• 전자공학회논문지 IE
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• v.43 no.4
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• pp.83-92
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• 2006

EMC(epoxy moulding compound) when operate with residual quantity processing after fixed quantity moulding inverse close way of designing by mechanical action inhalation so that may occur, solved of needle tip residual quantity and cause of thread extend phenomenon. In this paper, design to connect directly gun, washer tank and measuring beforehand amount that washing is easy and want minuteness fixed quantity that essential equipment in semi-conductor packaging process because develop EMC so that can molding with high speed consider.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.34-39
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• 2003

Seam seal welding on the semi-conductor package is a process for sealing the packages of semiconductors, crystal parts, saw filters, oscillators with lid plate by seam welding. This paper present the development process of automatic seam seal welding system. In this process, the process algorithm, high precision welding current control, design of welding head, high speed and high precision feeding mechanism, user interface process control program technologies are included.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.12
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• pp.184-197
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• 1995

In this paper, high speed IC package-to-package interconnections are modeled as lossless multiconductor transmission lines operating in the TEM mode. And, three mathematical algorithms for computing electrical parameters of the lossless multiconductor transmission lines are described. A semi-analytic Green's function method is used in computing per unit length capacitance and inductance matrices, a matrix square root algorithm based on the QR algorithm is used in computing a characteristic impedance matrix, and a matrix algorithm based on the theory of M-matrix is used in computing a diagonally matched load impedance matrix. These algorithms are implemented in a computer program DIME (DIagonally Matched Load Impedance Extractor) which computes electrical parameters of the lossless multiconductor transmission lines. Also, to illustrate the concept of design database for high speed IC package-to-package interconnection, a database for the multi conductor strip transmission lines system is constructed. This database is constructed with a sufficiently small number of nodes using the multi-dimensional cubic spline interpolation algorithm. The maximum interpolation error for diagonally matched load impedance matrix extraction from the database is 1.3 %.

• Journal of the Korean Institute of Telematics and Electronics
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• v.20 no.2
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• pp.7-15
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• 1983

In recent years, the logic circuits of high function have been developed to VLSI by the radical advancement of semi-conductor technologies. Under the above influence, it has become possible to design the special VLSI chips for high speed of numerical value processing, wide-band, image processing, etc. And, the development of the VLSI from various kinds of software package has become quite possible. This paper is to propose the technical skill of hardware design about general software package (BMD). The decrease of speed of former statistics processing caused by depending on software only is improved by hardware. In regard of design algorithm, the main system will be able to be established by considering of special feature of statistics. As a result, the complexity of software package is excluded by hardware. And, the efficiency is improved by high speed processing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.123-127
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• 1997

Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circles and medical world, An Ultrasonic wave transmitted from a focused beam transducer is being expected as a powerful tool for NDE of micro-defect. The ultrasonic NDE of the defect is based on the form of the wave reflected form the interface In this study, regarding to the thickness of film which is in opaque object and thickness measurement was done by MEM-cepstrum analysis of received ultrasonic wave. In measument results, film thickness which is beyond distance resolution capacity was measured accurately. Also, automatically repeated discrimination analysis method can be decided in the category of all kinds of defects on semiconductor package.