• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1621-1622
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• 2006

This paper presents the effect of driving waveform for piezoelectric bend mode inkjet printhead with optimized mechanical design. Experimental and theoretical studies on the applied driving waveform versus jetting characteristic s were performed. The inkjet head has been designed to maximize the droplet velocity, minimize voltage response of the actuator and optimize the firing frequency to eject ink droplet. The head design was carried out by using mechanical simulation. The printhead has been fabricated with Si(100) and SOI wafers by MEMS process and silicon direct bonding method. To investigate how performance of the piezoelectric ceramic actuator influences on droplet diameter and droplet velocity, the method of stroboscopy was used. Also we observed the movement characteristics of PZT actuator with LDV(Laser Doppler Vibrometer) system, oscilloscope and dynamic signal analyzer. Missing nozzles caused by bubbles in chamber were monitored by their resonance frequency. Using the water based ink of viscosity of 4.8 cps and surface tension of 0.025N/m, it is possible to eject stable droplets up to 20kHz, 4.4m/s and above 8pL at the different applied driving waveforms.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.20.2-20.2
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• 2010

Recently inkjet printing technology has been developed in the areas of low cost fabrication in environmentally friendly manufacturing processes. Although inkjet printing requires the interdisciplinary researches including development of materials, manufacturing processes and printing equipment and peripherals, manufacturing a printhead is still core of inkjet technology. In this study, a piezoelectric driven DOD (drop on demand) inkjet printhead has been fabricated on three layers of the silicon wafer in MEMS Technology because of its chemical resistance to industrial inks, strong mechanical properties and dimensional accuracy to meet the drop volume uniformity in printed electronics and display industries. The flow passage, filter and nozzles are precisely etched on the layers of the silicon wafers and assembled through silicon fusion bonding without additional adhesives. The piezoelectric is screen-printed on the top the pressure chamber and the nozzle plate surface is treated with non-wetting coating for jetting fluids. Printheads with nozzle number of 16 to 256 have been developed to get the drop volume range from 5 pL to 80 pL in various industrial applications. Currently our printheads are successfully utilized to fabricating color-filters and PI alignment layers in LCD Flat Panel Display and legend marking for PCB in Samsung Electronics.

• Journal of the Korean Ceramic Society
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• v.46 no.2
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• pp.211-218
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• 2009

For the Y5V characteristic MLCC which is very prone to crack, it is important to to find out the basic cause of the crack. After finding out the crack origin, the materials and processes should be developed to remove the crack. The microstructures of the cracks were investigated using the fractographic method for the various types of cracks such as an exterior crack, a cyclic thermal shock crack, and an piezo-electric crack. It was found out that the crack origin was the pore at the end of the Ni inner electrode after bake-out. Even though the three dimensional crack shapes were different, the crack origins were seemed to be similar. The exterior crack could grow from the origin with the aids of residual and applied stress. FEM (finite element method) analysis was used to calculate the stress distribution of residual and applied stress. And the concept of fracture mechanics was applied for the explanation of the crack initiation and propagation from the stresses concentration.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.43-48
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• 2007

This study is focused on the effect of the surface properties for the post electrode, which is used in pad formation consisted of SMT such as IC, passive component, combined with fired LTCC substrate, We carried out the surface microstructure of sintered electrode and the basic reliability evaluations with sample fired by microwave sintering to solve the problems occurred in post electrode by electric sintering. We evaluated surface densification status of post electrode according to various conditions of microwave sintering. In additions, it is obtained strong effect on blister improvement of post electrode because of over-sintering and the insufficient out gas in bum out process. As a result of adhesion strength, we confirmed $44.3N/mm^2$ in microwave sintering and $34.5N/mm^2$ in electric sintering, respectively. This result will be used for the basic reliability test. Finally, microwave sintering seems to be economic in process time with 30 min compared to electric sintering with 10 hr. In terms of Mass production and efficiency, microwave sintering are excepted to be higher than electric sintering.

• Proceedings of the KIEE Conference
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• 1992.07b
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• pp.563-566
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• 1992

Recently, a lot of efforts have been made to satisfy noise and vibration performance requirements of rotating electric precision machines by the use of various numerical techniques. This paper looks into the enfluence of the magnetization pattern and the shape of air gap which play the role of primary variables of the electro-magnetic circuits, and finally, an experimental verification has been performed to illustrate the efficiency and the advantages or the optimal air gap shape minimizing the cogging torque.

