• 한국세라믹학회지
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• 제27권6호
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• pp.783-789
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• 1990

Shaped crystal growth apparatus were made for sapphire ribbon single crystal growth. Sapphire ribbon single crystal are grown by EFG(Edge-defined Film-fed Growth) methdo for use as watch-glass and SOS(Silicon-On-Sapphire) devices. Sapphire ribbon crystals were grown to be 40min wide, 1.8mm thick, 96mm long. Therelationshiops between growth striation and surface roughness, with various growth rates, were investigated and compared. It was found that sapphire ribbon crystal is suitable for watch-glass by measuring the transmittance in the visible light region.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.1036-1038
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• 2001

The sapphire orientation dependence of the crystallization of ZnO thin films has been studied using real-time synchrotron x-ray scattering. The amorphous ZnO thin films with a 2400-${\AA}$-thick were grown on sapphire(110) and sapphire(001) substrates by radio frequency magnetron sputtering at room temperature. The amorphous ZnO films were crystallization into epitaxial ZnO(002) grains both on the sapphire(110) and on the sapphire(001) substrates. The epitaxial quality, such as mosaic distribution and crystal domain size, of the ZnO grains on the sapphire(110) is high, similar to that of the ZnO grains on the sapphire(001). With increasing the annealing temperature to 600$^{\circ}C$, the mosaic distribution and the crystal domain size of ZnO(002) grains in the film normal direction was improved and decreased, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.102-102
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• 2008

Sapphire (${\alpha}-Al_2O_3$) has been used as the substrate of opto-electronic device because of characteristics of thermal stability, comparatively low cost, large diameter, optical transparency and chemical compatibility. However, there is difficulty in the etching and patterning due to the physical stability of sapphire and the selectivity with sapphire and mask materials [1,2]. Therefore, sapphire has been studied on the various fields and need to be studied, continuously. In this study, the etching properties of sapphire substrate were investigated with various $CH_4$/Ar gas combination, radio frequency (RF) power, DC-bias voltage and process pressure. The characteristics of the plasma were estimated for mechanism using optical emission spectroscopy (OES). The chemical compounds on the surface of sapphire substrate were investigated using energy dispersive X-ray (EDX). The chemical reaction on the surface of the etched sapphire substrate was observed by X-ray photoelectron spectroscopy (XPS). Scanning electron microscopy (SEM) was used to investigate the vertical and slope profiles.

• 한국정밀공학회지
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• 제21권2호
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• pp.218-223
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• 2004

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by Micro-lapping process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of crystalline sapphire wafer at surface has a full width at half maximum of 250 arcsec. This value at the surface sapphire wafer surfaces indicated 0.12${mu}m$ sizes. Surfaces of sapphire wafers were mechanically affected by residual stress and surface default. As a result, the value of surface roughness of sapphire wafers measured by AFM(Atom Force Microscope) was 2.1nm.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.82-85
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• 2003

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by Micro-lapping process. The sapphire crystalline wafers were characterized by DCXD(Double Crystal X-ray Diffraction). The sample quality of crystalline sapphire wafer at surface has a FWHM(Full Width at Half Maximum) of 250 arcsec. This value at the sapphire wafer surfaces indicated 0.12${\mu}{\textrm}{m}$ sizes. Surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Also Surfaces roughness of sapphire wafers were measured 2.1 by AFM(Atom Force Microscope).

• 한국광학회지
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• 제19권5호
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• pp.381-385
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• 2008

InGaN/Sapphire LED에서 기판 제거와 패키지 방식이 광출력 특성에 미치는 영향을 분석하였다. Sapphire 기판의 제거는 반도체 접합에서 발생된 열의 방출에 도움이 되지만, 반대로 광추출효율이 손상되는 문제점이 수반된다. Sapphire 기판이 제거된 칩을 열전도율이 좋은 금속의 마운트 위에 부착하면, 최대 구동전류는 현저히 증가하고 광출력도 상당히 증가됨으로써, 광추출효율이 손상되는 문제점이 어느 정도 보상된다. 하지만, sapphire 기판이 제거된 칩을 상대적으로 열전도율이 낮은 유전체의 마운트 위에 부착하는 경우에는, 거의 모든 입력전류 범위에서 sapphire 기판이 남아 있는 일반형 칩보다 낮은 광출력을 나타낸다. 따라서, 작은 광출력이 요구되는 응용분야에서는 사용된 칩 마운트의 종류에 무관하게, 일반형 칩이 sapphire 기판이 제거된 칩 보다 유리한 것으로 분석된다.

