• 제목/요약/키워드: Screen Printing Method

검색결과 383건 처리시간 0.029초

Electrode formation using Light induced electroless plating in the crystalline silicon solar cells

  • 정명상;강민구;이정인;김동환;송희은
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.347.1-347.1
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    • 2016
  • Screen printing is commonly used to form the electrode for crystalline silicon solar cells. However, it has caused high resistance and low aspect ratio, resulting in decrease of conversion efficiency. Accordingly, Ni/Cu/Ag plating method could be applied for crystalline silicon solar cells to reduce contact resistance. For Ni/Cu/Ag plating, laser ablation process is required to remove anti-reflection layers prior to the plating process, but laser ablation results in surface damage and then decrease of open-circuit voltage and cell efficiency. Another issue with plating process is ghost plating. Ghost plating occurred in the non-metallized region, resulting from pin-hole in anti-reflection layer. In this paper, we investigated the effect of Ni/Cu/Ag plating on the electrical properties, compared to screen printing method. In addition, phosphoric acid layer was spin-coated prior to laser ablation to minimize emitter damage by the laser. Phosphorous elements in phosphoric acid generated selective emitter throughout emitter layer during laser process. Then, KOH treatment was applied to remove surface damage by laser. At this step, amorphous silicon formed by laser ablation was recrystallized during firing process and remaining of amorphous silicon was removed by KOH treatment. As a result, electrical properties as Jsc, FF and efficiency were improved, but Voc was lower than screen printed solar cells because Voc was decreased due to surface damage by laser process. Accordingly, we expect that efficiency of solar cells could be improved by optimization of the process to remove surface damage.

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고온 소결형 실리콘 태양 전지의 High Aspect Ratio 전극 형성이 가능한 Ag 페이스트의 레오로지 특성 연구 (A Study on Rheology Characteristics of Ag Paste for Screen Printing Method for Silicon Solar Cells Electrodes Capable of Forming High Aspect Ratio)

  • 오태현;김성빈;남수용
    • 한국인쇄학회지
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    • 제28권1호
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    • pp.15-24
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    • 2010
  • Photovoltaic solar cells are all in the incident because they are not converted into electrical energy, high-efficiency solar cells in order to reduce the loss of elements must be. Significant factor in the loss of solar cells, optical loss and electrical loss can be divided into. Optical losses occur when the sun will be joined on the surface of the reflection, the shadow loss due to electrodes, and the losses are in the solar wavelengths. Commercialization is currently the most common solar cells on the front of the light incident on the electrode is formed. Therefore, the shadow caused by the electrode to cover the dead area of the sun, due to factors that hinder the absorption of sunlight which is shadowing them and conversion efficiency of solar cells is the inhibition factor. These barriers to eliminate the electrode linewidth reduces the shadowing to reduce, but simply of the electrode line width is reduced electrode area by reducing the series resistance elevates this because to improve the electrode Aspect ratio(height/width) to increase Ag development of paste is required. In this study, aspect ratio of screen-printing method to increase the electrode Ag paste composition of the binder for the characterization of rheology in the shadow of the electrode by reducing the optical loss of the photoelectric conversion efficiency of solar cells to boost the performance measures was. Properties and printability of the paste, the binder resin sintered characteristics that affect the thermal properties are excellent with a good screen printability acrylic resin, ethyl cellulose, using a resin were evaluated. Prepared paste rheology properties, was formed to evaluate the electrode conductivity and aspect ratio.

Low Temperature Debinding Process Using Oxygen Plasma for Flexible Printed Electronics

  • Lee, Young-In
    • 한국분말재료학회지
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    • 제19권5호
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    • pp.343-347
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    • 2012
  • In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.

소결온도에 따른 BSCT 후막의 구조적 특성 (Structural Properties of BSCT Thick Films with variation of Sintering Temperature)

  • 박상만;이성갑;윤상은;이영희
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.212-213
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    • 2006
  • BSCT(60/30/10) powder specimens were fabricated by sol-gel method and BSCT thick films were fabricated by screen-printing method. The coating and drying procedure was repeated 6 times. Then the structural properties as a function of the sintering temperature. As a result of the TG-DTA, exothermic peak was observed at around $670^{\circ}C$ due to the crystalline phase. The BSCT sintered at $1430^{\circ}C$ showed the cubic perovskite structure. The prosity and thickness of the BSCT thick films was decreased with sintering temperature. The thickness of BSCT thick films at $1420^{\circ}C$ was approximately $40{\mu}m$.

