• Electrical & Electronic Materials
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• v.12 no.7
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• pp.12-18
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• 1999

• Solar Energy
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• v.17 no.1
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• pp.59-66
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• 1997

The solar cell electrical output parameters such as the open circuit voltage($V_{oc}$) and short circuit current density($V_{sc}$) are intrinsic characteristics depending on junction depth, doping concentration, metal contacts barriers and cell structure. As a role of thumb for solar cell design, the metal contact barriers for phosphorus doped emitter should have lower work function in order to provide lower series resistance. The fabrication of PESC(passivated emitter solar cell) structure usually involves the use of titanium as a metal contact barrier. Chromium, which work function is similar to titanium but conductance is higher than titanium is being investigated as the new metal contact barrier. Although titanium has lower work function difference than chromium, the electric performances of chromium as contact barrier are higher than titanium. This better performance is attributed to the lower resistivity from chromium. This paper, therefore, compares the attributes of metal barrier contacts using titanium and chromium.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.66-66
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• 2010

잉크젯용 저온 Cu ink의 소성 특성을 향상 시키기 위해 소성 분위기롤 조절 하였다. 일반적으로 Cu는 산화가 잘되는 물질로 환원 분위기에서 소성이 이루어져야만 하기 때문에 acid, alcohol, aldehyde, ether와 같은 환원제를 소성시 사용하였다. 또한 1종의 환원제가 아닌 2종의 환원제롤 일정 비율로 섞음으로써 환원력를 조절하여 소성 품질을 향상 시킬 수 있었으며, 이러한 환원 분위기 조절을 통하여 300도 이하 저온에서 소성이 가능하였다. 또한 optical microscopy와 field emission scanning electron microscopy를 통해 막 품질과 미세조직의 치밀도를 확인하였고 배선 재료로써의 적용을 위해 resistance를 측정 비교하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.53-53
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• 2010

The development of synthetic pathway to produce a highly yield nanoparticles is an important aspect of industrial technology. Herein, we report a simple, rapid approach to synthesize organic-soluble Cu and Ag nanoparticles in colloidal method for the application in a conductive pattern using inkjet printing. The silver nanoparticles have been synthesized in highly concentrated organic phase. The Cu nanoparticles have been synthesized by the reducing of the copper oxide materials using acid molecules in high concentrated organic phase. Their sintering and electric conductivity properties were investigated by melting process between $200^{\circ}C$ and $250^{\circ}C$ for application to printed electronics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.202-202
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• 2008

The world gross market of many kinds of electronics, such as TV and mobile phone has been increasing rapidly these days. It is mainly caused by the amazing developments of IT technology during past decade and the changes of individual life style for the better. Thanks to the increases of electronics manufactured in quantity, much more electronic components such as MLCC (multi layer ceramic capacitor) and PCB (printed circuit board), which are our main products, have been needed as a consequence. Though it was reported that total market of electronic components exceeds several hundreds of billion dollars, there are many manufactures struggling for survival in the competition of electronics components. Then the recognition of quality as a key technology has spread and the efforts for high-yield production lines have been kept in many companies. In this paper, our efforts to eliminate the contamination of particles and the diffusion of some volatile organic compounds which is very harmful to workers at production line have been introduced.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.251-254
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• 2005

A new driving waveform was proposed to reduce the cost in PDP-TV based on Vt close curve by eliminating the common (X) board under the conventional 42-inch panel structure. Due to the serious misfiring problem during a sustain-period when applying the new driving waveform, the wall voltage was measured and analyzed after the reset-period using Vt close curve. As a result of adopting the proposed driving waveform designed using Vt close curve analysis, the cost of PDP module could reduce compared with the conventional PDP module without any misfiring discharge.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.167-168
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• 2007

Design Rule이 작아짐에 따라 Transistor performance 향상을 위한 여러 방안중 SEG 공정이 적용되고 있으며 이에 따른 Transistor 특성 연구 결과이다. SEG공정 적용시 SEG Profile에 따라 Transistor의 Short Channel Effect 열화가 발생하였고 그 원인은 Sidewall Facet발생으로 추정되며 이를 개선시 Tr 특성이 개선됨을 확인하였다.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.557-558
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• 2006

In this paper, the hysteresis characteristics by bias stress in organic thin film transistors using inkjet printing were investigated. Electron trapping increased threshold voltage for positive gate bias stress and hole trapping decreased threshold voltage for negative gate bias stress. From these phenomena, highly reproducible measurement method which minimized threshold voltage shift by choosing the proper range of gate voltage was suggested. Using this measurement method, we found that electron trapping as well as hole trapping had important influence on hysteresis characteristics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.364-364
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• 2010

In the electricity control field, a relay is the most widely used electrical switch. But it has problems about a material transfer phenomenon, contact bounce, and the mechanical life. These Problems cause the serious problem in a facility. So, we tried to solve these problems by applying MOSFET electronic switch and could find good improvement compared to conventional electrical switch.