• 한국결정성장학회지
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• 제19권3호
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• pp.152-158
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• 2009

산업용 뿐만 아니라 보석용으로 가치가 있는 사파이어는 매우 다양한 방법으로 합성 사파이어를 만들어 왔다. 그 중 천연 사파이어와 매우 유사하며 보석용으로 가치가 높은 Chatham사의 플럭스 사파이어를 사용하여 천연 사파이어와 비교하였다. 먼저 WD-XRF(Wavelength dispersive x-ray fluorescence spectrometer)를 사용하여 천연과 합성의 화학 조성을 비교하였다. 천연 사파이어는 화학 조성이 매우 다양하였으나 플럭스 사파이어는 천연과 유사한 화학 성분과 특히 Mo, Pt, Pb 미량원소가 검출되었다. Pt는 플럭스 사파이어라는 결정적인 증거가 된다. 다음으로 $1300^{\circ}C$와 $1500^{\circ}C$의 고온에서 열처리를 한 후 자외선-가시광선 분광광도계(UV-VIS Spectrophotometer)를 사용하여 분광학적 특성을 조사함으로써 천연 사파이어는 $Cr^{3+}$와 관련된 약 690nm의 형광과 관련된 흡수 피크의 변화를 관찰할 수 있었고 플럭스 사파이어는 $Cr^{3+}$와 관련된 약 690nm의 피크와 376nm, 388nm의 $Fe^{3+}$의 흡수 피크가 변화함을 볼 수 있었다. 고온 열처리에 의해 플럭스 사파이어의 흡수 피크의 변화가 천연 사파이어의 흡수 피크의 변화보다 더 큰 것을 알 수 있었다 화학조성 및 분광분석 실험을 통하여 천연 사파이어와 flux 합성 사파이어의 특성을 비교 분석하였다.

• 한국레이저가공학회지
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• 제12권1호
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• pp.7-13
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• 2009

Engineering ceramics as sapphire are widely used in industry owing to their superior mechanical and corrosion properties. However, micromachining of sapphire is a considerable challenge due to its transparency. Recently, direct ablation of sapphire has been demonstrated with a visible laser pulse at sufficiently high laser intensity. In this work, the theoretical model for pulsed laser ablation of sapphire is suggested and numerical analysis is carried out using the model. Sapphire ablation begins with plasma generation by the laser interaction with surface defects, impurities and contaminations in the initial stage of machining. Subsequent absorption of the visible laser beam can be explained by three mechanisms: metalization of sapphire surface due to the EUV radiation from the hot plasma, increments of surface roughness and temperature-dependent absorption coefficient. Comparison of the computation results with experimental observation indicates that the proposed model of sapphire is reasonable.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.170-170
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• 2003

We have implanted on sapphire substrate with various ions and investigated the properties of GaN epilayers grown on implanted sapphire substrate by metal organic chemical vapor deposition (MOCVD). Sapphire is typical substrate for GaN epilayers. However, there are many problems such as lattice mismatch and thermal coefficient difference between sapphire substrate and GaN. The ion implanted substrate's surface had decreased internal tree energies during the growth of the GaN epilayer, md the misfit strain was relieved through the formation of an AlN phase on the ions implanted sapphire(0001) substrates. [1] The crystal and optical properties of GaN epilayer grown in ions implanted sapphire(0001) substrate were improved.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 기술교육전문연구회
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• pp.31-34
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• 2003

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing(CMP) process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum 89 arcses. The surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Sapphire wafers's waveness has higher abrasion rate in the edge of the wafer than its center due to Newton's Ring interference.