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Microwave Dielectric Properties of BSCT Thick Films with Addition of $Nb_2O_5$

  • Kang, Jeong-Min;Cho, Hyun-Moo;Lee, Sung-Gap;Park, Sang-Man;Lee, Young-Hie
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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    • pp.632-635
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    • 2003
  • [ $(Ba,Sr,Ca)TiO_3$ ] powders, prepared by the sol-gel method, were mixed with organic vehicle and the BSCT thick films were fabricated by the screen printing techniques on alumina substrates. The dielectric properties were investigated for various composition ratio and $Nb_2O_5$ doping contents. All the BSCT thick films, sintered at $1420^{\circ}C$, showed the typical XRD patterns of a perovskite polycrystalline structure. The Curie temperature and the relative dielectric constant decreased with increasing Ca content and $Nb_2O_5$ doping amount. The relative dielectric constant, dielectric loss and tunability of the BSCT(50/40/10) thick films doped with 1.0wt% $Nb_2O_5$ were 1410, 0.65% and 17.29% respectively.

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Cell Fabrication and Performances of SOFC prepared by DBM and SPM

  • Kim, Gwi-Yeol
    • Transactions on Electrical and Electronic Materials
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    • 제8권6호
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    • pp.286-288
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    • 2007
  • The research and development for the solid oxide fuel cell have been promoted rapidly and extensively in recent years, because of their high efficiency and future potential. Therefore this paper describes the manufacturing method and characteristics of anode electrode for solid oxide fuel cell, by the way, Ni-YSZ materials are used as anode of solid oxide fuel cell widely. In order to reduce production costs, we have fabricated single solid oxide fuel cell by doctor blade and screen printing method. Disk-type planar solid oxide fuel cell with an effective electrode area of about $7cm^2$ were fabricated and run for 500 h to investigate cell performance. The current density at a voltage of 0.7 V was $850mA/cm^2$.

코팅횟수에 따른 PZT세라믹의 구조적 특성 (The Structural properties of PZT ceramic with preparation coating timing)

  • 강정민;조현무;이성갑;배선기
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2004년도 추계학술대회 논문집 전기물성,응용부문
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    • pp.64-66
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    • 2004
  • $Pb(Zr_{0.3},Ti_{0.7})O_3$, $Pb(Zr_{0.3},Ti_{0.3})O_3$ powders were prepared by the sol-gel method and PZT heterolayered thick films were fabricated by the screen-printing method. The structural properties as a faction of the composition ration were studied. As a result of the differential thermal analysis (DTA), exothermic peak was observed at around $864^{\circ}C$ dne to the formation of the polycrystalline perovskite phase. The PZT heterolayered thick film sintered at $1050^{\circ}C$ for 10min showed the average grain size $1{\sim}1.4{\mu}m$. The average thickness of PZT heterolayered thick films, obained by $3{\sim}6times$ of screen-printing, was approximately $60{\sim}110{\mu}m$.

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프레스 압력 변화에 따른 PZT 후막의 전기적 특성 (The electric properties of PZT thick film by pressure variation)

  • 강정민;조현무;이성갑;이상헌;박상만
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2004년도 추계학술대회 논문집 전기물성,응용부문
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    • pp.177-179
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    • 2004
  • $Pb(Zr_{0.4},Ti_{0.6})O3$, $Pb(Zr_{0.6},Ti_{0.4})O_3$ powder were prepared by the sol-gel method using a solution of Pb-acetate, Zr n-propoxide and Ti iso-propoxide. PZT thick film were fabricated by the screen printing method, and the structural and ferroelectric properties asafunting of the sintering temperature were studied. PZT film thickness, obtained by four screen printing, was approximately $100{\sim}120{\mu}m$. The relative dielectric constant and the dielectric loss of the PZT thick film sintered at $1050^{\circ}C$ were approximately 676 and 1.4%, respectively.

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인쇄전자를 위한 롤투롤 프린팅 공정 장비 기술

  • 김동수;김충환;김명섭
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2009년도 춘계학술발표대회
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    • pp.15.2-15.2
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    • 2009
  • Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology with both low cost and high productivity, can be applied in the production of organic thin film transistor (OTFT), solar cell, radio frequency identification (RFID) tag, printed battery, E-paper, touch screen panel, black matrix for liquid crystal display (LCD), flexible display, and so forth. The emerging technology to manufacture the products in mass production is roll-to-roll printing technology which is a manufacturing method by printings of multi-layered patterns composed of semi-conductive, dielectric and conductive layers. In contrary to the conventional printing machines in which printing precision is about $50~100{\mu}m$, the printing machines for printed electronics should have a precision under $30{\mu}m$. In general, in order to implement printed electronics, narrow width and gap printing, register of multi-layer printing by several printing units, and printing accuracy of under $30{\mu}m$ are all required. We developed the roll-to-roll printing equipment used for printed electronics, which is composed of un-winder, re-winder, tension measurement system, feeding units, dancer systems, guide unit, printing unit, vision system, dryer units, and various auxiliary devices. The equipment is designed based on cantilever type in which all rollers except printing ones have cantilever types, which could give more accurate machine precision as well as convenience for changing rollers and observing the process.

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