• Journal of the Korean Magnetics Society
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• v.18 no.2
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• pp.58-62
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• 2008

$Ni_{0.4}Zn_{0.4}Cu_{0.2}Fe_2O_4$ ferrite was fabricated by solid stat reaction method and sol-gel method. Because of the drawbacks of each method, we combined these two methods together. We proposed and experimentally verified that nanocrystalline ferrite additive was effective on improving the densification behavior and magnetic properties of NiZnCu ferrites for multilayer chip inductors. The initial permeability of the toroidal core Sample with 20 wt% nanocrystalline ferrite increased from 78.1 to 178.2 as annealing temperature is increased from $880^{\circ}C$ to $920^{\circ}C$. The density, shrinkage and saturation magnetization were increased with increasing annealing temperature, which was attributed to the decrease of additive grain size and increase of sintering density.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.156-156
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• 2009

전자기기의 Slim화에 따라 부품 일장용 Board 기판의 두께도 날로 감소해지고 있다. 이와는 정 반대로 기판의 층수는 더 늘어나고 있다. 이에 따라 기판의 구성요소인 절연재의 두께도 감소하고 있다. 전자기기는 각각의 Module이 저항을 가지는데 이를 matching하기 위해서 각 module이나 package가 가지는 저항값을 상호 비슷하게 맞춘다. 하지만, 기판의 절연재의 두께 감소는 이러한 저항값이 낮아지게 한다. 이렇게 낮아진 저항값을 높이기 위해서는 전도체의 폭을 줄여야 한다. 하지만, 이렇게 전도체의 폭을 줄이는 것은 기판 제작 비용의 상승 및 제작 물가에 이르게 할 수 있다. 이를 해결하기 위해서는 절연재의 유전율을 낮추는 것이 가장 효과적이다. 본 연구에서는 PCB 기판의 유전율을 낮추기 위해 Liquid Crystalline Polymer(LCP)에 PTFE powder를 넣어 기판 재료의 가능성을 조사하였다. 유전율은 PTFE의 첨가량이 증가함에 따라 감소하여 40wt% 첨가할 경우 유전율이 2.4 정도로 낮아졌다. 이에 반해 열팽창계수는 증가가 크지 않고 peel strength는 감소함을 알 수 있었다.

• Proceedings of the KIPE Conference
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• 2013.11a
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• pp.17-18
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• 2013

본 논문에서는 자동차의 연료 절감을 위한 ISG(Idle Stop & Go) 시스템용 양방향 DC-DC 컨버터를 개발하였다. ISG 시스템 사양에 따라 효율 및 부피를 고려하여 3상 비절연 하프브리지 컨버터를 제안하였으며 또한 프리스케일사의 5643L MCU를 이용하여 디지털 제어기를 개발하였다. 1.8kW급 시작품을 통해 타당성을 검증하였으며 부피는 3.4L, 승 강압시 정격부하효율은 각각 95.1%, 95.5%이며 최고효율은 96.1%, 96.4%를 달성하였다.

• Proceedings of the KIPE Conference
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• 2008.06a
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• pp.394-396
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• 2008

기존 위상천이 풀 브리지 컨버터의 경우 구조가 간단하고, 모든 스위치의 영전압 스위칭 동작이 가능하기 때문에 고전압/대전력용으로 널리 사용되고 있다. 그러나 위상천이 풀 브리지 컨버터의 경우 환류구간동안 입력 에너지가 출력으로 전달되지 못하고 순환하므로 도통손실이 큰 단점이 있다. 따라서 본 논문에서는 환류구간이 존재하지 않으며, 출력인덕터 전류 리플을 최소화 할 수 있어 대전류 시스템에 매우 적합한 새로운 Double Ended 능동 클램프 풀 브리지 DC/DC 컨버터를 제안한다. 최종적으로 제안된 회로의 정상상태 동작에 관하여 이론적으로 분석하고, Psim 모의실험을 수행하며, 실제로 1.2KW급 서버용 전원장치에 적용하여 타당성을 검증한다.

• Proceedings of the KIPE Conference
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• 2008.06a
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• pp.397-399
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• 2008

본 논문은 대용량에 적합한 새로운 DC/DC 컨버터에 관한 것으로써, PFM-SBC(Series-Boost Capacitor) 풀 브리지 컨버터를 제안한다. 제안된 회로는 스위칭 주파수에 따라 직렬 부스트 캐패시터의 전압을 증감하여 출력전압을 제어하는 방식이며, 50% 고정 시비율로 구동하기 때문에 기존 위상천이 풀 브리지 회로에 존재하는 환류 구간이 발생하지 않는다. 또한 넓은 부하 영역에 대해 영전압-스위칭이 보장되므로 효율 및 발열 특성이 우수하며, 출력 인덕터 전류 리플이 작은 장점이 있다. 본 논문에서는 기존 컨버터들의 특성을 분석하고, 제안된 회로의 이론적 해석 및 PSIM 모의실험을 수행하며, 이를 실제로 1.2KW급 서버용 전원장치 프로토 타입 제작을 통하여 제안된 SBC 풀 브리지 컨버터의 타당성을 검증한다.