 2014

The automated visual inspection system (machine vision system) for quality assurance is important factory automation equipment in the manufacturing industries, such as display, semiconductor, etc. There is a lot of demand for the machine vision engineers. However, there are no technical training courses for machine vision technologies in vocational schools, colleges and universities. In this paper, we present the implementation of line scan camera based equipment for technical training of the automated visual inspection system. The training system consists of the X-Y stage which is widely used in machine vision industries and its variable image resolution are set to $10-30{\mu}m$. Additionally, this training system can attach the industrial illumination, either the direct illuminator or coaxial illuminator, for verifying the effect of illuminations. This means that the trainee can have a practical training in various equipment conditions and the training system is similar to the automated visual inspection system in industries.

• Journal of Power Electronics
• /
• v.16 no.2
• /
• pp.685-694
• /
• 2016

This paper presents a reliability assessment model for the power semiconductors used in wind turbine power converters. In this study, the thermal loadings at different timescales of wind speed are considered. First, in order to address the influence of long-term thermal cycling caused by variations in wind speed, the power converter operation state is partitioned into different phases in terms of average wind speed and wind turbulence. Therefore, the contributions can be considered separately. Then, in regards to the reliability assessment caused by short-term thermal cycling, the wind profile is converted to a wind speed distribution, and the contribution of different wind speeds to the final failure rate is accumulated. Finally, the reliability of an actual power converter semiconductor for a 2.5 MW wind turbine is assessed, and the failure rates induced by different timescale thermal behavior patterns are compared. The effects of various parameters such as cut-in, rated, cut-out wind speed on the failure rate of power devices are also analyzed based on the proposed model.

• Journal of the Institute of Electronics Engineers of Korea SC
• /
• v.49 no.1
• /
• pp.80-87
• /
• 2012

We have developed the ATE(Automatic Test Equipment) system for the performance test of pre-amplifier of thermal imaging devices. The device regenerates the electronic signals of photon detection module which is normally in weak energy, for the image signals processing. Previous ATE system was primarily and actively developed in the field of semiconductor devices quality parts inspection. Recently, it has been studied in the field of performance testing of equipment. In the field of thermal performance test equipment, however, it lacks the study of ATE compared to other areas, which causes the maintenance related to the core of military thermal imaging system maintenance to be limited. In this paper, a new study of ATE in the field of thermal imaging system is done. It is designed to be used universally for the ATE system with different types of circuit card of thermal imaging system by adopting matrix relays. Using the developed ATE measuring the pre-amplifier amplitude, an average amplified amplitude of 2.71Vpp was measured which confirms that it is within the range of theoretical analysis and also verifies the good performance of the developed ATE.

• The Journal of the Convergence on Culture Technology
• /
• v.9 no.6
• /
• pp.927-933
• /
• 2023

In modern times, with advances in semiconductor technology such as electronic devices, the need to improve the quality of onboard equipment with advanced electronic parts in automobiles, drones, airplanes, projectiles, and various fields, and reduce the impact of various disturbances on onboard equipment is becoming more important. Vibration control through hardware must be determined to prevent damage and improve quality to equipment operating in various environments such as automobiles, drones, airplanes, and projectiles. This study focuses on the study of vibration damping systems to protect mounted equipment from various disturbances and improve stability. Dynamic characteristics analysis, including compressive stiffness, damping rate, and frequency response, and vibration characteristics in the frequency domain of rubber dampers were identified through FEM analysis to identify the characteristics of rubber dampers. Through these findings, we would like to present the criteria for selecting a suitable rubber damper under various disturbance conditions.