• 한국분말재료학회지
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• 제18권5호
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• pp.449-455
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• 2011

In this study, p-type $(AgSbTe_2)_{15}(GeTe)_{85}$: TAGS-85 compound powders were prepared by gas atomization process, and then their microstructures and mechanical properties were investigated. The fabricated powders were of spherical shape, had clean surface, and illustrated fine microstructure and homogeneous $AgSbTe_2$ + GeTe solid solution. Powder X-ray diffraction results revealed that the crystal structure of the TAGS-85 sample was single rhombohedral GeTe phase, which with a space group $R_{3m}$. The grain size of the powder particles increased while the micro Vickers hardness decreased with increasing annealing temperature within the range of 573 K and 723 K due to grain growth and loss of Te. In addition, the crystal structure of the powder went through a phase transformation from rhombohedral ($R_{3m}$) at low-temperature to cubic ($F_{m-3m}$) at high-temperature with increasing annealing temperature. The micro Vickers hardness of the as-atomized powder was around 165 Hv, while it decreased gradually to 130 Hv after annealing at 673K, which is still higher than most other fabrication processes.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1997년도 한국재료학회 춘계학술발표회
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• pp.66-66
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• 1997

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.138-139
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• 2006

Metal organic chemical vapor deposition has been investigated for growth of $Sb_{2-x}Bi_xTe_3$ films on (001) GaAs substrates using diisopropyltelluride, triethylantimony and trimethylbismuth as metal organic sources. The thermoelectric properties were measured at room temperature and include Seebeck coefficient, electrical conductivity and Hall effect. In-plane carrier concentration and electrical Hall mobility were highly dependent on precursor's composition ratio and deposition temperature. The thermoelectric Power factor($={\alpha}^2{\sigma}$) was calculated from theses properties. The best Power factor was $2.6\;{\times}\;10^{-3}W/mK^2$, given by grown $Sb_{1.6}Bi_{0.4}Te_3$ at $450^{\circ}C$. These materials could potentially be incorporated into advanced thermoelectric unicouples for a variety of power generation applications.

• 한국진공학회지
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• 제6권1호
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• pp.69-76
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• 1997

순간 증착법으로 $Bi_{0.5}Sb_{1.5}Te_3$(p형)와 $Bi_2Te_{2.4} Se_{0.6}$(n형) 박막을 제조하여 두께와 어닐 링 조건에 따른 Seebeck 계수, 전기전도도, carrier 농도 및 이동도, 열전도도, 성능지수의 변화 등 열-전기적 특성을 조사하였다. 473K에서, 1시간 진공 열처리한 결과 p형과 n형의 성능지구는 각각 $1.3{\times}10^{-3}K^{-1}$ 및 $0.3{\times}10^{-3}K^{-1}$으로 향상되었으며 두께에 크게 의존하지 않았 다. 이런 성질을 갖는 열전 박막을 소자화한 박막 온도 센서를 유리와 Teflon기판 위에 제 조하였으며, 이들의 온도 변화에 대한 열기전력, 민감도 및 시간 상수 등 센서 특성을 측정 하였다. p 및 n형의 leg 폭 1mm$\times$길이 16mm인 박막 온도 센서의 경우, Teflon 기판일 때 좋은 성능을 나타내었으며, 민감도는 2.91V/W, 시간 상수는 28.2초이었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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• pp.9-14
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• 1996

The dependence of microstructural and optical properties of Ag-In-Sb-Te thin films on annealing heat-treatments was studied. It was found from the present work that the increase of reflectance after annealing heat-treatment is related with phase change of Ag-In-Sb-Te thin film from amorphous state to crystalline phases which involve Sb crystalline phase and AgInTe$_2$ stoichiometric phase. On the other hand, the reflectance is decreased after high temperature annealing (above 450$^{\circ}C$), due to the morphology .mange of film surface. For the purpose of practical application(erasable optical disk), we fabricated quadrilayered Ag-In-Sb-Te alloy disk, and annealed it with continuous laser beam. As result of this laser\ulcorner annealing treatment, we found that the increment of reflectance is 9.3% at 780nm wavelength. It might be considered that Ag-In-Sb-Te alloy optical disk is the big promising candidate for the erasable optical memory medium.

