• 제목/요약/키워드: Scanning Electron Microscopy

검색결과 5,016건 처리시간 0.035초

Three-Dimensional Automated Crystal Orientation and Phase Mapping Analysis of Epitaxially Grown Thin Film Interfaces by Using Transmission Electron Microscopy

  • Kim, Chang-Yeon;Lee, Ji-Hyun;Yoo, Seung Jo;Lee, Seok-Hoon;Kim, Jin-Gyu
    • Applied Microscopy
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    • 제45권3호
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    • pp.183-188
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    • 2015
  • Due to the miniaturization of semiconductor devices, their crystal structure on the nanoscale must be analyzed. However, scanning electron microscope-electron backscatter diffraction (EBSD) has a limitation of resolution in nanoscale and high-resolution electron microscopy (HREM) can be used to analyze restrictive local structural information. In this study, three-dimensional (3D) automated crystal orientation and phase mapping using transmission electron microscopy (TEM) (3D TEM-EBSD) was used to identify the crystal structure relationship between an epitaxially grown CdS interfacial layer and a $Cu(In_xGa_{x-1})Se_2$ (CIGS) solar cell layer. The 3D TEM-EBSD technique clearly defined the crystal orientation and phase of the epitaxially grown layers, making it useful for establishing the growth mechanism of functional nano-materials.

열교환 부품용 발열체 형성기술 (The Formation Technique of Thin Film Heaters for Heat Transfer Components)

  • 조남인;김민철
    • 반도체디스플레이기술학회지
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    • 제2권4호
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    • pp.31-35
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    • 2003
  • We present a formation technique of thin film heater for heat transfer components. Thin film structures of Cr-Si have been prepared on top of alumina substrates by magnetron sputtering. More samples of Mo thin films were prepared on silicon oxide and silicon nitride substrates by electron beam evaporation technology. The electrical properties of the thin film structures were measured up to the temperature of $500^{\circ}C$. The thickness of the thin films was ranged to about 1 um, and a post annealing up to $900^{\circ}C$ was carried out to achieve more reliable film structures. In measurements of temperature coefficient of resistance (TCR), chrome-rich films show the metallic properties; whereas silicon-rich films do the semiconductor properties. Optimal composition between Cr and Si was obtained as 1 : 2, and there is 20% change or less of surface resistance from room temperature to $500^{\circ}C$. Scanning electron microscopy (SEM) and Auger electron spectroscopy (AES) were used for the material analysis of the thin films.

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Simple Preparation of One-dimensional Metal Selenide Nanomaterials Using Anodic Aluminum Oxide Template

  • Piao, Yuanzhe
    • Journal of Electrochemical Science and Technology
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    • 제3권1호
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    • pp.35-43
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    • 2012
  • Highly ordered and perforated anodic aluminum oxide membranes were prepared by anodic oxidation and subsequent removal of the barrier layer. By using these homemade anodic aluminum oxide membranes as templates, metal selenide nanowires and nanotubes were synthesized. The structure and composition of these one-dimensional nanomaterials were studied by field emission scanning electron microscopy as well as transmission electron microscopy and energy dispersive X-ray spectroscopy. The growth process of metal selenide inside anodic aluminum oxide channel was traced by investigating the series of samples using scanning electron microscopy after reacting for different times. Straight and dense copper selenide and silver selenide nanowires with a uniform diameter were successfully prepared. In case of nickel selenide, nanotubes were preferentially formed. Phase and crystallinity of the nanostructured materials were also investigated.

Specimen Preparation for Scanning Electron Microscope Using a Converted Sample Stage

  • Kim, Hyelan;Kim, Hyo-Sik;Yu, Seungmin;Bae, Tae-Sung
    • Applied Microscopy
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    • 제45권4호
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    • pp.214-217
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    • 2015
  • This study introduces metal coating as an effective sample preparation method to remove charge-up caused by the shadow effect during field emission scanning electron microscope (FE-SEM) analysis of dynamic structured samples. During a FE-SEM analysis, charge-up occurs when the primary electrons (input electrons) that scan the specimens are not equal to the output electrons (secondary electrons, backscattered electrons, auger electrons, etc.) generated from the specimens. To remove charge-up, a metal layer of Pt, Au or Pd is applied on the surface of the sample. However, in some cases, charge-up still occurs due to the shadow effect. This study developed a coating method that effectively removes charge-up. By creating a converted sample stage capable of simultaneous tilt and rotation, the shadow effect was successfully removed, and image data without charge-up were obtained.

