• Plant Disease and Agriculture
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• v.1 no.1
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• pp.14-18
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• 1995

This study was carried out to investigate effect of transplanting method, environmental factor, and fertilizing level on occurrence of Pseudomonas glumae in south-west coastal area of Chonnam province. Occurrence in filed began after heading and increased gradually during 3-4 weeks. Occurrence of this disease was great at daily minimum temperature of 23-$25^{\circ}C$ and series of rainfall during early and mid. August Degree of infection by fertilization of nitrogen and by transplanting fertilizing level of 50% than standard fertilization of nitrogen and by transplanting method was greater machine-transplanting than hand-transplanting. Rate of degradation was 6.5% in case of 10% of infected panicle, 14.5% in 30%, 22% in 50% and 35.9% in 70%. We can reduce occurrence of this disease by sawing non -infected seed and balanced fertilizing in cultural practice and applying oryza 4kg/a in early transplanting or Kasugamin EC and Allta in heading stage.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.2
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• pp.228-236
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• 2002

In this study, the carbon steels, SM20C were machined with the tungsten carbide tipped circular saw to clarify the cutting-off characteristics in terms of tool wear. The results show that an improved performance in view of both the tool wear and the cutting efficiency was obtained by using oil base cutting fluid at the cutting speed of 100m/min with the feed of 0.06mm/tooth. The rake angle of 10$^{\circ}$ , clearance angle of 8$^{\circ}$ , nose radius of R0.1mm, and end cutting edge champer of 0.1mm$\times$25$^{\circ}$ are believed as the best tool geometries. The tool wear decreases due to using the saw of the disk of STS5 and the tool material of P30.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.3
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• pp.47-57
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• 2000

In this study, PC-based dicing machine and driving software were constructed for the purpose of automation of wafer cutting process. To automate the machine, hard automation including vision, loading, and software were considered in the development. Auto loading device and vision system were adopted for the increase of productivity, GUI software programmed for the expedient operation. The dicing machine is operated by the control algorithm and some parameters. It is verified that this kind of PC based automation has a great potential compared with the conventional dicing machine when applied to manufacturing some kinds of wafers as a test purpose.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.23 no.3
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• pp.119-123
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• 2013

Most of the world's solar cells in photovoltaic industry are currently fabricated using crystalline silicon. Czochralski-grown silicon crystals are more expensive than multicrystalline silicon crystals. The future of solar-grade Czochralski-grown silicon crystals crucially depends on whether it is usable for the mass-production of high-efficiency solar cells or not. It is generally believed that the main obstacle for making solar-grade Czochralski-grown silicon crystals a perfect high-efficiency solar cell material is presently light-induced degradation problem. In this work, the substitution of boron with gallium in p-type silicon single crystal is studied as an alternative to reduce the extent of lifetime degradation. The diamond-wire sawing technology is employed to slice the silicon ingot. In this paper, the quality of the diamond wire-sawn gallium-doped silicon wafers is studied from the chemical, electrical and structural points of view. It is found that the characteristic of gallium-doped silicon wafers including texturing behavior and surface metallic impurities are same as that of conventional boron-doped Czochralski crystals.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.101-106
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• 2001

In order to establish the optimum process parameters and diamond saw blade composition for machining natural stone, the chip formation process and the wear process must be understood. Diamond saw blade is one of the most effective, versatile, and extensively used methods of processing rock and other hard materials, such as granite, marble, concrete and asphalt. For many years, it has been known that chip thickness is one of the most significant in the understanding of the sawing process, and other variables such as force and power have been correlated with it. In this study, mathematical relations of a material chipped by a single grit of the saw blade will be undertaken. The material chipping geometries have been mathematically defined and derived as maximum chip thickness.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.5
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• pp.463-470
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• 2015

Solar cell is typical representative of renewable green energy. Silicon wafer contributes about 66 percent to its cost structure. In its manufacturing, micro-cracks are often occurred due to manufacturing process such as wire sawing, grinding and cleaning. Their detection and classification are important to process feedback information. In this paper, a classification method of micro-cracks is proposed, based on the fusion of principal component analysis(PCA) and neural network. The proposed method shows that it gives higher results than single application of two methods, in terms of shape and size classification of micro-cracks.

• Laser Solutions
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• v.11 no.1
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• pp.19-24
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• 2008

It has been recognized that laser dicing of wafers results in low mechanical strength compared to the conventional sawing techniques. Thermal shock generated by rapid thermal loading is responsible for this problem. This work presents a two-dimensional ultra-short thermo elastic model for numerical simulation of femtosecond laser ablation of metals in the high-fluence regime where the phase explosion is dominant. Laser-induced thermoelastic stress is analyzed for Ni. The results show that the laser-induced thermal shock is large enough to induce mechanical damages.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.67-71
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• 2003

Sawing silicon ingot with abrasive slurry generates sludge that includes abrasive powders, cutting oil, and silicon powders. The abrasive powders and cutting oil are being separated and reused. Mixing the remained stodged silicon powders with carbon powders and subsequent heat-treatment are conducted to produce silicon carbide. The size of SiC whiskers and powders was smaller than the conventionally grown silicon carbide whiskers that were synthesized by adding micron-size metal impurities. Impurity related mechanism is attributed to the formation of the silicon carbide whiskers, as metal impurities are contained in the stodged silicon powders.

• Journal of environmental and Sanitary engineering
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• v.21 no.2 s.60
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• pp.1-10
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• 2006

Codonopsis pilosula and Adenophora triphylla were cultivated by sawing seeds, but the germination rate were low. To cultivate these two wild plants was very difficult. The marketable roots of the plants had low quality. The plant pathogens were very difficulty to prevent the diseases (Rhizoctonia, Pythium, Fusarium, Erwinia, Botrytis, Phythophthora) appeared in cultural state. For the extermination of the disease needs a lot of agricultural chemicals, the effect of remain behind an insecticides was high of a hazardous rate after harvest. On this studies, for the safe prevention of the diseases and the promote of seeds germination, we used Bacillus subtilis, B. liquefaciens, Paenibacillus polymixa, Pseudomonas putida separated in our research, these results would bring us harmless products of medicinal herbs for human.

• Proceedings of the Korea Concrete Institute Conference
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• 2003.05a
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• pp.293-298
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• 2003

In this study, tensile adhesive strength(TAS) test was carreid out for evaluated the effects of temperature conditions(-20, -10, 5, 20, 30, $40^{\circ}C$) on the tensile adhesive characteristics about six waterproofing membranes which were commercially used in bridge decks. And, failure appeariences of waterproofing systems in each temperature were investigated and observed the sawing surfaces of waterproofing systems for whether or not damaged of waterproofing membranes. TAS test results were increased when test temperature was decrease in all waterproofing membrane. The type of failure was ductile in $30^{\circ}C$ and $40^{\circ}C$, but brittle failure below $20^{\circ}C$. This results were shown that if temperature above $30^{\circ}C$ is continued for a long time, waterproofing material will be damaged by softening and a part of membranes were damaged by hot aggregate in SMA. So we will consider the type of asphalt for choice of the waterproofing membranes.