• 한국분말재료학회지
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• 제23권2호
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• pp.120-125
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• 2016

P-type ternary $Bi_{0.5}Sb_{1.5}Te_3$ alloys are fabricated via mechanical alloying (MA) and spark plasma sintering (SPS). Different ball sizes are used in the MA process, and their effect on the microstructure; hardness, and thermoelectric properties of the p-type BiSbTe alloys are investigated. The phases of milled powders and bulks are identified using an X-ray diffraction technique. The morphology of milled powders and fracture surface of compacted samples are examined using scanning electron microscopy. The morphology, phase, and grain structures of the samples are not altered by the use of different ball sizes in the MA process. Measurements of the thermoelectric (TE) transport properties including the electrical conductivity, Seebeck coefficient, and power factor are measured at temperatures of 300-400 K for samples treated by SPS. The TE properties do not depend on the ball size used in the MA process.

• 한국결정성장학회지
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• 제25권4호
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• pp.135-139
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• 2015

단결정 ingot 성장기술 중 하나인 traveling heater method(THM) 기술을 이용하여 n형 열전소재인 $Bi_2Te_3-Bi_2Se_3$ 고용체화합물을 성장하였다. 고용체 화합물내 $CdCl_2$와 $SbI_3$을 첨가하여 dopant의 영향을 확인하였고 각각의 dopant의 최적의 첨가량[$CdCl_2$ 0.1 wt%(Z: $2.73{\times}10^{-3}/K$), $SbI_3$ 0.05 wt%(Z: $2.29{\times}10^{-3}/K$)]을 확인하였다. THM 기술을 통해 성장된 ingot의 각 부위별 열전특성을 확인해 본 결과 주요 인자들의 표준편차가 낮은 매우 균질화된 특성을 보였다. 또한 $Bi_2Te_3-Bi_2Se_3$ 고용체화합물의 비등방성 지수와 dopant와의 관계를 확인하기 위하여 $90(Bi_2Te_3)10(Bi_2Se_3)$ 조성의 고용체화합물에 donor dopant로서 $CdCl_2$(0.05~0.1 wt%)을 첨가하여 dopant의 증가에 따른 비등방성 지수의 변화를 확인해본 결과 dopant가 증가함에 따라 비등방성 지수가 변하는 것을 확인하였고 이러한 비등방성 지수의 변화가 실제 열전성능에 크게 영향을 미치는 것을 확인하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2005년도 춘계학술발표대회 및 제8회 신소재 심포지엄 논문개요집
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• pp.35-35
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• 2005

• 한국재료학회지
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• 제6권7호
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• pp.678-683
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• 1996

In the fabrication processes of thin film thermoelectrics, a subsequent annealing treatment is inevitable to reduce the defects and residual stresses introduced during the film growth, and to make the uniform carrier concentration of the film. However, the diffusion-induced atomic redistribution and the broadening of p/n junction region are expected to affect the thermoelectric properties of thin film modules. The present study intends to investigate the diffusion at the p/n junctions of thermoelectric thin films and to relate it to the property changes. The film junctions of p-type(Bi0.5Sb1.5Te3)and n-type(Bi2Te2.4Se0.6)were prepared by the flash evaporation method. Aluminum thin layer was employed as a diffusion barrier between p-and n-type films of the junction. This was found to be an effective barrier by showing a negligible diffusion into both type films. After annealing treatment, the thermoelectric properties of p/n couples with aluminum barrier layer were accordingly retained their properties without any deterioration.

• 한국재료학회지
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• 제22권6호
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• pp.280-284
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• 2012

Bismuth antimony telluride (BiSbTe) thermoelectric materials were successfully prepared by a spark plasma sintering process. Crystalline BiSbTe ingots were crushed into small pieces and then attrition milled into fine powders of about 300 nm ~ 2${\mu}m$ size under argon gas. Spark plasma sintering was applied on the BiSbTe powders at 240, 320, and $380^{\circ}C$, respectively, under a pressure of 40 MPa in vacuum. The heating rate was $50^{\circ}C$/min and the holding time at the sintering temperature was 10 min. At all sintering temperatures, high density bulk BiSbTe was successfully obtained. The XRD patterns verify that all samples were well matched with the $Bi_{0.5}Sb_{1.5}Te_{3}$. Seebeck coefficient (S), electric conductivity (${\sigma}$) and thermal conductivity (k) were evaluated in a temperature range of $25{\sim}300^{\circ}C$. The thermoelectric properties of BiSbTe were evaluated by the thermoelectric figure of merit, ZT (ZT = $S^2{\sigma}T$/k). The grain size and electric conductivity of sintered BiSbTe increased as the sintering temperature increased but the thermal conductivity was similar at all sintering temperatures. Grain growth reduced the carrier concentration, because grain growth reduced the grain boundaries, which serve as acceptors. Meanwhile, the carrier mobility was greatly increased and the electric conductivity was also improved. Consequentially, the grains grew with increasing sintering temperature and the figure of merit was improved.