건조기법을 달리한 SEM 시료상의 비교검토 (Comparison of Scanning Electron Microscopic Specimens Dried with Different Methods)

  • 박창현;장병준;조강용
    • Applied Microscopy
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    • 제25권3호
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    • pp.33-39
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    • 1995
  • To compare the quality of ultrastructural preservation of Scanning Electron Microscopic specimens dried with different methods; pure air-drying, air-drying with using Tetramethylsilane(TMS), four kind of air-drying using Hexamethyldisilazane(HMDS) and critical point drying(CPD), we conducted scanning electron microscopic observation on liver, skeletal muscle and intestinal tissues from laboratory rat treated with each method. In pure air drying group, severe distortion of tissue surface was observed, and in HMDS treated group, only liver tissue showed slight distortion. But in TMS treated group, each tissue showed a good presentation comparable to CPD group. The results suggest that the method of air-drying using TMS may be the former is less expensive and simple be and also time-saving.

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Image Noise Reduction Using Structural Mode Shaping for Scanning Electron Microscopy

  • Hamochi, Mitsuru;Wakui, Shinji
    • International Journal of Precision Engineering and Manufacturing
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    • 제9권2호
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    • pp.28-33
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    • 2008
  • In a scanning electron microscope (SEM), outside acoustic noise causes image noise that distorts observations of the specimen being examined. A SEM that is less sensitive to acoustic noise is highly desirable. This paper investigates the image noise problem by addressing the mode shapes of the base plate and the transmission path of the acoustic noise and vibration. By arranging the position of the rib, a new SEM base plate was developed that had twisting as the 1st and 2nd modes. In those two twisting modes, vibration nodes existed near the center of the base plate where the specimen chamber is placed. Less vibration was transmitted to the chamber and to the specimen by the twisting modes compared to bending ones, which are the 2nd and 3rd modes for a rectangular plain base plate. An SEM with the developed base plate installed exhibited a significant reduction of image noise when exposed to acoustic noises below 250 Hz.

Stem cell behaviors on periodic arrays of nanopillars analyzed by high-resolution scanning electron microscope images

  • Jihun Kang;Eun-Hye Kang;Young-Shik Yun;Seungmuk Ji;In-Sik Yun;Jong-Souk Yeo
    • Applied Microscopy
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    • 제50권
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    • pp.26.1-26.3
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    • 2020
  • The biocompatible polyurethane acrylate (PUA) nanopillars were fabricated by soft lithography using three different sizes of nanobeads (350, 500, and 1000 nm), and the human adipose-derived stem cells (hASCs) were cultured on the nanopillars. The hASCs and their various behaviors, such as cytoplasmic projections, migration, and morphology, were observed by high resolution images using a scanning electron microscope (SEM). With the accurate analysis by SEM for the controlled sizes of nanopillars, the deflections are observed at pillars fabricated with 350- and 500- nm nanobeads. These high-resolution images could offer crucial information to elucidate the complicated correlations between nanopillars and the cells, such as morphology and cytoplasmic projections.

Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy

  • Bae, Jee-Hwan;Shin, Keesam;Lee, Joon-Hwan;Kim, Mi-Yang;Yang, Cheol-Woong
    • Applied Microscopy
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    • 제45권2호
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    • pp.89-94
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    • 2015
  • This article briefly reviews the results of recently reported research on high-temperature Pb-free solder alloys and the research trend for characterization of the interfacial reaction layer. To improve the product reliability of high-temperature Pb-free solder alloys, thorough research is necessary not only to enhance the alloy properties but also to characterize and understand the interfacial reaction occurring during and after the bonding process. Transmission electron microscopy analysis is expected to play an important role in the development of high-temperature solders by providing accurate and reliable data with a high spatial resolution and facilitating understanding of the interfacial reaction at the solder joint.