• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.493-494
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• 2006

SU-8 can be implemented as a mask for micro Abrasive Jet Machining (micro-AJM) process [1]. In this paper, we will evaluate the quality of micro grooving result on glass substrate by micro-AJM process which using SU-8 as a mask. It was evaluated on width and edge profile of the micro grooving. The result was having distortion compare with the master film used to pattern the SU-8 mask. The value of distortion with other properties which came along with it, such as depth and surface roughness, can be optimized in order to fabricate micro-channel for micro-fluidic application.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.1 s.190
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• pp.71-78
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• 2007

Abrasive jet machining (AJM) has been traditionally used for removing rusts or paints. Nowadays, this is promising technology for micro bulk machining where brittle substrate materials are used. In order to get accurate details, masks such as metal, polymer or elastomer is inevitable. Among them, photo polymer which is sensitive to the light has been attractive for it's high accuracy using photolithography. In this research, SU-8 as a photo polymer is used since it is adequate for making thick mask. So, this paper describes how to make AJM masks using SU-8 with a photolithography process, and investigates the characteristics of SU-8 masks during AJM process. Also, an example of fabrication using AJM was shown.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.503-504
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• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.663-664
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• 2007

• Journal of KIISE:Software and Applications
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• v.27 no.3
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• pp.241-247
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• 2000

In this paper, a fast change detection is proposed for sequence image. The proposed method enhances the quality of the change detection mask and the speed of the change detection by combining block based method and pixel based method. Firstly, change regions are detected for 16 ${\times}$ 16 blocks in image. And 16 ${\times}$ 16 contour block of change detection mask is divided into 4 subblocks. Finally, for divided 8 ${\times}$ 8 blocks, contour blocks are extracted and then, the pixel-based change regions are detected for them. As this makes use of the block based method, this not only enhances the speed of the change detection, but also reduces effects of noise in change detection mask. Experimental results show not only the improvement of the separated change/non-change region, but also the improvement of the speed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.535-536
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1175-1178
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• 2005

Brittle materials, especially single-crystal silicon wafer, are widely used for sensors, IC industry, and MEMS applications. e general machining process of crack easy materials is by chemical agents, but it is hazardous and time consuming. Also, it is difficult to get high aspect ratio micro structure. As an alternative tool, an AJM(Abrasive jet machining) is promising method in terms of high aspect ratio and production cost. In this study, to get more precise detail compared to general AJM, photo polymer mask, SU-8, used in photolithography was applied in AJM. Process parameters such as abrasive diameter, air pressure, nozzle diameter, flow rate of abrasive in AJM and a variety of conditions in spin coating were decided. Finally, micro channel and mixer was fabricated to see the efficiency of the AJM with photo polymer mask.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.1
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• pp.138-144
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• 2008

Micro-machining of a brittle material such as glass, silicon, etc., is important in micro fabrication. Particularly, micro-abrasive jet machining (${\mu}-AJM$) has become a useful technique for micro-machining of such materials. The ${\mu}-AJM$ process is mainly based on the erosion of a mask which protects brittle substrate against high velocity of micro-particle. Therefore, fabrication of an adequate mask is very important. Generally, for the fabrication of a mask in the ${\mu}-AJM$ process, a photomask based on the semi-conductor fabrication process was used. In this research a rapid mask fabrication technology has been developed for the ${\mu}-AJM$. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Two kinds of mask patterns were fabricated using SU-8 and photopolymer (Watershed 11110). Using fabricated mask patterns, abrasive-jet machining of Si wafer were conducted successfully.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.10 s.253
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• pp.1314-1319
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• 2006

This paper describes the novel fabrication method of the high-aspect-ratio nano structure which is impossible by conventional method using a shadow mask and a Deep X-ray Lithography (DXRL). The shadow mask with $1{\mu}m-sized$ apertures is fabricated on the silicon membrane using a conventional UV-lithography. The size of aperture is reduced to 200nm by accumulated low stress silicon nitride using a LPCVD (low pressure chemical vapor deposition) process. The X-ray mask is fabricated by depositing absorber layer (Au, $3{\mu}m$) on the back side of nano shadow mask. The thickness of an absorber layer must deposit dozens micrometers to obtain contrast more than 100 for a conventional DXRL process. The thickness of $3{\mu}m-absorber$ layer can get sufficient contrast using a central beam stop method, blocking high energy X-rays. The nano circle and nano line, 200nm in diameter in width, respectively, were demonstrated 700nm in height with a negative photoresist of SU-8.

• Korean Journal of Materials Research
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• v.8 no.9
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• pp.871-875
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• 1998

High aspect ratio microstructures were fabricated by photolithography. The material for the microstructure was photosensitive glass which has good mechanical and electrical insulation properties. The photosensitive glass was exposed to ultraviolet light at 312nm through a chromium mask in which the structures are drawn. After heat treatment process over $500^{\circ}C$, the photosensitive glass was etched in a 10% hydrofluoric acid solution with ultrasonic conditions. Final dimension of the micro-framework was greatly dependent on the thickness of photosensitive glass, mask pattern, ultraviolet light exposure and etching conditions. The maximum aspect ratio of the micro-framework obtained from this work was over 30.