• ETRI Journal
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• v.33 no.6
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• pp.880-886
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• 2011

With the introduction of high-current 8-inch solar cells, conventional Schottky bypass diodes, usually adopted in photovoltaic (PV) panels to prevent the hot spot phenomenon, are becoming ineffective as they cause relatively high voltage drops with associated undue power consumption. In this paper, we present the architecture of an active circuit that reduces the aforementioned power dissipation by profitably replacing the bypass diode through a power MOS switch with its embedded driving circuitry. Experimental prototypes were fabricated and tested, showing that the proposed solution allows a reduction of the power dissipation by more than 70% compared to conventional Schottky diodes. The whole circuit does not require a dedicated DC power and is fully compatible with standard CMOS technologies. This enables its integration, even directly on the panel, thereby opening new scenarios for next generation PV systems.

• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.92-94
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• 2004

In this investigation, 3C-SiC film deposited $1000{\AA}$ on the p-type silicon wafer which is resistance $0{\sim}30[{\Omega}{\cdot}cm]$ by PECVD (Plasma-enhanced Chemical Vapor Deposition). We deposited Cr, Ta, Pt in front of wafer to utilize DC-sputter for $500{\AA}$, the SiC Schottky diode made from Al ohmic contact about $4000{\AA}$, and to each different temperature which annealing in Ar atmosphere, we had forward characteristic analysis along to annealing temperature.

• Journal of information and communication convergence engineering
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• v.4 no.3
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• pp.105-107
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• 2006

Amorphous silicon is a kind of optical to electric conversion material with current or voltage type after generating a numerous free electron and hole when it is injected by light. It is very effective technology to make schottky diode by bonding thin film to use optical diode. In this paper, we have fabricated optical diode device by forming chrome silicide film through thermal processing with thin film($100{\AA}$) having optimal amorphous silicon. The optimal condition is that we make a thin film by using PECVD(Plasma Enhanced Chemical Vapor Deposition) to improve reliability and characteristics of optical diode. We have obtained high quality diode by using chrome silicide optical diode from dark current and optical current measurement compared to previous method. It makes a simple process and improves a good reliability.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.8
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• pp.814-819
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• 2008

In this paper, a design of broadband detectors utilizing two ultra-wideband transitions is described for the first time, and the implementation method and measurement results of the detectors are provided. Two ultra-wideband transitions are used for input/output matching circuits for the diode detectors. Two detectors have been implemented using general Schottky diodes and zero-bias Schottky diodes. With general Schottky diodes, the fabricated detector provides less than 10 dB return loss from 11 GHz to 20 GHz, and the detector sensitivity is 30 mV/mW. The detector with zero-bias Schottky diodes shows significantly higher detection sensitivity(300 mV/mW).

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.90-92
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• 2001

Carbon monoxide-sensing behavior of Pt-SiC Schottky diodes. fabricated on the same SiC substrate have been systematically compared and analyzed as a function of carbon monoxide concentrati on and temperature by I-V and ${\Delta}I$-t methods under steady-state and transient condition. Adsorption activation energies of Carbon monoxide on the surface of Pt-SiC Schottky diodes is investigated in a high temperature range ($100{\sim}500^{\circ}C$). The optimal temperature for behavior sensing is $300^{\circ}C$ and saturation concentration is 200 ppm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.533-538
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• 2001

The barrier height is found to increase from 0.25 to 0.690 eV for Schottky contacts on n-InGaAs using deposition of Ag on a substrate cooled to 77K(LT). Surface analysis leads to an interface model for the LT diode in which there are oxide compounds of In:O and As:O between the metal and semiconductor, leading to behavior as a metal-insulator-semiconductor diode. The metal film deposited t LT has a finer and more uniform structure, as revealed by scanning electron microscopy and in situ metal layer resistance measurement. This increased uniformity is an additional reason for the barrier height improvement. In contrast, the diodes formed at room temperature exhibit poorer performance due to an unpassivated surface and non-uniform metal coverage on a microscopic level.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1733-1736
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• 2008

ZnO thin films with preferred orientation along the (0 0 2) plane were fabricated by a sol-gel method. The effects of the annealing temperature, time, and thickness were studied by investigating UV-visible spectra, FT-IR spectra, and XRD of ZnO films. The films were dried and annealed ed at $100^{\circ}C,\;200^{\circ}C$, and $300^{\circ}C$ for 1hr, 2hrs, and 3hrs, respectively. The film showed the preferred (0 0 2) orientation and high transmittance near 90% in the visible range. Also, SEM images of the films exhibited very smooth surfaces without holes and cracks. Schottky diodes were fabricated by using ZnO sol-gel material. Au and Al were used as electrodes to make Ohmic and Schottky contacts, respectively. The annealing temperature, time and the thickness dependent I-V characteristics were presented in this article.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.18-18
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• 2009

최근 다양하게 연구되고 있는 무분극(nonpolar) 갈륨질화물(GaN) 소재는 자발분극(spontaneous polarization) 및 압전분극(piezoelectric polarization) 등이 발생하지 않아 높은 내부양자효율의 확보가 가능하며, 이러한 장점을 바탕으로 고효율 특성을 갖는 발광다이오드(light-emitting diode) 및 고속 전자소자 등으로의 적용을 위한 연구가 활발히 수행 중 이다. 하지만, 무분극 GaN LED의 구현 시, GaN 박막의 비등방성 성장으로 인한 박막의 막질 저하와 함께 표면에 혼재하는 Ga층과 N층에서 기인되는 절연층의 생성으로 인한 오믹전극 형성의 어려움이 대두되고 있다. 따라서, 고효율의 무분극 GaN LED 구현을 위해서는 무분극 GaN층의 질소층 제거를 위한 표면처리 공정과 더불어 금속/무분극 GaN층 간 발생되는 쇼트키 장벽층의 높이(Schottky barrier height)를 제어하는 연구가 선행되어야 한다. 본 논문에서는 무분극 GaN LED 적용을 위한 n-형 전극물질 및 오믹조건 구현을 위한 금속/무분극 GaN층간 SBH의 제어방법에 대한 연구를 수행하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.6
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• pp.7-12
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• 2010

A semi-empirical organic schottky diode model is proposed for circuit simulation. We have set up a full custom design environment for organic schottky diode circuit using Spectre AHDL, which is widely used commercial EDA tool. We measured frequency response from fabricated rectifier, and it was compared to circuit simulation results using the AHDL model. The frequency response of the fabricated rectifier circuit is not sufficient for 13.56MHz RFID, however, it is enough for 135kHz-band RFID.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.7 s.361
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• pp.9-15
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• 2007

In this paper, we present the design of Schottky diodes and voltage multiplier for UHF-band passive RFID applications. The Schottky diodes were fabricated using Titanium (Ti/Al/Ta/Al)-Silicon (n-type) junction in $0.35\;{\mu}m$ CMOS process. The Schottky diode having $4{\times}10{\times}10\;{\mu}m^{2}$ contact area showed a turn-on voltage of about 150 mV for the forward diode current of $20\;{\mu}A$. The breakdown voltage is about -9 V, which provides sufficient peak inverse voltage necessary for the voltage multiplier in the RFID tag chip. The effect of the size of Schottky diode on the turn-on voltage and the input impedance at 900 MHz was investigated using small-signal equivalent model. Also, the effect or qualify factor of the diode on the input voltage to the tag chip is examined, which indicates that high qualify factor Schottky diode is desirable to minimize loss. The fabricated voltage multiplier resulted in a output voltage of more than 1.3 V for the input RF signal of 200mV, which is suitable for long-range RFID applications.